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| Number | Title | Issue Date |
| 7786219 | Cyanate-terminated polyphenylene ether The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition ... | 08/31/2010 |
| 7683138 | Molding compositions A curable composition exhibiting excellent moldability without mold staining or delamination is provided, including an epoxy resin, a curing agent for the epoxy resin, and a polyphenylene oxide compound having a glass transition temperature between about 165° C. an... | 03/23/2010 |
| 7521511 | Thermosetting resin composition, multilayer body using same, and circuit board Thermosetting resin compositions for manufacturing circuit boards and build-up circuit boards, and build-up boards, and multilayer bodies and circuit boards manufactured using these compositions are provided. A composition contains polyimide resin (A), phenol resin ... | 04/21/2009 |
| 7439310 | Polyphenylene ether modified by reaction with cresol novolac epoxy resin The present invention can provide a resin composition comprising epoxy-modified polyphenylene ethers which show good solubility in MEK or acetone which has been conventionally used in a manufacturing process for printed boards of epoxy resins, and has high heat resi... | 10/21/2008 |
| 7388057 | Di(meth)acrylate of epoxy-terminated polyphenylene ether A bifunctional phenylene ether oligomer containing monophenylene and biphenylene moieties can be rendered thermosetting by reacting the terminal phenolic hydroxyl groups with a) a cyanogen halide to introduce terminal cyanate groups, b) a halogenated glycidyl to for... | 06/17/2008 |
| 7384682 | Electronic package with epoxy or cyanate ester resin encapsulant An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper sur... | 06/10/2008 |
| 7378455 | Molding composition and method, and molded article A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent c... | 05/27/2008 |
| 7371801 | Vinyl ester and epoxide resins toughened with thermoplastic resin particles A material having a fracture toughness (K1c) of at least 1.2 Mpam.m1/2 as determined according to Standard ISO 13586:2000 comprises a vinyl ester and/or epoxide resin polymerizable at a temperature of less than 70° C. combined with thermoplast... | 05/13/2008 |
| 7371800 | Derivatized novolak polyhydroxystyrene from hydroxyphenylmethylcarbinol A process for preparing derivatized poly(4-hydroxystryrene) having a novolak type structure which comprises the steps of (i) supplying a solution of methanol containing 4-hydroxyphenylmethylcarbinol, (ii) subjecting said solution to an acid catalyzed displacement re... | 05/13/2008 |
| 7341783 | Functionalized polyphenylene ether An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The invention relates to a functionalized polyphenylene ether having an avera... | 03/11/2008 |
| 7326755 | Coolant resistant and thermally stable primer composition A coolant-resistant and thermally stable primer composition comprising an organic-functional silane, preferably the reaction product of at least one amino-functional silane and at least one isocyanato-functional silane, is provided. The primer composition may additi... | 02/05/2008 |
| 7321005 | Encapsulant composition and electronic package utilizing same A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity o... | 01/22/2008 |
| 7255925 | Thermosetting resin composition for high speed transmission circuit board The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and ... | 08/14/2007 |
| 7247682 | Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), wherei... | 07/24/2007 |
| 7235611 | Triazine compounds, polymers comprising triazine structural units, and method In various embodiments the present invention comprises 2,4,6-trisubstituted-1,3,5-triazine capping agents comprising one, two, or three leaving groups as substituents with any remaining substituents being essentially inert to reaction with a nucleophilic group on a ... | 06/26/2007 |
| 7205035 | Thermoset composition, method, and article A curable composition includes a functionalized poly(arylene ether), an alkenyl aromatic monomer, an acryloyl monomer, and a polymeric additive selected from polystyrene, poly(styrene-maleic anhydride), poly(styrene-methyl methacrylate), polybutene, poly(ethylene-bu... | 04/17/2007 |
| 7192997 | Encapsulant composition and electronic package utilizing same A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexi... | 03/20/2007 |
| 7148296 | Capped poly(arylene ether) composition and process A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(... | 12/12/2006 |
| 7101933 | Process for producing high speed transmitting dielectric material A process for producing high speed transmitting dielectric materials comprises essentially mixing and reacting a proportion of polyphenylene ether (PPE) with a proportion of an epoxy resin of the type of low bromine content in a non-polar solvent in the presence of ... | 09/05/2006 |
| 7090895 | Flame retardant epoxy resin composition, semiconductor encapsulating material using same, and resin encapsulated semiconductor device An epoxy resin composition is provided, which includes (A) an epoxy resin with at least 2 epoxy groups within each molecule, (B) a curing agent, and (C) a foaming agent. This composition displays excellent flame retardancy and reliability and is suitable for use as ... | 08/15/2006 |
| 7084213 | Compositions adapted for chain linking A polymer composition comprising chains of at least one aromatic polymer or a mixture thereof together with at least one chain linking component wherein the at least one aromatic polymer comprises polymer chains of number average molecular weight (Mn) in a first ran... | 08/01/2006 |
