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Motorized Ice Cream Cone

A Receptacle for supporting, rotating and sculpting a portion of ice cream or similarly malleable food while it is being consumed.

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Class 523/456 - Organic chalcogen compound DNRM


Subclass of Class 523 - Synthetic resins or natural rubbers -- part of the class 520 series
Definition: Subject matter wherein the DNRM is an organic compound containing
No. of patents: 304
Last issue date: 05/15/2012


1                
NumberTitleIssue Date
8178598Polyoxyalkylene polyamide-glycidyl ether adduct epoxy resin curing agent
A curing agent for epoxy resin, and a coating composition using the curing agent curing agent that delivers excellent recoatability and overcoatability after a long time exposure. (A) An epoxy curing agent that is derived by adduction between amide-type...
05/15/2012
8153709Halogen-free prepreg and resin for preparing the same
A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a gl...
04/10/2012
7977412Epoxy resin composition and semiconductor device
An epoxy resin composition for encapsulating semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer havi...
07/12/2011
7816430Composition of polycyanate ester and biphenyl epoxy resin
The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention...
10/19/2010
7629398Composition of epoxy resin, phenol resin and (epoxy resin-) CTBN
An epoxy resin composition for encapsulating semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer havi...
12/08/2009
7550522Composition of liquid thermoset resin and gelator
A resin composition comprising: (i) one or more polymerisable liquid thermoset resin components; (ii) optionally one or more curing agents for said one or more polymerisable liquid resin components; and (iii) at least one gelator, wherein said gelator interacts with...
06/23/2009
7462658Aging-resistant coatings and adhesive composites
Curable compositions are provided which contain a curable component and particular m-hydroxybenzene derivatives, wherein such derivatives function as aging inhibitors. Such curable compositions are useful as coating agents and adhesives having improved aging resista...
12/09/2008
7423097Glycidyloxy groups-containing polybutadiene, mono-oxetane compound and cationic photoinitiator
A radiation curable resin composition comprises a glycidyloxy groups-containing polybutadiene or hydrogenated polybutadiene, a mono-oxetane compound or monofunctional epoxy compound, and a cationic photopolymerization initiator. ...
09/09/2008
7405246Cure system, adhesive system, electronic device
A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive syste...
07/29/2008
7358312Epoxy resin curing agent of epoxy resin-liquid amine adduct and polyamidoamine
This invention describes epoxy-amine compositions that have low mix viscosity and a fast drying property at temperatures below freezing. The composition is useful for high solids coating applications, for adhesive and membrane applications, and for preparing ...
04/15/2008
7323360Electronic assemblies with filled no-flow underfill
High yield, high reliability, flip-chip integrated circuit (IC) packages are achieved utilizing a combination of heat and pressure to bond flip-chip die and to cure no-flow underfill material. The underfill comprises a filler or low coefficient of thermal expansion ...
01/29/2008
7317049Resin composition for a sheet molding compound and method therefor
A sheet molding compound used for the preparation of enclosures comprising a base resin in a range from 20.0 to 28.0% by weight; a thermoplastic resin in a range from 3.0 to 7.0% by weight; a styrene monomer in a range from 0.01 to 2.5% by weight; a first catalyst i...
01/08/2008
7271224Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same
A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional ...
09/18/2007
7196123Polyester block copolymer composition and process for the preparation thereof
The invention provides a polyester block copolymer composition (R) obtained by thermally-processing a polyester block copolymer composition (Q) obtained by melt-mixing 100 parts by weight of a polyester block copolymer (P) with 0.1–5 parts by weight of an epoxy co...
03/27/2007
7147889Organic photochromic compositions of improved kinetic performance
Described are imbibition compositions that incorporate kinetic enhancing additive(s) into photochromic polymeric host material. Kinetic enhancing additives include organic polyol(s), epoxy-containing compound(s) or a mixture thereof that improves the performance of ...
12/12/2006
7144763Epoxy resin compositions, solid state devices encapsulated therewith and method
Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal st...
12/05/2006
7097304Polarizing devices and methods of making the same
Certain, non-limiting embodiments of the disclosure provide ophthalmic elements and devices comprising an at least partial coating adapted to polarize at least transmitted radiation on at least a portion of at least one exterior surface of an ophthalmic element or s...
08/29/2006
7097303Polarizing devices and methods of making the same
Certain, non-limiting embodiments of the disclosure provide ophthalmic elements and devices comprising an at least partial coating adapted to polarize at least transmitted radiation on at least a portion of at least one exterior surface of an ophthalmic element or s...
08/29/2006
7053138Flame-proofing agents
Compounds of formula (I) or (II), wherein R1 is C1–C18alkyl; C5–C12cycloalkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alk...
05/30/2006
7044600Polarizing devices and methods of making the same
Certain, non-limiting embodiments of the disclosure provide ophthalmic elements and devices comprising an at least partial coating adapted to polarize at least transmitted radiation on at least a portion of at least one exterior surface of an ophthalmic element or s...
