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| Number | Title | Issue Date |
| 8084519 | Curing accelerator for epoxy resin composition, and one-pack type thermosetting epoxy resin composition A curing accelerator for epoxy resin compositions, which is used in a one-pack type epoxy resin composition having excellent storage stability and rapid curability. The curing accelerator for epoxy resin compositions contains a microcapsule type curing accelerator w... | 12/27/2011 |
| 7745516 | Composition of polyimide and sterically-hindered hydrophobic epoxy Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be p... | 06/29/2010 |
| 7462657 | Door system for a building A door assembly having a structural inner frame that is secured between an interior sheath and an exterior sheath. The inner frame provides rigidity and strength to the door assembly and will not warp or otherwise lose its dimensional integrity regardless of the env... | 12/09/2008 |
| 7364799 | Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board The present invention provides a non-halogen polyamide-imide resin soluble in an amide solvent at a concentration of 10%, the resulting varnish, when stored at 5° C. for 1 month, exhibiting a solution viscosity change ((solution viscosity after 1 month−initial so... | 04/29/2008 |
| 7303944 | Microelectronic devices having underfill materials with improved fluxing agents Microelectronic packages formed by using novel fluxing agents are disclosed. In one aspect, a microelectronic package may include a microelectronic device, a substrate, and an interconnect structure including a solder material coupling the microelectronic device wit... | 12/04/2007 |
| 7282170 | Thermoplastic throttle body The invention relates to a process of making a throttle body comprising injection-moulding of a reinforced thermoplastic composition, wherein a polyethylene terephthalate composition containing a nucleating agent and 25-60 mass % of glass-fibres is used as the reinf... | 10/16/2007 |
| 7271224 | Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional ... | 09/18/2007 |
| 7264856 | Fusible inkjet recording element and printing method An inkjet recording element comprising, over a porous, ink-receiving layer, a fusible, porous topmost layer comprising a film-forming, hydrophobic binder and fusible, polymeric particles of a non-segmented polyurethane, or salt thereof, comprising repeat units deriv... | 09/04/2007 |
| 7169833 | Liquid epoxy resin composition and semiconductor device A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising 5–100% by weight of a specific aromatic amine compound having a purity of at least 99%, (C) an inorganic filler, and (D) an ester organic solvent ha... | 01/30/2007 |
| 7163973 | Composition of bulk filler and epoxy-clay nanocomposite A molding composition or encapsulant for an electronic component and its method of preparation provides reduced moisture uptake without undue swelling and comprises melt-blending an epoxy resin, hardener and clay, cooling, adding a catalyst to form an epoxy-clay nan... | 01/16/2007 |
| 7160963 | Toner fuser member with release layer formed from silsesquioxane-epoxy resin composition A toner fuser member contains a substrate on which is disposed a toner release surface layer formed from a composition that includes a silsesquioxane and a curable epoxy resin. On curing, the composition forms an interpenetrating polymer network of the silsesquioxan... | 01/09/2007 |
| 7150390 | Flip chip dip coating encapsulant A method for underfilling and encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip e... | 12/19/2006 |
| 7125917 | Epoxy molding compounds with resistance to UV light and heat A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantial... | 10/24/2006 |
| 7026376 | Fluxing agent for underfill materials An underfill material, such as a no flow underfill material, containing an anhydride adduct of a rosin compound is disclosed. In one aspect, the anhydride adduct of a rosin compound contains an organic rosin acid moiety and a substitute moiety for a hydroxyl group o... | 04/11/2006 |
| 7021349 | Spin finish The present spin finish composition comprises at least about 10 percent by weight based on the spin finish composition of components (a) and (b) having the formula R1—(CO)x—O—(CH(R2)—CH2—O)yâ... | 04/04/2006 |
| 7024458 | System and method for managing mail and file A system and a method for managing mails and files are proposed, which are applied to a network environment e.g. Internet, allowing received mails or files to be classified and systematically stored in a database, according to receiver's group, mail subject, file na... | 04/04/2006 |
| 6924328 | Stabilized coating compositions A coating composition includes a thermoplastic dispersion and a stabilizer. The stabilizer includes the reaction product of an epoxy resin and an acid, wherein the stabilizer has at least two oxirane functional groups per molecule. ... | 08/02/2005 |
| 6916865 | Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins The present invention provides an organic carboxylate composition that has long working life, cures epoxy resins, and improves adhesive properties, and also provides a method for producing the same. An organic carboxylate composition, obtained by heating and mixing ... | 07/12/2005 |
| 6908579 | Process for making a yarn having a spin finish A spin finish which enhances yarn processability and contributes to improved yarn performance. The spin finish is advantageous when compared with conventional spin finishes applied to industrial yarn because the present spin finish enhances yarn processability as ev... | 06/21/2005 |
| 6899924 | Coating compositions and processes An undercoat composition comprises a film-forming synthetic resin and contains a non-volatile acidic aromatic polar organic compound in free acid or salt form, which compound facilitates the removal by a stripping composition of a top coat paint which is subsequentl... | 05/31/2005 |