| 7022776 | Conductive polyphenylene ether-polyamide composition, method of manufacture thereof, and article derived therefrom A conductive thermoplastic composition includes specific amounts of a polyphenylene ether copolymer, a polyamide, and an electrically conductive filler. The composition exhibits excellent high-temperature dimensional stability and impact strength, and it is particul... | 04/04/2006 |
| 7022777 | Moldable poly(arylene ether) thermosetting compositions, methods, and articles A moldable thermosetting composition comprises a poly(arylene ether), a thermosetting resin, a toughening agent, and an amine cure agent. The compositions may be conveniently prepared without solvents, and the poly(arylene ether) may be provided in the form of an ea... | 04/04/2006 |
| 6992166 | Phenolic resin and method of producing the same A phenolic resin obtainable by reacting a dihydroxy compound of the following formula (1) with a phenolic compound, wherein the dihydroxy compound is partially dehydrated. ... | 01/31/2006 |
| 6949592 | Liquid epoxy resin emulsions, method for the production and use thereof The invention relates to novel liquid epoxy resin emulsions which contain the following components, dissolved and/or dispersed in water: (A) at least one binding agent selected from the group made of epoxy resins and modified epoxy resins, (B) at least one non ionic... | 09/27/2005 |
| 6913792 | Hybrid materials employing PPE/polystyrene/curable epoxy mixtures A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably high impact polystyrene (HIPS), and optionally a compatiblizer, with... | 07/05/2005 |
| 6906120 | Poly(arylene ether) adhesive compositions An adhesive for thermoplastic film is formed from a composition comprising a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, an optional plasticizer, and a cure agent. The adhesive finds particular utility in circuit board applications. | 06/14/2005 |
| 6884837 | Crosslinkable polymer composition The present invention provides a crosslinkable polymer composition in the form of its aqueous polymer dispersion or polymer powder, including A) a copolymer having a glass transition temperature Tg or a melting temperature of ≧30° C. and containing units derived ... | 04/26/2005 |
| 6875812 | Resin composition containing graft copolymer An object of the present invention is to provide an agent serving both as a compatibilizer and an impact strength-imparting agent, which is freed from layer separation phenomenon and capable of improving compatibility to a polyphenylene ether and/or a polyolefin wit... | 04/05/2005 |
| 6815485 | Resin composition An object of the invention is to provide a resin composition with which color tone, moldability, heat resistance, flame retardancy and mechanical properties are simultaneously attained each in a sufficient level and which is particularly excellent in color tone and ... | 11/09/2004 |
| 6808810 | Resin composition, laminate and production of laminate A resin composition comprising 3 to 80 parts by weight of a resol type phenolic resin or 3 to 150 parts by weight of a polyhydric phenol, based on 100 parts by weight of a copolymer (Å) of an epoxy group-containing monomer and an α-olefin, a powder of the resin c... | 10/26/2004 |
| 6794034 | Resin composition, molding material, and molded object A phenolic resin composition in which the phenolic resin can be smoothly cured at a low temperature while inhibiting the generation of free formaldehyde and trapping free phenol. An epoxy compound is dispersed or dissolved as a hardener in an aqueous phenolic resin ... | 09/21/2004 |
| 6774160 | Curable epoxy resin compositions and the cured residues thereof A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixt... | 08/10/2004 |
| 6770691 | Curable epoxy resin compositions and the cured residues thereof A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixt... | 08/03/2004 |
| 6767639 | Cured epoxy resin compositions with brominated triazine flame retardants, and laminates comprising them A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixt... | 07/27/2004 |
| 6713589 | Phenyl, naphthly or fluorene cyclopentyl epoxy resins This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorption, high adhesion and fluidity which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl... | 03/30/2004 |
| 6693149 | Process for preparing epoxy group-containing curable polyphenylene ether resin using high-molecular-weight polyphenylene resin A process for preparing an epoxy group-containing curable polyphenylene ether (PPE) resin. The process involves introducing an epoxy group-containing functional group to the terminal end of PPE (Mn>3000) by modifying the hydroxy and ester groups on the te... | 02/17/2004 |
| 6670042 | Insulating film Provided is an industrially advantageous insulating film obtainable from a resin composition comprising (A) 100 parts by weight of a polyphenylene oxide having a structural unit of the following formula (1): ##STR1## and (B) 0.1 to 60 parts by weight of a... | 12/30/2003 |
| 6589656 | Epoxy resin composition, prepreg and metal-clad laminate An epoxy resin composition of the invention comprises: an epoxy resin; a hardening agent; and a phenol-modified polyphenylene oxide having a number average molecular weight of 1000 to 4000, which is prepared by carried out a redistribution reaction betwee... | 07/08/2003 |
| 6569953 | Phenolic resin polyols and polymers derived from the polyols Phenolic resin polyols are disclosed. The polyols, which contain aliphatic or mixed phenolic and aliphatic hydroxyl groups, are the reaction products of aralkylated phenols or phenol aralkylation polymers with an oxyalkylating agent selected from alkylene... | 05/27/2003 |
