Bizarre Patents
Pillow with retractable umbrella
A pillow assembly having a supporting assembly and a retractable umbrella assembly that is easily transportable and allows a user to support his/her head while covering their face from sunlight.
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| Number | Title | Issue Date |
| 7737199 | Two-component adhesive of epoxy resin/polyol pack and polyamide/aliphatic amine/tertiary amine pack An epoxy adhesive composition of an epoxy resin, an epoxy terminated liquid rubber, filler, and an amine curing package for said epoxy resin is disclosed. Advantageously, a short chain diol will be incorporated into the adhesive in order to enhance reactivity and st... | 06/15/2010 |
| 7612130 | Composition of polyester, aromatic epoxy compound and epoxy-functional polyolefin and/or copolyester A composition contains a polyester; an aromatic epoxy compound, in an amount sufficient to provide 5 to 300 milliequivalents of epoxy per kilogram of polyester; and 0.5 to 6 weight percent, based on the weight of the polyester, and an ethylene-glycidyl methacrylate ... | 11/03/2009 |
| 7291657 | Ultraviolet light curing compositions for composite repair An ultraviolet (UV) light curable formulation useful for repairing composite materials, comprising: an acrylic oligomer, an acrylic monomer, and a photoinitiator. This formulation may include fiberglass. The photoinitiator can be a combination of a bis-acylphosphine... | 11/06/2007 |
| 7291656 | Ultraviolet light curing compositions for composite repair An ultraviolet (UV) light curable formulation useful for repairing composite materials, comprising: an acrylic oligomer, an acrylic monomer, and a photoinitiator. This formulation may include fiberglass. The photoinitiator can be a combination of a bis-acylphosphine... | 11/06/2007 |
| 7276542 | Ultraviolet light curing compositions for composite repair An ultraviolet (UV) light curable formulation useful for repairing composite materials, comprising: an acrylic oligomer, an acrylic monomer, and a photoinitiator. This formulation may include fiberglass. The photoinitiator can be a combination of a bis-acylphosphine... | 10/02/2007 |
| 7247683 | Low voiding no flow fluxing underfill for electronic devices A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfil... | 07/24/2007 |
| 7144544 | Ultraviolet light curing compositions for composite repair An ultraviolet (UV) light curable formulation useful for repairing composite materials, comprising: an acrylic oligomer, an acrylic monomer, and a photoinitiator. This formulation may include fiberglass. The photoinitiator can be a combination of a bis-acylphosphine... | 12/05/2006 |
| 7087664 | Resin film and multilayer printed wiring board using thereof A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section o... | 08/08/2006 |
| 6979712 | Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hyd... | 12/27/2005 |
| 6884854 | Composition of epoxy resin, low glass transition temperature copolymer, latent hardener and carboxy-terminated polyamide and/or polyamide Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder component for epoxy resin compo... | 04/26/2005 |
| 6803414 | Damping resin composition and damping resin article for structure using the resin composition A damping resin composition is provided which includes bifunctional diacrylate or bifunctional dimethacrylate (A) expressed by the formula (1) below, and an unsaturated polyester resin (B+C) containing an unsaturated polyester (B) and a cross-linking monomer (C), an... | 10/12/2004 |
| 6790904 | Liquid coating of film-forming resin and particles chemically modified to lower surface tension Liquid coating compositions having improved mar and scratch resistance are disclosed. The coatings generally comprise one or more particles that have been modified to render the particles more surface active. The improved resistance is achieved without affecting the... | 09/14/2004 |
| 6645340 | Curable two-component mortar composition and its use A curable, two-component mortar composition is described, which is based on a curable epoxide resin, at least one reactive diluent for the epoxide resin, an amine curing agent and one or more inorganic fillers, as well as, optionally, curing catalysts, rh... | 11/11/2003 |
| 6632881 | Encapsulant of epoxy resin and liquid aromatic amine curing agent An encapsulating epoxy resin composition comprising an epoxy resin which is liquid at normal temperature, a curing agent containing an aromatic amine which is liquid at normal temperature, an inorganic filler, and rubber particles; an encapsulant comprisi... | 10/14/2003 |
