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| Number | Title | Issue Date |
| 8030418 | Modified hydrocarbylphenol-aldehyde resins for use as tackifiers and rubber compositions containing them The invention relates to a modified hydrocarbylphenol-aldehyde resin prepared by reacting a hydrocarbylphenol-aldehyde resin with a primary or secondary amine and further with an epoxide. The invention also provides a process for preparing a modified, hydrocarbylphe... | 10/04/2011 |
| 7939609 | Redispersing agents for redispersible polymer powders and redispersible polymer powders including same A redispersible polymer powder including: a polymer to be redispersed; and an ortho-cresol based condensation product or salt thereof; wherein the ortho-cresol based condensation product or salt thereof includes N-containing units derived from a N-based component in... | 05/10/2011 |
| 7858713 | Accelerator systems for low-temperature curing Composition comprising as component A) a 1-imidazoly[mothyl-substituted 2-naphthol compound of the general formula (I) where R1, R2 and R3 each independently of one another are H; C1-17alkyl; C3-12cycloalkyl, op... | 12/28/2010 |
| 7538165 | Conductive polyaniline composition, film thereof and processes for producing these The invention provides an electrically conductive polyaniline composition comprising polyaniline which contains at least one of novolac resins selected from the group consisting of phenolsulfonic acid novolac resin and naphtholsulfonic acid novolac resin as a dopant... | 05/26/2009 |
| 7432335 | Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same There are provided a composition for functioning as an effective additive for epoxy resin that is solid at room temperature and has high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carbox... | 10/07/2008 |
| 7378461 | Curable epoxy resin compositions and process for production thereof The invention relates to (1) a curable epoxy resin composition comprising (A) a non-gel type amine-modified epoxy resin which is obtained by reacting an epoxy resin with a polyamine and (B) at least one of boric acid and boric ester, (2) a powder form of the curable... | 05/27/2008 |
| 7345101 | Aqueous composition of reaction product of epoxy and phosphorus materials with curing agent A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially mela... | 03/18/2008 |
| 7312260 | Epoxide adducts and their salts as dispersants The invention relates to addition compounds suitable for use as wetting agents and dispersants and obtainable by reacting monofunctional or polyfunctional aromatic epoxides with polyoxyalkylenemonoamines having a number-average molecular weight of >400 g/mol, one pr... | 12/25/2007 |
| 7276555 | Amide-modified resin or hydrocarbyl moiety for dispersing a pigment A method of dispersing pigment using an amide-modified resin or an amide-modified hydrocarbyl moiety, and the resulting pigment concentrate or coating or ink composition. ... | 10/02/2007 |
| 7244793 | Adhesive compositions Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive composition... | 07/17/2007 |
| 7223820 | Amine hardener for epoxy resins Compounds of formula Ia or Ib wherein A is an (n+1)-valent aliphatic, cycloaliphatic, araliphatic or aromatic radical and n is an integer from 0 to 5, E is an (m+1)-valent aliphatic, cycloaliphatic, ... | 05/29/2007 |
| 7217771 | Epoxy resin Compositions containing: (a) a liquid epoxy resin; (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine; (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C.... | 05/15/2007 |
| 7148308 | One-part moisture-curing urethane composition The present invention provides an one-part moisture-curable urethane composition which exhibits excellent adhesion particularly to a coated steel plate difficult to bond with no-primer and is useful in the bonding of automobile window glass. The urethane composition... | 12/12/2006 |
| 7141303 | Protective articles The invention provides protective articles comprising a backing that comprises a fluorinated polymer and a curable adhesive on at least one layer of the backing. The protective articles of the invention may be used to provide substrates or articles of the invention ... | 11/28/2006 |
| 7138709 | Microelectronic package array This invention relates to an apparatus and method for increasing microelectronic package density by stacking multiple microelectronic packages in an array and controlling package to package scalability without stressing the carrier substrates and without limiting th... | 11/21/2006 |
| 7125914 | Heat-cured furan binder system This invention relates to a heat-cured furan foundry binder system comprising a furan binder and a furan monomer or oligomer containing at least two terminal hydroxymethyl groups. The binders are particularly useful as warm-box binders, because they cure faster and ... | 10/24/2006 |
| 7094845 | Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same There is provided a composition for functioning as an effective additive for an epoxy resin that is a solid at room temperature and has a high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic ... | 08/22/2006 |
| 7091286 | Low-cure powder coatings and methods for using the same Low-cure powder coating compositions are disclosed, comprising at least one epoxy-containing resin and/or at least one siloxane-containing resin, and at least one material having the structure wherein R1 | 08/15/2006 |
| 7087684 | Self-dispersing, hardenable epoxy resins, processes for producing the same and methods of using the same Self-dispersing, hardenable epoxy resins produced by reacting one or more α,β-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, and reacting the thus formed intermediate with one or more polyepoxide compounds, are described. Pr... | 08/08/2006 |
| 7087664 | Resin film and multilayer printed wiring board using thereof A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section o... | 08/08/2006 |
