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| Number | Title | Issue Date |
| 7829638 | Antireflective hardmask composition and methods for using same Hardmask compositions having antireflective properties useful in lithographic processes, methods of using the same, and semiconductor devices fabricated by such methods, are provided. ... | 11/09/2010 |
| 7605213 | Semiconductor encapsulant of epoxy resin, phenolic resin, phosphine-quinone adduct and OH compound There is provided an epoxy resin composition for encapsulating a semiconductor essentially comprising (A) a phenolaralkyl type epoxy resin having a phenylene structure, (B) a phenolaralkyl resin having a biphenylene structure, (C) a curing accelerator containing an ... | 10/20/2009 |
| 7427652 | Composition of epoxy resin, OH-terminated phosphonate oligomer and inorganic filler An epoxy resin composition is disclosed that comprises an epoxy resin, a reactive phosphonate curing agent, an inorganic filler, whose presence allows for reduced amounts of phosphonate as compared to a composition not containing the filler, an optional polybenzoxaz... | 09/23/2008 |
| 7410673 | Smooth board and process for preparing a smooth board The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin... | 08/12/2008 |
| 7201957 | Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition incl... | 04/10/2007 |
| 7202311 | Phosphine oxide hydroxyarl mixtures with novolac resins for co-curing epoxy resins There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition incl... | 04/10/2007 |
| 7148294 | Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic ring-containing proton donor of a polyhydric alcohol and/or a polymercapta... | 12/12/2006 |
| 6992151 | Phosphorus-containing flame-retardant hardener, and epoxy resins cured by the same The present invention discloses an active-hydrogen-containing curing agent having a phosphorus group, and a flame retardant cured epoxy resin which can be prepared via an addition reaction between the active hydrogen and the epoxide group of an epoxy resin. The cure... | 01/31/2006 |
| 6936664 | Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a ... | 08/30/2005 |
| 6916890 | Thermally reworkable epoxy resins and compositions based thereon The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a multifunctional 1-alkenyl ether or 1-cycloalkenyl ether and an alkenyl carboxylic a... | 07/12/2005 |
| 6911503 | Curing agent composition for epoxy resins, epoxy resin composition and use thereof An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a curing accelerator (C), wherein the curing agent (B) is a phenol compound having two or more hydroxyl functional groups or a compound obtained by esterification of the phenol compound... | 06/28/2005 |
| 6887950 | Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins A mixture of hydroxyarylphosphine oxides comprising (a) a mono(hydroxyaryl)phosphine oxide, (b) a bis(hydroxyaryl)phosphine oxide, (c) a tris((hydroxyaryl)phosphine oxide, and, optionally (d) a tri- aryl, alkyl, or aralkyl-substituted phosphine oxide combined with a... | 05/03/2005 |
| 6881799 | Curing agent for epoxy resins and epoxy resin composition A curing agent for epoxy resins, comprising (a) 30 to 99 parts by weight of (i) a modified phenol resin, which is obtained by polycondensation of a heavy oil or pitch, a phenol and an aldehyde compound in the present of an acid catalyst, and/or of (ii) a a phenol re... | 04/19/2005 |
| 6818707 | Spray dried phenolic resole molding powder with crystalline phenolic compounds A binder composition comprising a blend of a crystalline phenolic compound having two or more hydroxyphenyl groups and a thermosetting spray dried phenolic resole resin is disclosed. The binder together with a filler is particularly useful in the preparation of mold... | 11/16/2004 |
| 6812299 | Composition of epoxy resin-unsaturated acid adduct, (meth)acrylate and crystallizable epoxy resin The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin... | 11/02/2004 |
| 6667194 | Method of bonding die chip with underfill fluxing composition A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy r... | 12/23/2003 |
| 6664344 | Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product The present invention provides an epoxy resin composition that has both a rapidly-curability and an excellent storage stability and is useful in the field of electronic and electric materials. That is, the present invention is an epoxy resin composition c... | 12/16/2003 |
| 6569959 | Modified phenolic hydroxyl-containing resin by reacting epoxy resin with difunctional phenol A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and anothe... | 05/27/2003 |
| 6432539 | Phosphorus-containing polymer having phenolic units and uses thereof A phosphorus-containing polymer having phenolic units and an epoxy rein composition are provided. The epoxy resin composition suitably comprises an epoxy resin and a hardener, wherein the epoxy resin may be obtained by reacting the polymer with epihalohyd... | 08/13/2002 |
| 6376101 | Epoxy resin composition and semiconductor devices The present invention provides an epoxy resin composition having excellent moldability, flame retardancy and soldering resistance and low in water absorption. More specifically, it provides an epoxy resin composition for semiconductor encapsulation compri... | 04/23/2002 |
| 6376053 | Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same An inter-laminar adhesive composition containing: (A) a liquid epoxy resin; (B) a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and (C) a latent e... | 04/23/2002 |
| 6329474 | Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole An epoxy resin composition for printed wiring boards which comprises as the essential components (a) an epoxy resin obtained by epoxidizing a condensation product of a phenol with hydroxybenzaldehyde, (b) a condensation product of bisphenol A with formald... | 12/11/2001 |
