Did You Know...
...that one person who claimed to be the inventor of the television is Russian emigre Vladimir Zworykin? In 1929 David Sarnoff, founder of RCA, asked Zworykin what it would take to develop TV for commercial use. He said: a year and a half and $100,000. In reality, it took 20 years and $50 million! Before his death in 1982 at the age of 92, Zworykin said of his invention: "The technique is wonderful. It is beyond my expectations. But the programs! I would never let my children even come close to this thing."
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| Number | Title | Issue Date |
| 8168731 | Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these pro... | 05/01/2012 |
| 8143357 | Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen cont... | 03/27/2012 |
| 8048969 | Semiconductor encapsulating epoxy resin composition and semiconductor device An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the res... | 11/01/2011 |
| 8039560 | Low dielectric brominated resin with a symmetric or saturated heterocyclic alphatic molecular structure and the preparation thereof The present invention provides a brominated epoxy resin, which has a molecular segment of low polarity in the polymer chain, while the molecular segment of low polarity is attributed to the symmetric or saturated cyclic alphatic molecular structure with low “molec... | 10/18/2011 |
| 7985808 | Distortional matrix of epoxy resin and diamine The disclosure relates to composites having increased distortional deformation, and/or decreased dilatation load, as expressed within the von Mises strain relationship, which provide increased von Mises strain results. These composites may provide enhanced composite... | 07/26/2011 |
| 7745549 | Distortional matrix of epoxy resin and diamine The invention relates to composites having increased distortional deformation, and/or decreased dilatation load, as expressed within the von Mises strain relationship, which provide increased von Mises strain results. These composites may provide enhanced composite ... | 06/29/2010 |
| 7723444 | Epoxy resin composition, process for providing latency to the composition and a semiconductor device An epoxy resin composition which comprises an epoxy resin (A), a curing agent (B), a curing accelerator (C) and a component retarding curing of the epoxy resin (D) which is at least one component selected from components (a), (b) and (c) represented by general formu... | 05/25/2010 |
| 7696286 | Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing accelerator (D). The epoxy resin (A) contains an epoxy resin (a1) represen... | 04/13/2010 |
| 7666953 | Phosphine-protonated haloaromatic compound accelerator with curing resin and curing agent The invention relates to a curing accelerator for a curing resin obtained by reacting a phosphine compound (a) with a compound (b) having at least one halogen atom substituted on an aromatic ring and at least one proton atom which can be discharged, and subjecting t... | 02/23/2010 |
| 7491774 | Producing granular epoxy resin by refining and pulverizing solid epoxy resin A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and epihalohydrin; a purifying processing step of refining the prepared epoxy ... | 02/17/2009 |
| 7470754 | Biphenylaralkyl epoxy and phenolic resins An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor free from a harmful substance out of regard for the environment, which exhibits excellent soldering heat resistance and a higher productivity, as well as a semi... | 12/30/2008 |
| 7442729 | Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reli... | 10/28/2008 |
| 7425598 | Adhesive of epoxy resin and curing agent with xylylene diamine structure The present invention provides an adhesive for laminates containing, as a main component, an epoxy resin composition comprising an epoxy resin and an epoxy resin-curing agent, the epoxy resin composition being formed into an epoxy resin cured product containing a sk... | 09/16/2008 |
| 7423096 | Underfill of resin and sulfonic acid-releasing thermally cleavable compound An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a moun... | 09/09/2008 |
| 7345102 | Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same An epoxy resin composition for encapsulating optical semiconductor element, comprising the following (A) to (D): (A) an epoxy resin component comprising a novolak type epoxy resin having at least one of the biphenyl skeleton and na... | 03/18/2008 |
| 7342071 | Clearcoat paint composition A coating composition including a copolymerization product of a mixture of monomers including one or more carbamate-functional monomers and (meth)acrylic monomers, some having carboxylic acid-functionality. The monomer mixture is essentially free of hydroxyl monomer... | 03/11/2008 |
| 7314587 | Method of forming a multilayer golf ball with a thin thermoset outer layer The present invention is directed towards a method of forming a multilayer golf ball which comprises a core, an inner cover layer and an outer cover layer. The steps include forming a golf ball core; forming an inner cover layer around golf ball core with a material... | 01/01/2008 |
| 7307128 | Epoxy compound, preparation method thereof, and use thereof The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanica... | 12/11/2007 |