| 6881813 | Epoxy resin hardener compositions The invention relates to epoxy resin hardener compositions containing at least one mercaptan hardener and at least one metal salt of C8-24 carboxylic acids. These hardeners are distinguished in particular by the fact that catalyzed resins containing epoxy... | 04/19/2005 |
| 6872762 | Epoxy resin composition with solid organic acid This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, optionally a polythiol compound which has two or more thiol groups per molecu... | 03/29/2005 |
| 6843939 | UV stabilizing additive composition This invention relates to an UV stabilizing additive composition comprising an ortho-hydroxy triazine compound, a hindered hydroxybenzoate compound and optionally a hindered amine compound. This additive composition may be used to stabilize materials from UV radiati... | 01/18/2005 |
| 6809162 | Solid state device with encapsulant of cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride and boron catalyst Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least ... | 10/26/2004 |
| 6653371 | One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, a polythiol compound which has two or more thiol groups per molecu... | 11/25/2003 |
| 6649673 | Single component room temperature curable low VOC epoxy coatings A single component epoxy coating precursor and a method for making such a precursor, a low VOC epoxy coating and a method for making such a coating, and a method for making a blocked amine which is more stable than previously known ones. The single compon... | 11/18/2003 |
| 6617401 | Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D... | 09/09/2003 |
| 6617400 | Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, a... | 09/09/2003 |
| 6617046 | Thermosetting resin composition and semiconductor device using the same A thermosetting resin composition usable for sealing a gap formed between a printed circuit board and a semiconductor element in a semiconductor package having a face-down structure; a semiconductor device comprising a printed circuit board, a semiconduct... | 09/09/2003 |
| 6613437 | Two-component preparations containing epoxy compounds The invention relates to two-component preparations comprising components (I) and (II), wherein at least one component comprises epoxy compounds and the preparations cure by cationic polymerization, initiated by Lewis and/or Bronsted acids, after mixing o... | 09/02/2003 |
| 6482289 | Nonconductive laminate for coupling substrates and method therefor An assembly and method for connecting two substrates utilizes a nonconductive laminant that is compatible when wet with a conductive paste when wet. Thus, the curing of the nonconductive laminant and the conductive paste may be performed together. The non... | 11/19/2002 |
| 6468659 | Resin system The resin system comprises at least two components which can be stored separately and crosslinked with one another at room temperature, preferably without curing accelerators. The first component comprises at least one compound of the formula (I) ##S... | 10/22/2002 |
| 6458472 | Fluxing underfill compositions This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages ("CSPs"), ball g... | 10/01/2002 |
| 6447915 | Interlaminar insulating adhesive for multilayer printed circuit board In order to provide a multilayer printed circuit board having a fine pitch circuit, the interlaminar insulating adhesive used therein must have heat resistance and low thermal expansion coefficient so that required accuracy can be obtained during circuit ... | 09/10/2002 |
| 6420460 | Cationically curable compositions containing triarylcyclopropenylium salts The present invention relates to a thermally and cationically curable composition containing triarylcyclopropenylium salts and a solvent that is a Lewis base which contains acidic hydrogen and their use as thermal initiators in polymerization processes. T... | 07/16/2002 |
| 6372826 | Curable composition comprising epoxy resin, graphite powder and polytetrafluoroethylene powder A curable composition useful for repairing worn surfaces on housings comprising an admixture of: (1) a mixture of (a) an one-component epoxy resin, (b) solvent and (c) reactive diluent, wherein said epoxy resin is present in a major amount in said mixture... | 04/16/2002 |
| 6359039 | Mixing barbituric acid-modified BMI with MEK solution of epoxy resin and elastomer An epoxy based adhesive composition contains: (i) a barbituric acid-modified bismaleimide; (ii) an epoxy resin selected from the group consisting of tetraglycidylmethylenedianiline, diglycidyl ortho-phthalate, diglycidyl ether of bisphenol A, polyglycidyl... | 03/19/2002 |
| 6337362 | Ultraviolet resistant pre-mix compositions and articles using such compositions The compositions described include micronized zinc oxide UV blocking agents with at least one organic UV protective compound. Premix compositions are provided for imparting improved UV resistance to paints, coatings, finishes and plastic articles comprisi... | 01/08/2002 |
| 6302951 | Coating composition for rejuvenating gloss of painted surfaces A paint protecting and reactivating composition comprising a main ingredient selected from: a dicyclopentadiene polymer, soy oil, sunflower oil or corn oil; an organic solvent; alkanoates of cobalt, magnesium, and zirconium; a chelating agent; an epoxy re... | 10/16/2001 |
| 6294259 | Polyimide hybrid adhesives This invention relates to a polyimide hybrid adhesive comprised of an epoxy component, an epoxy curing agent, and a polyimide oligomer of molecular weight of up to about 8,000 (Mn) having repeating units of Formula (1): ##STR1## The adhesi... | 09/25/2001 |
