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| Number | Title | Issue Date |
| 8178599 | Composition of epoxy resin, spherical alumina, ultrafine silica polyorganosiloxane and phenolic resin The object of the present invention is to provide an epoxy resin composition which is excellent in flash characteristics and thermal conductivity, and gives an area mounting type semiconductor apparatus having little warpage and excellent temperature cycle propertie... | 05/15/2012 |
| 8084520 | Epoxy resin composition and semiconductor device An epoxy resin composition comprising (A) an epoxy resin (B) a phenol resin, (C) a curing accelerator, (D) silica, and (E) alumina and/or aluminum hydroxide, wherein the amount of aluminum to the total amount of the epoxy resin composition is 0.25-5 wt % and 70 wt %... | 12/27/2011 |
| 7999016 | Semiconductor encapsulating epoxy resin composition and semiconductor device Epoxy resin compositions comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a rare earth oxide, and optionally (E) a phosphazene compound cure into products having improved heat resistance and moisture-proof reliability an... | 08/16/2011 |
| 7851520 | Thermosetting epoxy resin composition The thermosetting epoxy resin composition of the present invention includes an aluminum chelate/silanol curing catalyst system, an epoxy resin, and an anion-trapping agent. The anion-trapping agent is preferably an aromatic phenol derivative or an acid anhydride. Ex... | 12/14/2010 |
| 7622515 | Composition of epoxy resin, phenolic resin, silicone compound, spherical alumina and ultrafine silica The object of the present invention is to provide an epoxy resin composition which is excellent in flash characteristics and thermal conductivity, and gives an area mounting type semiconductor apparatus having little warpage and excellent temperature cycle propertie... | 11/24/2009 |
| 7524893 | Conductive adhesive The present invention provides a conductive adhesive that is applicable as means for forming conductive junction to process for surface mounting of electronic parts for vehicle loading and process for the manufacture of the electronic parts per se for the purpose of... | 04/28/2009 |
| 7482396 | Storable moldable material and flat articles produced from renewable raw materials The present invention relates to a method for producing a flat article comprising a material that contains the products of several reactions. The method comprises the following steps: carrying out a pre-cross-linking of a mixture comprising an epoxydation product of... | 01/27/2009 |
| 7439285 | Liquid thermosetting ink Liquid thermosetting ink for ink-jet applications includes at least a resin, at least one solid latent curing agent having a maximal particle size of less than 2 microns and an inert filler having fine particles. The single-pack or two-pack ink has a viscosity lower... | 10/21/2008 |
| 7432603 | Semiconductor encapsulating epoxy resin composition and semiconductor device In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at least one of which is a metal element of Group II in the Periodic Tab... | 10/07/2008 |
| 7427652 | Composition of epoxy resin, OH-terminated phosphonate oligomer and inorganic filler An epoxy resin composition is disclosed that comprises an epoxy resin, a reactive phosphonate curing agent, an inorganic filler, whose presence allows for reduced amounts of phosphonate as compared to a composition not containing the filler, an optional polybenzoxaz... | 09/23/2008 |
| 7405247 | Conductive adhesive composition A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. ... | 07/29/2008 |
| 7405246 | Cure system, adhesive system, electronic device A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive syste... | 07/29/2008 |
| 7390571 | Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to... | 06/24/2008 |
| 7387718 | Cationic electrodeposition coating composition and method of preparing the same In a cationic electrodeposition coating composition and a method of preparing the cationic electrodeposition coating composition, a cationic electrodeposition coating composition is prepared by dispersing a cationic electrodeposition resin in an aqueous medium conta... | 06/17/2008 |
| 7354499 | Method for making a lubricating fast setting epoxy composition A method for making a lubricating fast-setting epoxy compound comprising: mixing under vacuum dispersion a first micro-crystalline filler, a first talc, and a titanium oxide into a hardenable epoxide containing liquid forming an epoxy base. A second micro-crystallin... | 04/08/2008 |
| 7354978 | Semiconductor encapsulant of epoxy resin, phenolic resin and triazole compound One of major objects of the invention is to provide an epoxy resin composition and a semiconductor device exhibiting good soldering resistance when being formed on a non-copper frame. Thus, this invention provides an epoxy resin composition for encapsulating a semic... | 04/08/2008 |
| 7350571 | Methods of preparing and using coated particulates The present invention involves methods of preparing coated particulates and using such coated particulates in subterranean applications such as production enhancement and sand control. One embodiment of the present invention provides a method of preparing coated par... | 04/01/2008 |
| 7348370 | Metal oxides and hydroxides as corrosion inhibitor pigments for a chromate-free corrosion resistant epoxy primer A corrosion resistant epoxy primer comprises a epoxy resin, a curing agent, and a non-chromate containing corrosion-inhibiting pigment. ... | 03/25/2008 |
| 7348061 | Slip-resistant coatings and substrates coated therewith A slip-resistant coating composition comprising (i) a binder comprising a polyepoxide and a polyamine; (ii) a micaceous pigment selected from the group consisting of mica and micaceous iron oxide and blends thereof... | 03/25/2008 |
| 7334635 | Methods for fracturing subterranean wells A method of forming a propped fracture comprising: providing a fracture having a far-well bore area and a near-well bore area; placing first proppant particulates at least partially coated with an adhesive substance; placing a portion of second proppant particulates... | 02/26/2008 |
