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| Number | Title | Issue Date |
| 7179853 | Resin dispersion for cationic electrodeposition and cationic electrodeposition coating composition including the same Disclosed are a resin dispersion and a cationic electrodeposition coating composition including the same, in which the dried coating film of the electrodeposition paint is lead-free and has an epoxy-acrylic double-layered structure for displaying excellent propertie... | 02/20/2007 |
| 6942922 | Cationic paint composition The present invention provides a cationic paint composition containing, as a vehicle component, a xylene-formaldehyde resin-modified amino group-containing epoxy resin obtained by reacting an epoxy resin having an epoxy equivalent of 180 to 2,500 with an alkyl pheno... | 09/13/2005 |
| 6830825 | Epoxy resin composition and semiconductor device An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for mo... | 12/14/2004 |
| 6791839 | Thermal interface materials and methods for their preparation and use A composition that can be used to prepare a thermal interface material includes: A) a curable matrix having a curing temperature, B) a metal filler having a low melting point, optionally C) a spacer, and optionally D) a conductive filler. The temperature at which co... | 09/14/2004 |
| 6627684 | Dielectric compositions having two steps of laminating temperatures The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, c... | 09/30/2003 |
| 6617030 | Cationic electro-coating bath composition This invention provides, at a low cost, a low-pollution type cationic electro-coating bath composition which contains neither lead nor chromium, and which comprises cationic electrodeposition paint and, contained therein, a bismuth oxide paste, the amount... | 09/09/2003 |
| 6475641 | Connecting material and connection structure A connecting material that can be used in the mounting of semiconductor devices on a circuit substrate for semiconductor devices, contains the following components A to C: (A) an epoxy resin; (B) a phenol compound having two or more phenolic hydroxyl groups; a... | 11/05/2002 |
| 6465541 | Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same Polymerizable composition that include: (a) a cationically active functional group; (b) an initiation system capable of initiating cationic polymerization of the cationically active functional group; and (c) a filler composition that includes various radi... | 10/15/2002 |
| 6440568 | Plastic lenses and primer composition used for coating the same A plastic lens having a primer layer made from a polyurethane resin obtained through a reaction between a polyester polyol containing isophthalic acid as a main component and a polyisocyanate. A plastic lens having excellent resistance to scratch and impact re... | 08/27/2002 |
| 6322620 | Conductive ink composition A thermoset conductive ink for use in through hole interconnections or similar electric and electronic applications to provide stable electrical connections. The conductive ink of this invention comprises a thermal curable resin system having an admixing ... | 11/27/2001 |
| 6306926 | Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same Polymerizable compositions that include: (a) a cationically active functional group; (b) an initiation system capable of initiating cationic polymerization of the cationically active functional group; and (c) a filler composition that includes various rad... | 10/23/2001 |
| 6288145 | High-melting polyamide resin compositions and molded articles thereof High-melting polyamide resin compositions having improved mechanical properties, and molded articles for electrical and electronic components made using the same. The high-melting polyamide resin compositions comprise an aromatic polyamide having a meltin... | 09/11/2001 |
| 6284818 | Encapsulant composition and electronic device In the present invention, provided are i) an encapsulant composition comprising an epoxy resin, a curing agent, an inorganic filler, an adduct of triphenylphosphine with benzoquinone, and a hydrous bismuth nitrate oxide; the inorganic filler being mixed i... | 09/04/2001 |
| 6228500 | Adhesive composition and precursor thereof An adhesive composition, which is useful as an adhesive for FPC protective film and is particularly superior in dimensional stability and adhesion is described herein. The adhesive composition comprises a resin component containing an phenoxy resin, an ep... | 05/08/2001 |
| 6005024 | Phosphorescent epoxy overlay The present invention pertains to novel durable, tough, transparent, luminescent overlay compositions, useful for highlighting and/or illuminating and preserving surfaces and markings thereupon, such as roadways/highways, pedestrian passageways, airport r... | 12/21/1999 |
| 5936013 | Process for the preparation of formulations comprising bismuth salts, and their use as catalyst component in cathodic electrodeposition coating materials The invention pertains to a method for producing preparations containing bismuth salts, wherein bismuth oxide is reacted in a specific way with lactic acid and the resulting mixture of bismuthyl lactate and bismuth lactate is dispersed in a binder. These ... | 08/10/1999 |
| 5876210 | Dental polymer product The invention concerns a process for preparing a polymer composition, that is free-radical/photochemical and thermal curing epoxide-methacrylate and/or isocyanate-methacrylate adhesives in broadest terms, dental/medical adhesives, and dental restoratives.... | 03/02/1999 |
| 5874491 | Phosphorescent highway paint composition The present invention relates to novel compositions useful, for example, in marking road surfaces. The compositions contain a moisture sensitive luminescent substance (for example a phosphorescent substance having increased brightness and longer lasting a... | 02/23/1999 |
| 5859095 | Epoxy corrosion-inhibiting coating composition This invention relates to aqueous epoxy resin-containing compositions and to such compositions which are particularly useful for depositing coatings on metalic substrates in order to protect substrates against corrosion. The aqueous compositions generally... | 01/12/1999 |
