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| Number | Title | Issue Date |
| 7820742 | Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at 40 to 80 degrees C Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at... | 10/26/2010 |
| 7501461 | Composition of epoxy resin, aliphatic amine curing agent and halogenated amine One aspect of the current invention is a halogen containing epoxy composition and a method of producing the same. A functional halogen group, fluorine in one case, is incorporated into an epoxy coating by using a functionalized amine curing agent in small amounts. F... | 03/10/2009 |
| 7442729 | Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reli... | 10/28/2008 |
| 7432334 | Silicone-modified single-component casting compound A casting compound based on a resin which cures by a chemical reaction. The casting compound is suitable for insulation of electric components and contains an epoxy resin component, a silicone-containing component, a filler, and a thermal initiator. This casting com... | 10/07/2008 |
| 7429800 | Molding composition and method, and molded article A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica... | 09/30/2008 |
| 7405246 | Cure system, adhesive system, electronic device A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive syste... | 07/29/2008 |
| 7390571 | Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to... | 06/24/2008 |
| 7368170 | Viscous chemical anchoring adhesive A chemical anchoring adhesive includes a first part having a viscosity of about 200,000 to about 4,000,000 centipoise and a second part having a viscosity of about 200,000 to about 4,000,000 centipoise. The chemical anchoring adhesive can be in the form of a slug or... | 05/06/2008 |
| 7362943 | Polymeric photonic crystals with co-continuous phases An optical element is formed by co-extruding to have an arrangement of polymer scattering fibers within a polymer matrix. The scattering fibers lie substantially parallel to a first axis. The scattering fibers are arranged at positions across the cross-section of th... | 04/22/2008 |
| 7354978 | Semiconductor encapsulant of epoxy resin, phenolic resin and triazole compound One of major objects of the invention is to provide an epoxy resin composition and a semiconductor device exhibiting good soldering resistance when being formed on a non-copper frame. Thus, this invention provides an epoxy resin composition for encapsulating a semic... | 04/08/2008 |
| 7356229 | Reflective polarizers containing polymer fibers A polarizer is formed with an arrangement of polymer fibers substantially parallel within a polymer matrix. The polymer fibers are formed of at least first and second polymer materials. At least one of the polymer matrix and the first and second polymer materials is... | 04/08/2008 |
| 7354499 | Method for making a lubricating fast setting epoxy composition A method for making a lubricating fast-setting epoxy compound comprising: mixing under vacuum dispersion a first micro-crystalline filler, a first talc, and a titanium oxide into a hardenable epoxide containing liquid forming an epoxy base. A second micro-crystallin... | 04/08/2008 |
| 7329711 | Modified epoxy resins The present invention relates to molding compositions comprising A) from 40 to 99% by weight of at least one epoxy resin, B) from 1 to 60% by weight of at least one polyarylene ether sulfone containing side- or end-groups selected from the ... | 02/12/2008 |
| 7311972 | Filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 12/25/2007 |
| 7312104 | Resin composition for encapsulating semiconductor device A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide s... | 12/25/2007 |
| 7307128 | Epoxy compound, preparation method thereof, and use thereof The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanica... | 12/11/2007 |
| 7304120 | Epoxy compound, preparation method thereof, and use thereof An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 eac... | 12/04/2007 |
| 7304102 | Process for making encapsulant for opto-electronic devices An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of r... | 12/04/2007 |
| 7285602 | Granular epoxy resin, production method thereof, and granular epoxy resin package A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less ... | 10/23/2007 |
| 7279223 | Underfill composition and packaged solid state device An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized c... | 10/09/2007 |
| 7276563 | Polyphenylene ether oligomer compound, derivatives thereof and use thereof The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition ... | 10/02/2007 |
| 7268191 | Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains th... | 09/11/2007 |
| 7265167 | Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well a... | 09/04/2007 |
| 7255925 | Thermosetting resin composition for high speed transmission circuit board The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and ... | 08/14/2007 |
| 7247683 | Low voiding no flow fluxing underfill for electronic devices A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfil... | 07/24/2007 |
| 7214421 | Optical display elements based on aqueous polymer dispersions Optical display elements comprising a layer made from a deformable material (matrix) and from discrete polymer particles whose distribution in the matrix follows a defined spatial lattice structure. ... | 05/08/2007 |
| 7192997 | Encapsulant composition and electronic package utilizing same A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexi... | 03/20/2007 |
| 7169833 | Liquid epoxy resin composition and semiconductor device A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising 5–100% by weight of a specific aromatic amine compound having a purity of at least 99%, (C) an inorganic filler, and (D) an ester organic solvent ha... | 01/30/2007 |
| 7163973 | Composition of bulk filler and epoxy-clay nanocomposite A molding composition or encapsulant for an electronic component and its method of preparation provides reduced moisture uptake without undue swelling and comprises melt-blending an epoxy resin, hardener and clay, cooling, adding a catalyst to form an epoxy-clay nan... | 01/16/2007 |
| 7160961 | Melt coating method using a polyester resin composition The invention relates to cast resins containing A) at least one solid unsaturated polyester and B) at least one oligomer and/or polymer cross-linking agent that can be copolymerised therewith, said cross-linking agent having at least one terminal and/or lateral prop... | 01/09/2007 |
| 7147921 | Anti-fouling coatings containing silica-coated copper Anti-fouling compositions are disclosed. The compositions comprise a film-forming resin and an effective amount of silica coated copper. Methods for using the compositions are also disclosed, as are substrates coated with the compositions. The coatings find particul... | 12/12/2006 |
| 7129283 | Binders containing an epoxy resin, an ester of a fatty acid, and a fluorinated acid This invention relates to foundry binder systems, which cure in the presence of sulfur dioxide and an oxidizing agent, comprising (a) an epoxy resin; (b) an ester of a fatty acid; (c) a fluorinated acid, preferably hydrofluoric acid; (d) an effective amount of a oxi... | 10/31/2006 |
| 7122583 | Cold-box binders containing an epoxy resin, acrylate, and certain akyl esters This invention relates to foundry binder systems, which will cure in the presence of sulfur dioxide and a free radical initiator, comprising (a) an epoxy resin; (b) an acrylate; (c) an alkyl ester of a fatty acid, wherein the alkyl group of the ester is an aliphatic... | 10/17/2006 |
| 7098276 | Flame-retardant epoxy resin composition and semiconductor device made using the same An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and... | 08/29/2006 |
| 7094844 | Liquid epoxy resin composition and semiconductor device A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is useful for semiconductor encapsulation. The composition is adherent to the... | 08/22/2006 |
| 7094843 | Epoxy compositions having improved shelf life and articles containing the same Epoxy systems having improved shelf life are disclosed. The epoxy systems are suitable for use in a number of applications, including as an adhesive or as a sealant (e.g., as a component in a melt-sealing tape). Methods of making and using the epoxy systems are also... | 08/22/2006 |
| 7095125 | Semiconductor encapsulating epoxy resin composition and semiconductor device A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtai... | 08/22/2006 |
| 7087664 | Resin film and multilayer printed wiring board using thereof A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section o... | 08/08/2006 |
| 7081487 | Cold-box binders containing an epoxy resin and ester of a fatty acid This invention relates to foundry binder systems, which cure in the presence of sulfur dioxide and an oxidizing agent, comprising (a) an epoxy resin; (b) an ester of a fatty acid; (c) an effective amount of a oxidizing agent, and (d) no ethylenically unsaturated mon... | 07/25/2006 |
| 7064157 | Flame retardant resin and flame retardant composition containing the same The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: | 06/20/2006 |
