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| Number | Title | Issue Date |
| 5093437 | Polyamide copolymers Novel polyamide copolymers having skeletons of a specific structure are disclosed. The polyamide copolymers have excellent resistance to hydrolysis, low temperature characteristics (low temperature softness), heat aging resistance and mechanical propertie... | 03/03/1992 |
| 5093202 | Method of gluing substrates using a composition comprising an arylaliphatic copolyimide with ether chain formations and an epoxy resin Adhesive compositions are described comprising at least an arylaliphatic olyimide with ether chain formations, obtained by the polycondensation reaction of a tetracarboxylic aromatic acid or of one of its derivatives with at least two primary diamines, o... | 03/03/1992 |
| 5091481 | Composition of polyepoxy compounds, linear polymer and aromatic diamine A resin composition for laminate, which comprises 100 parts by weight of a composition (B), from 0.5 to 10 parts by weight of dicyandiamide and from 1 to 100 parts by weight of a linear polymer, said composition (B) comprising (i) a composition (A) compri... | 02/25/1992 |
| 5086149 | Low energy cured composite repair system based on epoxy resin with imidazole blocked naphthyl diisocyanate catalyst having extended shelf life A fiber reinforced resin matrix composite material repair system is provided, which critically employs a resin comprising a catalyst of the formula I: ##STR1## with a multifunctional epoxy resin, the resin system being sealed in a water-proofed ... | 02/04/1992 |
| 5084525 | Epoxy resin composition with polyamide powder An epoxy resin bonding composition containing two different epoxy resin as a liquid admixture, a curing agent and a polyamide powder is disclosed. The bonding composition may be used, for example, to bond a ferrite magnetic to a motor yoke. One of the epo... | 01/28/1992 |
| 5081167 | Cyanamide-cured maleimide/epoxy resin blend A polymaleimide/epoxy blend is cured with cyanamide to provide interlocked one-phase networks with superior thermal properties.... | 01/14/1992 |
| 5055530 | Epoxy resin-modified polyamide resin The present invention discloses a curable coating composition characterized in that the composition comprises as a vehicle component a nitrogen-containing resin modified with an epoxy resin and obtained by subjecting to a condensation reaction a polybasic... | 10/08/1991 |
| 5037901 | Polyaminoamide which filters ultraviolet radiation Polyaminoamides of formula: ##STR1## in which A1 represents a divalent radical of structure: ##STR2## in which a and b=0 or 1 ##STR3## in which c and d=0 or 1 ##STR4## B1 represents: 1) in the proportions of ... | 08/06/1991 |
| 5037900 | Composition of polyarylate, polyamide, polyethylene terephthalate and epoxy resin Thermoplastic resin compositions comprising polyarylate and polyamide resins as main components, polyethylene terephthalate and an epoxy resin of the following formula [1] in a predetermined amount are provided. ##STR1## The thermoplastic resin compositio... | 08/06/1991 |
| 5036144 | Powdered lacquer of epoxy resin of diamine-benzene polycarboxylic acid salt The invention relates to lacquers based on a substance mixture of epoxide compounds and possibly polyesters as well as salts of primary (cyclo)aliphatic C4-18 -diamines with benzene polycarboxylic acid as hardeners as well as the usual additive... | 07/30/1991 |
| 5034473 | Composition of polyepoxide derived from alkoxy-substituted allylphenol and carboxy-terminated polyester or polyamide Epoxy compositions having improved toughness and flexibility comprising a polyepoxide of the formula ##STR1## wherein each X is H, allyl or glycidyl, Y is allyl or glycidyl and R is an alkyl of 1 to 4 carbons with there being at least two epoxy group... | 07/23/1991 |
| 5030698 | Composition of epoxy resin, butadiene-acrylonitrile copolymer and segmented copolyester, copolyamide or copolyesteramide Curable compositions are described comprising (A) an epoxy resin having on average more than one epoxide group per molecule, (B) a curing agent which can be activated at an elevated temperature for component (A), (C) a liquid copolymer based on butadiene, acry... | 07/09/1991 |
| 5030693 | Copolymer compositions prepared from triazine derivatives of polycarbonates Triazine compounds are prepared by the reaction of a bisphenol or a hydroxy-terminated polycarbonate with a chlorocyanurate containing epoxy and/or aromatic substituents. The compounds derived from bisphenols or protected bisphenols may be converted to po... | 07/09/1991 |