| 7030197 | Aqueous resin composition, aqueous coating material containing the composition, coating provided by the material, and metal plate coated with the material There is provided an aqueous resin composition excellent in settability, flexibility, retort resistance, hygienicity, sprayability and dispersibility in water, and used to coat an internal surface of a can. The aqueous resin composition contains: polyester resin hav... | 04/18/2006 |
| 7022779 | One-pack moisture-curing epoxy resin composition A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition include... | 04/04/2006 |
| 7014699 | Oxalkylation products produced from epoxides and amines and their use in pigment preparations The invention relates to addition compounds of formula (1): in which: n is a number from 1 to 10; R1 and R2 are identical or different and are each a hydrogen atom or a saturated or unsaturated ali... | 03/21/2006 |
| 7012719 | Sign sensitive aperture correction system and method The aperture correction system variably adjusts a correction efficient value based upon a sign and an original relative light intensity value or its equivalent. Because the correction is relative light intensity sensitive, the aperture correction is optimized, and t... | 03/14/2006 |
| 7012120 | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this... | 03/14/2006 |
| 6992151 | Phosphorus-containing flame-retardant hardener, and epoxy resins cured by the same The present invention discloses an active-hydrogen-containing curing agent having a phosphorus group, and a flame retardant cured epoxy resin which can be prepared via an addition reaction between the active hydrogen and the epoxide group of an epoxy resin. The cure... | 01/31/2006 |
| 6977279 | Solvent-free room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings The present invention relates to novel solventless reactive systems curable at room temperature, based on blocked polyisocyanates, primary amines, compounds with oxirane groups, and 2,3-dimethyl-3,4,5,6-tetrahydropyrimidine, and to processes for the preparation of t... | 12/20/2005 |
| 6977274 | Epoxy resin curing system containing latent catalytic curing agent causing the expansion of volume The present invention relates to a novel epoxy resin curing system comprising a cationic latent catalytic curing agent containing a hexafluoroantimonate, characterized by exhibiting no shrinkage of volume or inducing an expansion of volume during the curing reaction... | 12/20/2005 |
| 6962964 | Hydrogenation of methylenedianiline homologs and epoxy resins cured with same This invention relates to improved polyepoxide resins cured with a mixture of methylene bridged poly(cycloaliphatic-aromatic)amines and a process for preparing such polyepoxide resins as well as to the methylene bridged poly(cycloaliphatic-aromatic)amine composition... | 11/08/2005 |
| 6962744 | Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), (wherein —... | 11/08/2005 |
| 6936644 | Releasable microcapsule and adhesive curing system using the same An uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that covers substantially the entire su... | 08/30/2005 |
| 6936676 | One-part, room temperature moisture curable resin composition This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at α position and a polyamine having at least two amino groups within its molecule wherein α posit... | 08/30/2005 |
| 6911292 | Positive resist composition and patterning process A positive resist composition contains a novolak resin in which 3-27 mol % of the hydroxyl group hydrogens are substituted with 1,2-naphthoquinonediazidosulfonyl ester groups, a methyl vinyl ether-monoalkyl maleate copolymer and optionally, an alkali-soluble cellulo... | 06/28/2005 |
| 6905809 | Photoresist compositions The present invention relates to a composition and a process for preparing a composition that comprises: 1) a film-forming novolak resin wherein the hydrogen atom of a hydroxyl group in the novolak resin is substituted with a naphthoquinonediazidosulfonyl (DNQ) grou... | 06/14/2005 |
| 6906120 | Poly(arylene ether) adhesive compositions An adhesive for thermoplastic film is formed from a composition comprising a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, an optional plasticizer, and a cure agent. The adhesive finds particular utility in circuit board applications. | 06/14/2005 |
| 6875807 | Silane-modified phenolic resins and applications thereof A silane-modified phenolic resin is prepared by reacting a phenolic compound (e.g., resorcinol) with an aldehyde to produce a phenolic novolak resin. The phenolic novolak resin is further reacted with at least one silane compound to produce the silane-modified pheno... | 04/05/2005 |
| 6828391 | Plastified novolaks as additive to rubber mixtures Use, as modifier resin for rubber mixtures, of novolaks ABC plastified with terpene-type olefinically unsaturated natural substances C, where the ratio of the molar amount of the phenol or phenol derivative B and the molar amount of the natural substance C in the mo... | 12/07/2004 |
| 6815495 | Coating of melamine, epoxy, urethane or alkyd resin with phenolic resin binder A coating solution for producing a cured coating, particularly for metallic surfaces, includes (1) a binder containing organic polymers with optional organic or inorganic addictions and (2) at least one of a melamine resin, an epoxy resin, a polyurethane resin, an a... | 11/09/2004 |
| 6800717 | Acid catalyzed copolymerization of water and epoxy resin and uses thereof Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of epoxy resins and water. When the starting resin is an epoxy resin derived from bisphenol-A, the resulting product has much lower levels of bisphenol-A and diglycidyl ether of bisphen... | 10/05/2004 |
| 6797789 | Phenolic/polyurea coating co-polymer compositions and process This invention relates to the process of preparation and application of a plural component, fast cure phenolic/polyurea elastomer coating co-polymer system. The disclosed coating system is prepared from the reaction of an isocyanate component and an amine terminated... | 09/28/2004 |
