Celebrity Inventors
Penn Jillette of Penn and Teller fame has patented a "Hydro-Therapeutic Stimulator", which uses a hot tub for stimulation.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8173745 | Compositions useful for preparing composites and composites produced therewith A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadie... | 05/08/2012 |
| 8138266 | Semiconductor-encapsulating resin composition and semiconductor device A semiconductor-encapsulating resin composition includes a curing agent and a compound (A) having a plurality of glycidyl ether groups. When ion viscosity of the resin composition is measured under conditions of a measurement temperature of about 175° C. and a meas... | 03/20/2012 |
| 8119737 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for p... | 02/21/2012 |
| 7947779 | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for p... | 05/24/2011 |
| 7674859 | Adhesive composition and adhesive sheet An adhesive sheet which can actualize a high package reliability wherein there is no separation at the adhesive interface and no package cracking, in a package in which a semiconductor chip being reduced in thickness is mounted under severe reflow conditions after e... | 03/09/2010 |
| 7615595 | Adhesive of epoxy resin, diene copolymer-modified epoxy resin, phenolic-terminated elastomeric toughener and polyester segment polymer The present invention relates to an epoxy adhesive composition comprising a) a first epoxy resin, b) a second epoxy resin modified with a copolymer based on a 1,3-diene and a polar, ethylenically unsaturated comonomer, c) a tou... | 11/10/2009 |
| 7432335 | Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same There are provided a composition for functioning as an effective additive for epoxy resin that is solid at room temperature and has high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carbox... | 10/07/2008 |
| 7423096 | Underfill of resin and sulfonic acid-releasing thermally cleavable compound An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a moun... | 09/09/2008 |
| 7393895 | Forming concentrate of poly(arylene ether), thermosetting resin and compatibilizer A method of forming a poly(arylene ether)-containing solid concentrate is described. The method includes blending a poly(arylene ether), a thermosetting resin, and a compatibilizing agent in the presence of a solvent to form a homogeneous solution, and removing the ... | 07/01/2008 |
| 7358301 | Latex particles having incorporated image stabilizers A composition and method of associating stabilizer functionalities with latex particulates is provided. The composition can comprise a latex particulate configured for inclusion in an ink-jet ink to provide improved humidfastness of an image printed by the ink-jet i... | 04/15/2008 |
| 7348057 | Acrylic adhesive sheet An adhesive sheet made of an acrylic adhesive composition comprising (A) an acrylic polymer containing carboxyl groups and having a Tg of 5-30° C., (B) a resol phenolic resin, (C) an epoxy resin, and (D) a curing accelerator has improved heat resistance, processing... | 03/25/2008 |
| 7327039 | Nanoparticle filled underfill The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting r... | 02/05/2008 |
| 7323242 | Thermally curable binding agents A heat-curable binder based on an aqueous polymer dispersion comprising an emulsion polymer (EP), a polymer composed of at least 5% by weight of an ethylenically unsaturated monocarboxylic acid, dicarboxylic acid or dicarboxylic anhydride (acid polymer SP for short)... | 01/29/2008 |
| 7323521 | Epoxy polymer additives for powder coatings Comb polymers prepared by reacting an epoxy resin and a lactone are disclosed. These comb polymers find particular application as additives for powder coating compositions, to improve various performance properties thereof. Powder coating composition comprising the ... | 01/29/2008 |
| 7320762 | Polymer compound with nonlinear current-voltage characteristic and process for producing a polymer compound The polymer compound contains a polymer matrix and a filler embedded in the matrix. The filler comprises two filler components with nonlinear current-voltage characteristics deviating from one another. By selection of suitable amounts of these filler components, a p... | 01/22/2008 |
| 7265173 | Tire fabric compositions and methods of production thereof A polymer-based reinforced rubber composition may be produced that comprises a) a plurality of polymer-based fibers, wherein at least some of the plurality of polymer-based fibers comprises at least one surface modification agent; and b) a rubber compound, wherein t... | 09/04/2007 |
| 7262261 | Binders and a method of use thereof as coating material for metal containers Condensation products of dihydroxyaromatics A, alone or in mixture with mono- or polyhydroxyaromatics C, with diepoxides or polyepoxides B which have been alkylolated by reaction with aldehydes D and whose alkylol groups may have been etherified with alcohols, a pro... | 08/28/2007 |
| 7230055 | Compositions containing oxetane compounds for use in semiconductor packaging Compositions containing oxetane compounds having ester, amide, urea, carbamate, carbonate, or carbonyl functionality one carbon atom removed from the oxetane ring cure at high temperatures are suitable for use as underfill materials within a semiconductor package, p... | 06/12/2007 |
| 7217771 | Epoxy resin Compositions containing: (a) a liquid epoxy resin; (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine; (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C.... | 05/15/2007 |