| 5026789 | Curable impact modified epoxy resin having stabilized multiphase morphology A curable impact modified epoxy resin mixture suitable for producing high performance composites is composed of A. an aromatic epoxy compound, B. an amine type curing agent, C. from 10 to 40% by weight of an aromatic thermoplastic oligomer which contains react... | 06/25/1991 |
| 5021519 | Epoxy-polyimide blend for low temperature cure, high-performance resin system and composites A non-elastomeric epoxy having a mol wt less than about 10,000 and curing agent therefor ("epoxy-curing-agent"), both of which (epoxy/epoxy-curing-agent) are liquid while at curing temperatures, provide a continuous liquid phase in which a polyimide (PI) ... | 06/04/1991 |
| 5017676 | Acetoacetoxyethyl methacrylate in the cure of epoxy resins A method for curing a 1,2-epoxy resin by mixing the resin with an effective amount of an amine curing agent under epoxy resin curing conditions and accelerating the cure with acetoacetoxyethyl methacrylate (AAEM).... | 05/21/1991 |
| 5015701 | Composition of vinyl ester resin, hydroxyalkyl (meth)acrylate and a styrene Described herein are curable molding compositions comprising a mixture of: (a) a vinyl ester produced by the addition of an unsaturated monocarboxylic acid to a polyepoxide and having a molecular weight greater than 300; (b) acrylic or methacrylic acid or a functio... | 05/14/1991 |
| 5013818 | Modified polyarylate resin and composition comprising the same An improved polyarylate resin is provided, which resin comprises the following units (I) to (IV) ##STR1## the units (I) being contained in an amount of from 3 to 30 mole %, the units (II) being contained in amount of not less than 30 mole %, the unit... | 05/07/1991 |
| 5013383 | Epoxy adhesive for use with thermal ink-jet printers An adhesive (14) is disclosed which is useful in bonding dissimilar adherends, such as silicon and plastic or stainless steel. The adhesive is particularly useful in bonding a printhead (12) and a pen body (10) for use in a thermal ink-jet printer, since ... | 05/07/1991 |
| 5006611 | Curable epoxy resin compositions of matter containing a thermoplastic which has phenolic end groups Heat-curable compositions of matter which are stable on storage and which contain (a) 10-70 parts by weight of an epoxy resin having a functionality of at least 3, (b) 90-30 parts by weight of an epoxy resin having a functionality of 2-2.5, (c) a diphenol... | 04/09/1991 |
| 4996279 | Dissymmetric polymer materials Dissymmetric new epoxy polymer materials have improved processability because they can be cured at lower temperatures.... | 02/26/1991 |
| 4996267 | Heat-curable resin mixture of monocyanate, polycyanate and reactive thermoplastic A heat-curable resin mixture comprises (A) a polyfunctional aromatic cyanic ester, (B) a monofunctional aromatic cyanic ester, (C) a thermoplastic polymer, (D) an optional bismaleimide, (E) an optional epoxy resin.... | 02/26/1991 |
| 4994525 | Functionalized polyphenylene ethers, method of preparation, and polyphenylene ether-polyamide compositions prepared therefrom Functionalized polyphenylene ethers are prepared by reacting a polyphenylene ether with a polymerizable olefinic compound containing a phosphorus or silicon atom or an epoxy or lactam group, preferably in the presence of a free radical initiator. They may... | 02/19/1991 |
| 4985529 | Thermosettable imide compound and epoxy resin composition containing the same The invention provides an imide compound represented by the general formula (I), ##STR1## wherein X represents a hydroxyl or amino group, Ar1 and Ar2 independently represent an aromatic residue, R1 represents a hydrog... | 01/15/1991 |
| 4977239 | Polybase from amino amido carboxylic acid, polyamine and difunctional alkylating agent A water-soluble organic polybase which is useful for the cationization of asbestos-free, cellulose fiber filter media is prepared by reacting a mixture of a compound of the formula R2 --CO--R1 --COOH and a polyalkyleneimine with a difunct... | 12/11/1990 |
| 4962162 | Resin composition of thermosetting resin and thermoplastic resin The resin composition which contains thermosetting resin as Component (A), a thermoplastic resin as Component (B), and at least one compound selected from the group consisting of an epoxy resin capable of dissolving the thermoplastic resin and a reactive ... | 10/09/1990 |
| 4960836 | Polyamide polycarbonate block copolymer Polyamide-carbonate block copolymers are made by admixture of polyamides with carbonate polymers containing carboxyl groups or an ester groups capable of elimination to form carboxyl groups, in the presence of a polyepoxy linking agent, such as triglycidy... | 10/02/1990 |