| 6579936 | Composition of polyarylenesulfide, epoxy resin and oxazoline polymer A resin composition applicable to semiconductor or electric devices comprises (A) a polyarylenesulfide resin, (B) a bisphenol epoxy resin, (C) an oxazoline group-containing amorphous polymer, and (D) an impact resistance-improving resin which is either (d... | 06/17/2003 |
| 6388009 | Carboxyl or anhydride-functional styrene/p-alkylstyrene copolymer, epoxy resin and curing agent A low dielectric constant composition used in electric circuit boards is disclosed. The composition includes (a) 20-99.9 parts by weight of a functionalized syndiotactic styrene/para-alkystyrene copolymer having microfoaming when being cured; (b) 0.01-80 ... | 05/14/2002 |
| 6388008 | Crosslinking isoprene-isobutylene rubber with alkylphenol-formaldehyde resin, hydrazide and epoxy compound The present invention provides a method for crosslinking an isoprene-isobutylene rubber, which comprises adding, to 100 parts by weight of an isoprene-isobutylene rubber, 5 to 25 parts by weight of an alkylphenol-formaldehyde resin and 0.1 to 5 parts by w... | 05/14/2002 |
| 6372827 | Sealant composition, article including same, and method of using same A multi-layer article which may be provided in the form of a tape comprises a conformable, compressible, melt flow-resistant core layer having first and second major surfaces, a sealant layer on the first major surface of the core layer, and optionally a ... | 04/16/2002 |
| 6297344 | Heat-setting single-component LVA (low viscosity adhesive) system for bonding in the micro-range A composition comprises from 60-98 weight percent of a casting resin such as an epoxy resin, from 2-30 weight percent of an alcohol or sugar such as 3 (4), 8 (9)-bis(hydroxymethyl)tricyclo[5.2.1.02,6 ]decane, from 0.2 to 2.0 weight percent of a... | 10/02/2001 |
| 6258899 | Cleavable acetal-containing diepoxide and anhydride curing agent for removable epoxy compositions A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent or and an amine promoter.... | 07/10/2001 |
| 6255394 | Crosslinking isoprene-isobutylene rubber with alkylphenol-formaldehyde resin and hydrazide The present invention provides a method for crosslinking an isoprene-isobutylene rubber, which comprises adding, to 100 parts by weight of an isoprene-isobutylene rubber, 5 to 25 parts by weight of an alkylphenol-formaldehyde resin and 0.1 to 5 parts by w... | 07/03/2001 |
| 6197898 | Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent A process for preparing a polymer composition useful as a prepreg comprises (a) melt-mixing at least one thermoplastic polymer above the glass transition temperature or melt temperature of the thermoplastic polymer with either (i) an uncured epoxy resin o... | 03/06/2001 |
| 6147136 | Dental compositions based on ROMP oligomers and polymers The invention relates to dental compositions containing (a) 5 to 70 wt. %, relative to (a)+(b)+(d), of oligomers and/or polymers, (b) 0 to 95 wt. %, relative to (a)+(b)+(d), of fillers, (c) 0.1 to 3 wt. %, relative to (a), of at least one initiator or one initiator... | 11/14/2000 |
| 6136944 | Adhesive of epoxy resin, amine-terminated polyamide and polyamine The present invention relates to a flexible industrial adhesive composition which effectively bonds thermoplastic polymer substrates and substrates having low stiffness such as fabric, rubbers and asphaltic materials, to materials selected from metals, fa... | 10/24/2000 |
| 6037411 | Acoustic vibrational material of fiber reinforcement with epoxy resin and epoxy-reactive polybutadiene This invention provides an acoustic vibrational material containing various fibers as the reinforcement material and having the epoxy resin as the matrix resin, wherein the epoxy resin is modified by a polybutadiene base elastomer containing not less than... | 03/14/2000 |
| 5990204 | Crosslinking isoprene-isobutylene rubber with alkyphenol-formaldehyde and epoxy resins The present invention relates to a method for crosslinking an isoprene-isobutylene rubber with resins, and a crosslinked rubber product obtained by said method. According to the present invention, there are provided: a method for crosslinking an isoprene-... | 11/23/1999 |
| 5807910 | Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive An adhesive for a flexible printed circuit board and the method of preparing the same where the adhesive displays excellent migration inhibition, moisture adsorption resistance, and superior peeling strength, heat resistance, solvent resistance, chemical ... | 09/15/1998 |