| 7334636 | Methods of creating high-porosity propped fractures using reticulated foam One embodiment of the prevent invention provides a method of creating a high porosity propped fracture comprising creating a slurry comprising a treatment fluid, proppant particulates, pieces of reticulated foam having cells, and an adhesive substance such that the ... | 02/26/2008 |
| 7323234 | Curable alkanolamine containing epoxy powder coating composition The present invention provides a curable alkanolamine containing epoxy powder coating composition comprising at least one epoxy resin, at least one alkanolamine, a curing agent in an amount effective to cure the coating and optionally at least one zinc borate compou... | 01/29/2008 |
| 7318473 | Methods relating to maintaining the structural integrity of deviated well bores Methods of enhancing at least partially the structural integrity of a longitudinal portion of a deviated well bore are provided. The methods include providing a gravel matrix composition; providing a longitudinal portion of a deviated well bore; and placing a suffic... | 01/15/2008 |
| 7318474 | Methods and compositions for controlling formation fines and reducing proppant flow-back Provided herein are methods for controlling the migration of particulates within a portion of a subterranean formation that comprise aqueous tackifying treatment fluids, curable resin compositions, and/or noncurable resin compositions. ... | 01/15/2008 |
| 7312104 | Resin composition for encapsulating semiconductor device A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide s... | 12/25/2007 |
| 7312261 | Thermal interface adhesive and rework A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved metho... | 12/25/2007 |
| 7307128 | Epoxy compound, preparation method thereof, and use thereof The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanica... | 12/11/2007 |
| 7304500 | Programmable logic module and upgrade method thereof A programmable logic module. In the programmable logic module, a first printed circuit board has a socket and a downloading unit. A field programmable gate array (FPGA) is disposed on the first printed circuit board. A nonvolatile memory stores program codes for pro... | 12/04/2007 |
| 7304120 | Epoxy compound, preparation method thereof, and use thereof An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 eac... | 12/04/2007 |
| 7299875 | Methods for controlling particulate migration Many methods are provided including methods of stabilizing a portion of a subterranean formation or reducing the production of particulates from a portion of a subterranean formation comprising contacting the portion of the subterranean formation with a pre-flush fl... | 11/27/2007 |
| 7297406 | Lead-free electrodeposition coating composition and coated article The present invention relates to a cationic electrodeposition coating composition substantially free of lead compounds, which is excellent in curability and can be finish-coated with a splendid appearance, and an article coated with the composition. The invention pr... | 11/20/2007 |
| 7291684 | Resin composition for encapsulating semiconductor chip and semiconductor device therewith An epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, a resin composition is disclosed for encapsulating a semiconductor chip containing a phenol aralkyl type epoxy resin cont... | 11/06/2007 |
| 7281581 | Methods of hydraulic fracturing and of propping fractures in subterranean formations A method of propping at least one fracture in a subterranean formation, that comprises forming a plurality of proppant aggregates, each proppant aggregate comprising a binding fluid and a filler material, and introducing the plurality of proppant aggregates into the... | 10/16/2007 |
| 7273099 | Methods of stimulating a subterranean formation comprising multiple production intervals A method of stimulating a production interval adjacent a well bore having a casing disposed therein, that comprises introducing a carrier fluid comprising first particulates into the well bore, packing the first particulates into a plurality of perforations in the c... | 09/25/2007 |
| 7271206 | Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability and high dielectric constant. The composition includes a) a high Tg ... | 09/18/2007 |
| 7268174 | Homogeneous alumoxane-LCT-epoxy polymers and methods for making the same The present invention relates to homogeneous alumoxane-LCT-epoxy polymers and methods for making the same. The homogeneous alumoxane-LCT-epoxy polymers comprise alumoxane-containing sub-structures evenly dispersed and essentially completely co-reacted with the LCT-e... | 09/11/2007 |
| 7267171 | Methods and compositions for stabilizing the surface of a subterranean formation Methods comprising providing a fracturing fluid comprising proppant particulates at least partially coated with a hardenable resin composition that comprises a hardenable resin component and a hardening agent component, wherein the hardenable resin component compris... | 09/11/2007 |
| 7264051 | Methods of using partitioned, coated particulates Methods of treating a portion of a subterranean formation comprising: providing partitioned, coated particulates that comprise particulates, an adhesive substance, and a partitioning agent, and wherein the adhesive substance comprises an aqueous tackifying agent or ... | 09/04/2007 |
| 7264052 | Methods and compositions for consolidating proppant in fractures Improved methods and compositions for consolidating proppant in subterranean fractures are provided. In certain embodiments, the hardenable resin compositions may be especially suited for consolidating proppant in subterranean fractures having temperatures above abo... | 09/04/2007 |
| 7261156 | Methods using particulates coated with treatment chemical partitioning agents Methods of treating a portion of a subterranean formation comprising: providing partitioned, coated particulates that comprise particulates, an adhesive substance, and a partitioning agent, and wherein the partitioning agent comprises a subterranean treatment chemic... | 08/28/2007 |