| 4959438 | Epoxy resin composition and prepreg for composite materials using the same from bi and tri-epoxides, triarylbisphenols and diaminodiphenylsulfones An epoxy resin composition is disclosed, which comprises the following elements: (A) a bifunctional epoxy resin; (B) a trifunctional epoxy resin; (C) a phenolic compound represented by the following general formula: ##STR1## wherein X1, X2... | 09/25/1990 |
| 4957980 | Polyester resin composition and hollow molded article thereof A polyester resin composition having excellent gas barrier properties and transparency which comprises 100 parts by weight of a thermoplastic polyester resin (A), 1 to 100 parts by weight of a polyamide resin having metaxylylene group (B) and 0.01 to 50 p... | 09/18/1990 |
| 4957995 | Low-viscosity epoxy resin, and fiber-reinforced composite material based on m-alkyl triglycidylaminophenols A low viscosity epoxy resin, i.e., a low viscosity polyglycidyl derivative, of an aminophenol having at least one alkyl group on its aromatic ring of which viscosity is 15 poises or below as measured at 25° C., a resin composition containing said resin, ... | 09/18/1990 |
| 4948831 | Process for preparing polyetherimide/epoxyimide resin composition A process for the preparation of a polyetherimide/epoxyimide resin composition comprising (a) mixing a polyetherimide and an epoxyimide in a mixing ratio, by weight, of polyetherimide to epoxyimide of from 6:1 to 1:1 in a polar solvent to form a mixed res... | 08/14/1990 |
| 4937296 | Epoxy-amine coatings with carboxylic acid thixotropic additive Curable epoxy-amine coatings comprised of pigmented mixtures of reactive amine-functional curing agents and epoxy resins are substantially improved by being rendered thixotropic or pseudoplastic by the inclusion of at least about 0.05% by weight of a thix... | 06/26/1990 |
| 4921916 | Flame-retardant fillers in silane-grafted ethylene polymer process A flame-retardant cross-linkable polymer composition for extrusion which is capable of producing non-porous products comprises: at least one flame-retardant filler of the class that evolve substantial amounts of bound water on heating at temperatures abov... | 05/01/1990 |
| 4916203 | Curable resin composition from epoxy compound and propargyl aromatic ether A curable resin composition comprises an epoxy compound and a propargyl aromatic ether.... | 04/10/1990 |
| 4910270 | Composition containing epoxy resin, di(meth)acrylate, N-heterocylic compound and polyamine Disclosed is a curable epoxy resin composition having excellent flexibility and toughness, comprising (a) an epoxy resin, (b) a glycol type di(meth)acrylate, (c) a nitrogen containing heterocyclic compound, and (d) a polyamine having at least two amino gr... | 03/20/1990 |
| 4900848 | Low-viscosity epoxy resin, and fiber-reinforced composite material from triglycidyl m-aminophenols A low viscosity epoxy resin, i.e., a low viscosity polyglycidyl derivative, of an aminophenol having at least one alkyl group on its aromatic ring of which viscosity is 15 poises or below as measured at 25° C., a resin composition containing said resin, ... | 02/13/1990 |
| 4892901 | Polyetherimide ester elastomer Disclosed is a polyetherimide ester composition comprising at least one polyetherimide ester resin and a modifier composition which is comprised of a modifying amount of at least one multifunctional epoxy resin. The modifier composition may optionally als... | 01/09/1990 |
| 4888407 | Imide compound and composition containing the same The present invention provides an improved epoxy resin composition comprising an epoxy resin and a novel imide compound represented by the formula ##STR1## wherein X represents an --NH2 group and/or --OH group, Ar1 and Ar | 12/19/1989 |
| 4879324 | Thermoplastic molding compositions based on polycarbonates, polyesters and polyamides Thermoplastic molding compositions contain as essential components (A) from 1 to 90% by weight of a polycarbonate, (B) from 1 to 90% by weight of a polyester, (C) from 1 to 90% by weight of a polyamide, (D) from 0.5 to 30% by weight of a polymeric component having hydro... | 11/07/1989 |
| 4877848 | Thermoplastic blends containing polyamide and epoxy functional compound Thermoplastic blends of polyamide with a resin selected from the group consisting of polycarbonate, poly(ester-carbonate), and polyarylate have improved physical properties with the incorporation therein of an epoxy functional compatibilizing agent.... | 10/31/1989 |