| 6274251 | Semiconductor encapsulating epoxy resin composition and semiconductor device An epoxy resin composition contains (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a curing catalyst, and (D) an inorganic filler. The catalyst is a quaternary phosphorus compound or a quaternary phosphorus compound which has been mixed and re... | 08/14/2001 |
| 6214455 | Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin Disclosed in a halogen-free flame-retardant epoxy resin composition, comprising (A) a bisphenol A type epoxy resin, (B) a novolak type epoxy resin, (C) a phenolic resin type curing agent, (D) a curing accelerator, and (E) an inorganic filler. The phenolic... | 04/10/2001 |
| 6204422 | Process for producing dialklylnaphthalenes A rational technical process for producing dialkylnaphthalenes from petroleum-derived starting materials which exist in abundance is established. The process for producing dialkylnaphthalenes contains the steps (1), (2), (3), and (4): (1) 1st s... | 03/20/2001 |
| 6197898 | Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent A process for preparing a polymer composition useful as a prepreg comprises (a) melt-mixing at least one thermoplastic polymer above the glass transition temperature or melt temperature of the thermoplastic polymer with either (i) an uncured epoxy resin o... | 03/06/2001 |
| 6046284 | Phenolic hydroxyl-containing resin by reacting epoxy resin with excess difunctional phenol and epoxidation thereof A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and anothe... | 04/04/2000 |
| 5959043 | Phosphorus-containing dicarboxylic reaction product of epoxy resins and phosphorus acid (anhydride) with hardener The invention relates to a flame-resistant epoxy resin mixture comprising epoxy resins, phosphorus-containing compounds and a hardener, which comprises a phosphorus-containing compound of the formula I or II ##STR1## in which R1 and R2 are identical ... | 09/28/1999 |
| 5936010 | Process for producing highly reactive low-viscosity modified phenolic resins A process for producing a highly reactive low-viscosity modified phenolic resin comprising the steps of polycondensating a petroleum heavy oil or pitch, a formaldehyde polymer, and a phenol in the presence of an acid catalyst to prepare a modified phenoli... | 08/10/1999 |
| 5834569 | Grinding wheel for flat glass beveling A composite, polymer bonded abrasive wheel is disclosed for grinding operations and especially for use with multiple station, glass beveling machines. The abrasive wheel breaks in quickly and delivers consistent performance with little or no dressing need... | 11/10/1998 |
| 5773533 | Epoxy resin reacted with carboxy-functional phosphinic or phosphonic acid and hardener The invention relates to flame-resistant epoxy resin mixtures comprising epoxy resins, phosphorus-containing compounds and a hardener, which comprise a phosphorus-containing compound of the formula I or II ##STR1## in which R is a linear or branched ... | 06/30/1998 |
| 5767175 | Aqueous coating composition An aqueous coating composition comprising an acrylic resin-modified epoxy resin (D), which is obtained by the reaction between a mixture of a bisphenol F based epoxy resin (A) and a bisphenol F based phenoxy resin (B) and an acrylic resin having carboxyl ... | 06/16/1998 |
| 5677414 | Acetal derivatives of resole compounds Cyclic acetal derivative of a resole includes the reaction product of an ortho resole compound with a carbonyl compound or a carbonyl compound derivative. The cyclic acetal derivatives of phenolic resole compounds exhibit enhanced storage stability and ca... | 10/14/1997 |
| 5661223 | Composition of phenolic resin-modified epoxy resin and straight chain polymer A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde... | 08/26/1997 |
| 5648436 | Halogen-free mixture, a self-extinguishing prepreg containing this mixture and the use of such a prepreg A halogen-free resin mixture comprising an epoxy resin, a hardener, a flame retardant as well as additives, a self-extinguishing prepreg composed of this resin mixture as well as its advantageous application, particularly as an insulation material. The ha... | 07/15/1997 |
| 5644003 | Epoxy resin composition, process for producing the same and resin-sealed semiconductor device An epoxy resin composition which comprises: (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an epoxy resin curing agent, (c) a cure accelerator, (d) an aromatic polyamide pulp and (e) an inorganic filler as the essential component... | 07/01/1997 |
| 5643675 | Addition for promotion of bench life extension in a hot box binder system The invention relates to the use of tripotassium citrate monohydrate and other alkali metal salts of polybasic acid as bench life extenders in heat curable hot box foundry mixtures comprising sand, thermosetting binder resin, and a latent acid catalyst co... | 07/01/1997 |
| 5641839 | Novolac type epoxy resin and electronic parts encapsulating resin composition This invention relates to a semiconductor encapsulating novolac type epoxy resin with the reduced stress, which is obtained by an addition reaction 1 to 15% of a novolac type epoxy resin of the following formula with a monohydric or dihydric aliphatic alc... | 06/24/1997 |
| 5618891 | Solventless resin composition having minimal reactivity at room temperature A resin composition is provided that is suitable for impregnating sheet material, including fabrics, films, paper and tapes of the type employed to form prepregs, such as tapes used to form electrical insulation layers on electrical components. The resin ... | 04/08/1997 |
| 5616631 | Binder composition for mold making, binder/curing agent composition for mold making, sand composition for mold making, and process of making mold Sand compositions containing a binder composition and a curing agent, in which the binder composition comprises (a) a binder comprising an acid-curable resin and (b) from 0.5 to 63.0% by weight, based on the binder composition, of at least one curing acce... | 04/01/1997 |