| 5624978 | Conductive, internally lubricated barrier coating for metal This invention relates to aqueous epoxy resin-containing compositions useful for depositing coatings on metallic substrates in order to protect substrates against corrosion. The aqueous compositions generally comprise (A) an organic resin component consis... | 04/29/1997 |
| 5525651 | Blends of polycarbonate and chlorinated polyethylene A blend of polycarbonate and chlorinated polyethylene which has a desirable balance of impact and ignition resistance properties.... | 06/11/1996 |
| 5476716 | Flame retardant epoxy molding compound, method and encapsulated device A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing ... | 12/19/1995 |
| 5441657 | Vibration-isolating composite material A vibration-isolating composite material consists essentially of powder of an inorganic elastic material and a synthetic polymer mixed thereto. The inorganic elastic material is at least one material selected from the group consisting of NdP5 O... | 08/15/1995 |
| 5424341 | Blends of polycarbonate and chlorinated polyethylene A blend of polycarbonate and chlorinated polyethylene which has a desirable balance of impact and ignition resistance properties.... | 06/13/1995 |
| 5420178 | Flame-retardant epoxy molding compound A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing ... | 05/30/1995 |
| 5413861 | Semiconductor device encapsulated with a flame retardant epoxy molding compound A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing ... | 05/09/1995 |
| 5338781 | Flame retardant epoxy molding compound for encapsulating a semiconductor device An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound c... | 08/16/1994 |
| 5284938 | Polysiloxane modified thermoset compositions A polysiloxane-modified epoxy-based encapsulation composition comprising an epoxy resin, a curing agent for the epoxy resin, a polylactone-polysiloxane block copolymer, and a filler is described. The powder molding compositions provide a low internal stre... | 02/08/1994 |
| 5177132 | Flame retardant resin composition Disclosed is a polyalkylene terephthalate type flame retardant resin composition comprising: (A) 100 parts by weight of a polyalkylene terephthalate resin, (B) 30 to 250 parts by weight of a filler, (C) 5 to 50 parts by weight of an organic halogen compound having ... | 01/05/1993 |
| 5104604 | Flame retardant epoxy molding compound, method and encapsulated device method of encapsulating a semiconductor device with a flame retardant epoxy molding compound A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing ... | 04/14/1992 |
| 5073580 | Epoxy resin composition for use in sealing semiconductors An epoxy resin composition for use in sealing semiconductors, having enhanced moisture resistance reliability is disclosed, which comprises an epoxy resin and an oxyacid bismuth oxyhydroxide represented by the following formula (1): Bix Oy... | 12/17/1991 |
| 5037898 | Polysiloxane-polylactone block copolymer modified thermostat compositions A polysiloxane-modified epoxy-based encapsulation composition comprising an epoxy resin, a curing agent for the epoxy resin, a polylactone-polysiloxane block copolymer, and a filler is described. The powder molding compositions provide a low internal stre... | 08/06/1991 |
| 5021473 | Process for enhancing the electrostatic chargeability of powder coatings or powders, and the use thereof for surface-coating solid objects Process for enhancing the electrostatic chargeability of powder coatings or powders, and the use thereof for surface coating solid objects. Process for enhancing the electrostatic chargeability of powder coatings or powders intended for the surface-coating of ... | 06/04/1991 |
| 4985478 | Thermosetting resin composition Disclosed is a thermosetting resin composition comprising (a) a preliminary reaction product between a polyamino compound and an unsaturated bismaleimide compound, (b) an epoxy group-containing vinyl compound, (b') a vinyl group-free aliphatic or aromatic... | 01/15/1991 |
| 4971727 | Conductive primer for plastics or conductive primer surfacer paint and coated plastics molded products An electrically conductive coating composition is useful for a primer or a surfacer paint for a plastic article, in particular one having a small polarity on the surface, and comprises (A) a polyurethane, (B) a spiro-ortho-ester resin of the ring-opening ... | 11/20/1990 |
| 4837254 | Poly(1,4-cyclohexylene dimethylene terephthalate) molding compositions Disclosed is a polyester molding composition containing a reinforcing material and a halogenated flame retardant, the polyester containing repeat units from terephthalic acid and 1,4-cyclohexane-dimethanol, the composition further comprising an additive s... | 06/06/1989 |
| 4788091 | Flame retardant embossing film A flame retardant, curing adhesive film having improved OSU heat release properties is provided. The film contains decabromophenylene oxide and antimony trioxide as a flame retardant agent.... | 11/29/1988 |
| 4732921 | Flame retardant polybutylene terephthalate A flame-resistant polybutylene terephthalate molding composition has vastly improved fatigue strength and improved melt flow by incorporating therein a halogenated epoxy flame retardant represented by the general formula: ##STR1## wherein an n is the... | 03/22/1988 |
| 4716184 | Epoxy resin encapsulating composition with enhanced moisture resistance and method for producing the same An epoxy resin encapsulating composition for semiconductor packages consisting essentially of an epoxy resin adduct of epichlorohydrin and an aromatic hydroxyl-containing compound, and an inorganic ion-exchange solid material admixed with the epoxy resin ... | 12/29/1987 |
| 4710796 | Resin encapsulation type semiconductor device by use of epoxy resin composition A resin encapsulation type semiconductor device having a semiconductor element and a resinous encapsulating material for encapsulating said semiconductor element therein, said resinous encapsulating material comprising a cured product of an epoxy resin co... | 12/01/1987 |