| 5789482 | Epoxy resin with anhydride, toughener and active hydrogen-containing compound Epoxy resin compositions which contain a) at least one epoxy resin containing, on average, more than one 1,2-epoxy group per molecule, b) an anhydride hardener for the epoxy resin a), c) a toughener, and d) a compound containing two active hydrogen atoms which is c... | 08/04/1998 |
| 5756600 | Urethane-modified epoxy vinyl ester resin A composition useful as a sheet or bulk molding compound comprises a urethane-modified vinyl ester resin (A), or acid-addition vinyl ester resn (A') obtained by reacting the hydroxyl groups in (A) with a polybasic acid anhydride (B), and a double bond(s)-... | 05/26/1998 |
| 5750590 | Polymerizable material Polymerizable materials that contain "oxetanes" (trimethylene oxides) shrink only slightly when polymerized in the presence of a cationic polymerization catalyst. The materials are particular appropriate for coatings and for medical and dental purposes.... | 05/12/1998 |
| 5747557 | Method of manufacturing a castable epoxy resin composition comprising acrylic rubber particles predispersed in an anhydride hardener A method of manufacturing a castable epoxy resin composition which comprises as components an epoxy resin, an acid anhydride in an amount sufficient for hardening, an inorganic filler, and acrylic rubber particles having a thermoplastic resin skin, said t... | 05/05/1998 |
| 5719206 | Aqueous coating compositions An aqueous coating composition includes: an inorganic particulate substance whose surface is modified with a silane coupling agent having at least one functional group selected from a group consisting of vinyl group, (meth)acryloyl group, epoxy group, and... | 02/17/1998 |
| 5468461 | Anticorrosive primer composition An anticorrosive primer composition comprises (1) 100 parts by weight of an epoxy resin having a number-average molecular weight of from 500 to 10,000, (2) from 10 to 60 parts by weight of an aromatic polyamine containing from 2% to 30% by weight, based o... | 11/21/1995 |
| 5432211 | Lubricating paint A lubricating paint including a resin mix, a lubricant additive and silica. The resin mix consists of a urethane resin with molecular weight of over 3,000 and an epoxy resin, with the solids of the urethane resin accounting for 50-97 wt % of the solids of... | 07/11/1995 |
| 5342554 | Vinyl-terminated polyesters and polycarbonates for flexibilizing and improving the toughness of compositions from unsaturated polyesters and fiber reinforced plastics made from them Vinyl-terminated polyesters and vinyl-terminated aliphatic polycarbonates are described which improve the flexibility and elongation at failure of cured samples of unsaturated polyesters or vinyl ester resins both at room temperature and at high temperatu... | 08/30/1994 |
| 5308894 | Polycarbonate/aromatic polyester blends containing an olefinic modifier A polycarbonate blend of good impact and flexural strength, good weldline properties, and good solvent resistance prepared by admixing with polycarbonate an aromatic polyester, an olefinic epoxide-containing modifier, and a thermoplastic elastomer. Option... | 05/03/1994 |
| 5212217 | Artificial marble from reactive thermoplastic, monomer and anhydride This invention is directed to a setting resin composition comprising (A) a radically polymerizable monomer, (B) a thermoplastic resin soluble or dispersible in said monomer (A), (C) an epoxy resin, (D) at least one polyfunctional carboxylic acid compound ... | 05/18/1993 |
| 5114991 | Paper felts or mats A paper felt or mat is made from an aqueous slurry or dispersion of kraft wood pulp, a number of compounding ingredients such as finely divided inorganic pigments and fillers, a binder, an anionic latex of a copolymer wherein the core of the copolymer com... | 05/19/1992 |
| 5019608 | Rubber-modified epoxy adhesive compositions An epoxy adhesive composition for the bonding of SMC to metal substrates and other SMC parts having an improved cure rate and hence rate of initial lap shear strength development has been discovered. The adhesive composition comprises an epoxy resin and a... | 05/28/1991 |
| 4966928 | Epoxy resin based powder coating composition An epoxy resin based powder coating composition is disclosed, comprising an epoxy resin, a reaction product of dicyclopentadiene and maleic anhydride, and a cure accelerator. The coating composition may further comprise an aromatic acid anhydride based cu... | 10/30/1990 |