05/16/2006
7034079Radial polymers prepared by stabilized free radical polymerization
A process for preparing a radial polymer comprising at least 3 polymeric arms and a central core comprising a polymerized di- or polyfunctional monomer, said process comprising the steps, (a) polymerizing at an elevated temperature...
04/25/2006
7022410Combinations of resin compositions and methods of use thereof
A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in c...
04/04/2006
7019052Liquid substance mixtures and (co)-polymers, method for their production and use thereof for producing complex reactive mixtures
Liquid compositions and homopolymers or copolymers of olefinically unsaturated compounds, preparable by (co)polymerizing olefinically unsaturated compounds and reactive diluents for thermally curable multisubstance mixtures as reaction medium, and their use to prepa...
03/28/2006
7009008Transparent liquid resin material for SMT-enabled led-applications at higher temperatures and higher luminosities
A casting resin compound as an assembly and encapsulation material for electronic and optoelectronic component parts, modules and components, for example for casting out optoelectronic components on the basis of acid anhydride-curable epoxy compounds, particularly b...
03/07/2006
7005186Damage resistant and tolerant optical materials
A new damage resistant and tolerant optical element is disclosed. Prior art solid or liquid host matrices are replaced by a soft crosslinked polymer or similar host material. The viscoelastic properties of the matrix host material are controlled during formation so ...
02/28/2006
6916889Epoxy resin compositions, solid state devices encapsulated therewith and method
Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal st...
07/12/2005
6914087Process for producing powder coating composition, powder coating composition, and method of coating film formation
A powder coating is provided which does not require a long complicated production process, can be produced easily and with no danger of gelling occurring during production, and which forms a paint film with superior smoothness and with no film defects such as bubble...
07/05/2005
6881813Epoxy resin hardener compositions
The invention relates to epoxy resin hardener compositions containing at least one mercaptan hardener and at least one metal salt of C8-24 carboxylic acids. These hardeners are distinguished in particular by the fact that catalyzed resins containing epoxy...
04/19/2005
6872762Epoxy resin composition with solid organic acid
This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, optionally a polythiol compound which has two or more thiol groups per molecu...
03/29/2005
6841605Adhesive composition for metal foil, and adhesive-coated metal foil, metal-clad laminate and related materials using the same
Disclosed are an adhesive composition for a metal foil which comprises a material wherein a tracking resistance test is carried out according to the IEC method by making a thickness of an adhesive layer 30 to 40 μm, using a copper foil pattern with a width of 4 mm ...
01/11/2005
6831113Amine-modified epoxy resin reacted in presence of latent hardener
A method for making a one-component epoxy resin system comprises reacting (A) an epoxy resin and (B) an amine solidifying system present in insufficient quantities to cause gelation in the presence of a latent hardener (C) and an expanding agent (E), each of which r...
12/14/2004
6815474Water-based intaglio printing ink
The invention relates to a water-based intaglio printing ink especially suited for the intaglio printing of security documents, such as postage stamps, stock certificates and the like, wherein the water-based intaglio printing ink having a) an epoxy resin ester reac...
11/09/2004
6815495Coating of melamine, epoxy, urethane or alkyd resin with phenolic resin binder
A coating solution for producing a cured coating, particularly for metallic surfaces, includes (1) a binder containing organic polymers with optional organic or inorganic addictions and (2) at least one of a melamine resin, an epoxy resin, a polyurethane resin, an a...
11/09/2004
6774160Curable epoxy resin compositions and the cured residues thereof
A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixt...
08/10/2004
6770691Curable epoxy resin compositions and the cured residues thereof
A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixt...
08/03/2004
6767639Cured epoxy resin compositions with brominated triazine flame retardants, and laminates comprising them
A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixt...
07/27/2004
6713536Removable imbibition composition of photochromic compound and epoxy and polyol kinetic enhancing additives
Described are imbibition compositions that incorporate kinetic enhancing additive(s) into photochromic polymeric host material. Kinetic enhancing additives include organic polyol(s), epoxy-containing compound(s) or a mixture thereof that improves the performance of ...
03/30/2004
6689459Clear cathodic electrocoating compositions
An improved aqueous cathodic electrocoating composition having a binder of an epoxy-amine adduct which is an epoxy resin that has been reacted with an amine, a blocked polyisocyanate crosslinking agent and an organic or inorganic acid as the neutralizing ...
02/10/2004
6670417Rubber-acrylic adhesive formulation
Pressure sensitive adhesive formulations of an acrylic polymer grafted with a hydrogenated rubber. In one embodiment, the polymer contains a hydroxyalkyl (meth)acrylate ester which is crosslinked with a titanium-containing chelated metal alkoxide. The adh...
12/30/2003
6653371One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid
This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, a polythiol compound which has two or more thiol groups per molecu...
11/25/2003
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