| 7304120 | Epoxy compound, preparation method thereof, and use thereof An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 eac... | 12/04/2007 |
| 7300796 | Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temp... | 11/27/2007 |
| 7291684 | Resin composition for encapsulating semiconductor chip and semiconductor device therewith An epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, a resin composition is disclosed for encapsulating a semiconductor chip containing a phenol aralkyl type epoxy resin cont... | 11/06/2007 |
| 7285602 | Granular epoxy resin, production method thereof, and granular epoxy resin package A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less ... | 10/23/2007 |
| 7282266 | Corrosion and alkali-resistant compositions and methods for using the same A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially mela... | 10/16/2007 |
| 7271225 | Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the resin, sealant containing the composition, molding material containing the composition, and laminate containing the composition A phosphorus-containing epoxy resin has a structural unit derived from a secondary phosphine derivative represented by the following formula: wherein R1 represents an alkylene group that may have a sub... | 09/18/2007 |
| 7271222 | Thin-layer-covered golf ball with improved velocity A golf ball comprising a center comprising a polybutadiene having a molecular weight of greater than 200,000 and a resilience index of at least about 40; and a cover layer comprising a polyurethane composition formed from a prepolymer having no greater than 7.5 perc... | 09/18/2007 |
| 7268191 | Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains th... | 09/11/2007 |
| 7267055 | Inks for use in membrane image transfer printing process The present invention involves an ink for transferring a printed image from a membrane to a substrate. The ink comprises a hydrocarbon solvent, a synthetic resin, and a thixotrope for forming a thixotropic network in the ink. The hydrocarbon solvent has a predetermi... | 09/11/2007 |
| 7265167 | Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well a... | 09/04/2007 |
| 7259213 | Indole resins epoxy resins and resin compositions containing the same This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent f... | 08/21/2007 |
| 7247683 | Low voiding no flow fluxing underfill for electronic devices A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfil... | 07/24/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
| 7226971 | Polyester resin with carbamate functionality, a method of preparing the resin, and a coating composition utilizing the resin The present invention is directed to a polyester resin for use in a coating composition. The polyester resin is the reaction product of a first compound comprising a plurality of hydroxyl groups, a lactone compound, a carboxylic acid anhydride, an epoxy compound hav... | 06/05/2007 |
| 7193016 | Epoxy-extended polyacrylate toughening agent In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polybutylacrylates have been found to be useful toughening agents o... | 03/20/2007 |
| 7179861 | Carbamate functional addition polymers and a method for their preparation A carbamate or terminal urea functional vinyl polymer is prepared by reacting a compound having an hydroxyl group and a carbamate group, terminal urea group, or a group that can be converted to a carbamate or terminal urea group, with a cyclic carboxylic acid anhydr... | 02/20/2007 |
| 7163973 | Composition of bulk filler and epoxy-clay nanocomposite A molding composition or encapsulant for an electronic component and its method of preparation provides reduced moisture uptake without undue swelling and comprises melt-blending an epoxy resin, hardener and clay, cooling, adding a catalyst to form an epoxy-clay nan... | 01/16/2007 |
| 7160973 | Urethane polymers that reduce the effect of polylactone linkages A composition comprising a reaction product of a diisocyanate, a chain extension agent having at least difunctional reactivity with an isocyanate, and a material comprising a blend of i) a primary carbamate material having at least one functional group reactive with... | 01/09/2007 |
| 7141619 | Corrosion and alkali-resistant compositions and methods for using the same A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially mela... | 11/28/2006 |
| 7118213 | Promotional aid The present invention relates to a promotional aid comprising a substantially flat plastic film sample which comprises at least one quality which is substantially similar to at least one quality of a medical device. The promotional aids of the present invention may ... | 10/10/2006 |
| 7105610 | Thin-layer-covered golf ball with improved velocity A golf ball comprising a center comprising a polybutadiene having a molecular weight of greater than 200,000 and a resilience index of at least about 40; and a cover layer comprising a polyurethane composition formed from a prepolymer having no greater than 7.5 perc... | 09/12/2006 |
| 7098276 | Flame-retardant epoxy resin composition and semiconductor device made using the same An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and... | 08/29/2006 |
