Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Number | Title | Issue Date |
| 8163819 | Adhesive compositions, micro-fluid ejection devices and methods for attaching micro-fluid ejection heads Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decr... | 04/24/2012 |
| 8076395 | Low temperature curable epoxy compositions containing urea curatives A heat curable epoxy composition comprising the contact product of an epoxy resin, an epoxy curing agent and an accelerator for the epoxy curing agent, the curing agent or the accelerator comprising a urea compound which is the reaction product of an isocyanate and ... | 12/13/2011 |
| 7923488 | Epoxy compositions An epoxy composition for applications such as one-part adhesives, coatings, prepreg and molding compounds that includes leuco dyes, particularly those comprising a N,N-dialkylamino-, N,N-diarylamino-, N-alkyl-N-arylamino-, N-alkylamino- or N-arylamino- functional gr... | 04/12/2011 |
| 7442434 | Epoxy resin composition A solvent-free epoxy resin matrix composition comprising: (a) a liquid epoxy resin or a liquid mixture of epoxy resins, (b) a benzylidenamine compound, (c) an aliphatic or cycloaliphatic primary monoamine and/or disecondary diamine; and (d) a catalytically curing te... | 10/28/2008 |
| 7405247 | Conductive adhesive composition A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. ... | 07/29/2008 |
| 7390571 | Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to... | 06/24/2008 |
| 7323234 | Curable alkanolamine containing epoxy powder coating composition The present invention provides a curable alkanolamine containing epoxy powder coating composition comprising at least one epoxy resin, at least one alkanolamine, a curing agent in an amount effective to cure the coating and optionally at least one zinc borate compou... | 01/29/2008 |
| 7312260 | Epoxide adducts and their salts as dispersants The invention relates to addition compounds suitable for use as wetting agents and dispersants and obtainable by reacting monofunctional or polyfunctional aromatic epoxides with polyoxyalkylenemonoamines having a number-average molecular weight of >400 g/mol, one pr... | 12/25/2007 |
| 7271224 | Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional ... | 09/18/2007 |
| 7255925 | Thermosetting resin composition for high speed transmission circuit board The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and ... | 08/14/2007 |
| 7169474 | Epoxy resin composition and semiconductor device An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an effective flux component selected from among abietic acid, palustric acid, levopimaric acid and dihydroabietic acid is low volatile and exhibits impr... | 01/30/2007 |
| 7090895 | Flame retardant epoxy resin composition, semiconductor encapsulating material using same, and resin encapsulated semiconductor device An epoxy resin composition is provided, which includes (A) an epoxy resin with at least 2 epoxy groups within each molecule, (B) a curing agent, and (C) a foaming agent. This composition displays excellent flame retardancy and reliability and is suitable for use as ... | 08/15/2006 |
| 7084194 | Halogen-free resin composition A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): | 08/01/2006 |
| 7074254 | Binder for powder metallurgy, mixed powder for powder metallurgy and method for producing same The invention aims to provide a binder for powder metallurgy, the binder containing an epoxy resin which is liquid at room temperature and a curing agent having at least one functional group selected from the group consisting of amino, mercapto and carboxyl groups. ... | 07/11/2006 |
| 7064157 | Flame retardant resin and flame retardant composition containing the same The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: | 06/20/2006 |
| 7053138 | Flame-proofing agents Compounds of formula (I) or (II), wherein R1 is C1–C18alkyl; C5–C12cycloalkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alk... | 05/30/2006 |
| 7047633 | Method of using pre-applied underfill encapsulant The invention relates to a method for utilizing one or more B-stageable or pre-formed underfill encapsulant compositions in the application of electronic components, most commonly chip scale packages (CSP's) to substrates. One such composition comprises a thermoplas... | 05/23/2006 |
| 7041399 | Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to... | 05/09/2006 |
| 7008986 | Stabilized thermoplastic moulding materials The invention relates to thermoplastic moulding materials containing A) 29 to (100 wt. % minus 1 ppb) of at least one thermoplastic polymer. B) 1 ppb to 1 wt. % or at least one polyethyleneimine homopolymer of copolymer, as well as C) 0 to 70 wt. % of other additive... | 03/07/2006 |
| 7005233 | Photoresist formulation for high aspect ratio plating SU-8 photoresist compositions are modified to improve their adhesion properties by adding 1% to 6% of an adhesion promoter selected from the group consisting of glycidoxypropanetrimethoxysilane, mercaptopropyltrimethoxysilane, and aminopropyltrimethoxysilane. SU-8 p... | 02/28/2006 |
| 7001938 | Epoxy resin curing compositions and resin compositions including same Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include a primary amino alcohol physically blended therewith. Alternatively, the invention relates to curing agent... | 02/21/2006 |