| RE39615 | Adhesive compositions and copper foils and copper clad laminates using same The invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula | 05/08/2007 |
| 7204574 | Polyimide thickfilm flow feature photoresist and method of applying same A polyimide photoresist for thick film flow features adheres to a polyimide nozzle plate or other materials, without the use of an adhesive material between the two surfaces. Further, the photoresist can utilize an acrylate UV initiator, which can reduce the potenti... | 04/17/2007 |
| 7193016 | Epoxy-extended polyacrylate toughening agent In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polybutylacrylates have been found to be useful toughening agents o... | 03/20/2007 |
| 7169446 | Oxetane compound, actinic ray curable composition, ink composition for ink jet recording, and image formation method Disclosed is an oxetane compound represented by the following formula (I), (II), (III), (IV) or (V): ... | 01/30/2007 |
| 7157549 | Polymerization of oxiranes with a lithium-containing initiator A method is provided for polymerizing oxiranes by employing a lithium-containing polymerization initiator in a liquid reaction medium devoid of polymerization additives. Linear and star polymers can be produced by practicing the subject method. ... | 01/02/2007 |
| 7153576 | Weatherable multilayer article assemblies and method for their preparation Disclosed is a multilayer article assembly comprising (i) a coating layer comprising a block copolyestercarbonate comprising structural units derived from at least one 1,3-dihydroxybenzene and at least one aromatic dicarboxylic acid, (ii) a second layer comprising a... | 12/26/2006 |
| 7101933 | Process for producing high speed transmitting dielectric material A process for producing high speed transmitting dielectric materials comprises essentially mixing and reacting a proportion of polyphenylene ether (PPE) with a proportion of an epoxy resin of the type of low bromine content in a non-polar solvent in the presence of ... | 09/05/2006 |
| 7094845 | Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same There is provided a composition for functioning as an effective additive for an epoxy resin that is a solid at room temperature and has a high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic ... | 08/22/2006 |
| 7087664 | Resin film and multilayer printed wiring board using thereof A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section o... | 08/08/2006 |
| 7083855 | Continuous filament mat binder system A binder slurry for a continuous filament mat used in a phenolic pultrusion system comprising a phenolic compatible silane, a non-ionic surfactant, a defoamer, water, an organic acid and a bisphenol epoxy powdered resin having a thermally active dicyandiamide cross-... | 08/01/2006 |
| 7084194 | Halogen-free resin composition A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): | 08/01/2006 |
| 7071263 | Epoxy adhesives and bonded substrates Epoxy adhesives are reported that comprise: (i) about 20% to about 40% weight of a reactive oligomer having a glass transition temperature of about −40° C. or less after curing and having at least two functional groups selected from epoxide, isocyanate, and amine... | 07/04/2006 |
| 7022777 | Moldable poly(arylene ether) thermosetting compositions, methods, and articles A moldable thermosetting composition comprises a poly(arylene ether), a thermosetting resin, a toughening agent, and an amine cure agent. The compositions may be conveniently prepared without solvents, and the poly(arylene ether) may be provided in the form of an ea... | 04/04/2006 |
| 7012116 | Blend compositions of an unmodified poly vinyl alcohol and a thermoplastic elastomer This invention relates, in general, to blend compositions of an unmodified poly vinyl alcohol and a thermoplastic elastomer and thermoplastic film and fiber structures comprising these blend compositions. More specifically, this invention relates to substantially wa... | 03/14/2006 |
| 7013019 | Thermoset composite material baffle for loudspeaker This invention provides a baffle formed from a thermoset composite material such as Bulk Molding Compound (BMC), Thick Molding Compound (TMC), or Sheet Molding Compound (SMC). Due to the physical properties of BMCs, TMCs, and SMCs, the baffle may be molded to minimi... | 03/14/2006 |
| 7005185 | Quick cure carbon fiber reinforced epoxy resin An epoxy composition includes an epoxy resin, a latent curing agent, and a catalyst. The composition includes two epoxide groups per molecule, and the latent curing agent is preferably a dicyanopolyamide, and most preferably dicyandiamide. The catalyst includes 2,4-... | 02/28/2006 |
| 6979712 | Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hyd... | 12/27/2005 |
| 6962957 | Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 μm or smaller and having such a size distribution that t... | 11/08/2005 |
| 6951907 | Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex A thermosetting resin is useful as an underfilling sealant form mounting semiconductors onto a printed circuit board and comprises (a) an epoxy resin containing at least one multifunctional epoxy resin, (b) an adhesion promotor having at least two secondary amine gr... | 10/04/2005 |
| 6943219 | Polymer and epoxy resin compositions The present invention provides a vinyl polymer with an epoxy group terminally introduced therein and an epoxy resin composition comprising (A) an epoxy resin and (B) a vinyl polymer which has a main chain produced by living radical polymerization and has a reactive ... | 09/13/2005 |
| 6939431 | Paste for circuit connection, anisotropic conductive paste and uses thereof Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and... | 09/06/2005 |