| 6946503 | Amine blend accelerators for polyoxyalkylenepolyamine cured epoxy resins Provided herein are amine blends which may be used in place of N-aminoethyl piperazine as accelerator in the curing reaction of epoxy resins. ... | 09/20/2005 |
| 6936646 | Flame-retardant molding compositions A flame-retardant molding composition that includes an epoxy resin, melamine cyanurate, and one or more hydrate metal salts capable of liberating water when heated. The hydrated metal salt may include one or more compounds selected from metal borate salts, Group IIB... | 08/30/2005 |
| 6924000 | Environmentally preferred high solids, low viscosity flock adhesives An environmentally preferred flock adhesive composition containing low molecular weight prepolymers of isocyanate terminated polyether and/or polyalkadiene polyols is disclosed. The prepolymers are free of residual volatile isocyanate ( | 08/02/2005 |
| 6911237 | Hydrophilic polyurethanes, preparation thereof and fiber sizes containing the same Water-soluble polyurethanes prepared by reacting a polyisocyanate and a polyalkylene oxide polyol at a molar ratio sufficient to form an isocyanate-terminated polymer, and reacting the isocyanate-terminated polymer with an epoxy alcohol to form a water-soluble, epox... | 06/28/2005 |
| 6899924 | Coating compositions and processes An undercoat composition comprises a film-forming synthetic resin and contains a non-volatile acidic aromatic polar organic compound in free acid or salt form, which compound facilitates the removal by a stripping composition of a top coat paint which is subsequentl... | 05/31/2005 |
| 6843939 | UV stabilizing additive composition This invention relates to an UV stabilizing additive composition comprising an ortho-hydroxy triazine compound, a hindered hydroxybenzoate compound and optionally a hindered amine compound. This additive composition may be used to stabilize materials from UV radiati... | 01/18/2005 |
| 6831113 | Amine-modified epoxy resin reacted in presence of latent hardener A method for making a one-component epoxy resin system comprises reacting (A) an epoxy resin and (B) an amine solidifying system present in insufficient quantities to cause gelation in the presence of a latent hardener (C) and an expanding agent (E), each of which r... | 12/14/2004 |
| 6809162 | Solid state device with encapsulant of cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride and boron catalyst Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least ... | 10/26/2004 |
| 6774193 | Stabilized unsaturated polymer resin compositions and methods of using the same Stabilized pre-promoted unsaturated polymer resin systems that include a tertiary aromatic amine cure promoter. The stabilized curable resins systems can include a vinyl ester resin. ... | 08/10/2004 |
| 6774160 | Curable epoxy resin compositions and the cured residues thereof A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixt... | 08/10/2004 |
| 6770691 | Curable epoxy resin compositions and the cured residues thereof A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixt... | 08/03/2004 |
| 6767639 | Cured epoxy resin compositions with brominated triazine flame retardants, and laminates comprising them A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixt... | 07/27/2004 |
| 6767941 | Halogen-free flame-retardant composition A halogen-free, flame-retardant composition includes (1) organic phosphorus compound (A) and (1′) melamine or a compound derived from melamine (B); or (2) a melamine-phosphorus compound (AB). The composition also includes and olefin polymer and from 0.1-30 wt % ba... | 07/27/2004 |
| 6713536 | Removable imbibition composition of photochromic compound and epoxy and polyol kinetic enhancing additives Described are imbibition compositions that incorporate kinetic enhancing additive(s) into photochromic polymeric host material. Kinetic enhancing additives include organic polyol(s), epoxy-containing compound(s) or a mixture thereof that improves the performance of ... | 03/30/2004 |
| 6635721 | Powder coating of semicrystalline and amorphous polyesters with crosslinker Thermosetting powder compositions comprising as binder a mixture of polyesters containing carboxyl groups and of a crosslinking agent having functional groups capable of reacting with the carboxyl groups. The polyesters comprise: (a) a semicrystalline poly... | 10/21/2003 |
| 6617400 | Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, a... | 09/09/2003 |
| 6617401 | Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D... | 09/09/2003 |
| 6528594 | Flowable glanulates A process for the manufacture of a flowable granulate by means of spray granulation, which comprises using as starting material a formulation in liquid form comprising (a) a substance or a mixture of substances that is in the form of a waxy or cohesive so... | 03/04/2003 |
| 6525113 | Process for producing cross-linked polyallylamine hydrochloride The present invention relates to a process for preparing a cross-linked pollyallylamine hydrochloride. The process involves mixing polyallylamine hydrochloride, water, a hydroxide or alkoxide, and a water-miscible organic solvent or co-solvents, to a reac... | 02/25/2003 |
