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| Number | Title | Issue Date |
| 8084518 | Ethylenebis(hydroxyalkylphosphinic acid) and salts thereof The invention relates to an ethylenebis(hydroxyalkylphosphinic acid) and salts thereof. The acid has the general formula: A-P(O)(OX)—CR1R2—CR3R4—P(O)(OX)-A. Variable A is CR5R6—OH. Variables R... | 12/27/2011 |
| 8013039 | Encapsulant composition for a light-emitting diode An encapsulant composition for a light-emitting diode is provided. One embodiment of the encapsulant composition comprises: (a) about 100 parts by weight of at least one liquid bi-functional epoxy resin containing about 40˜50 weight % of aromatic ring; (b) about 55... | 09/06/2011 |
| 7910639 | Resin compositions, prepregs and laminates The present invention relates generally to resin compositions having a generally halogen-free epoxy resin that can encompass a novolak epoxy resin, a curing agent and a non-halogen flame-retardant material. For some embodiments, the curing agent can be dicyandiamide... | 03/22/2011 |
| 7820741 | Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density. The flame retardant adhesive... | 10/26/2010 |
| 7820740 | Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density such as copper-clad laminates... | 10/26/2010 |
| 7585904 | Curing accelerator, curable resin composition and electronic parts device A curing accelerator that enables a composition to exhibit excellent fluidity, reflow crack resistance and high-temperature storage properties, and exhibits excellent curability even upon moisture absorption, as well as a curable resin composition, and an electronic... | 09/08/2009 |
| 7544727 | Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin m... | 06/09/2009 |
| 7423097 | Glycidyloxy groups-containing polybutadiene, mono-oxetane compound and cationic photoinitiator A radiation curable resin composition comprises a glycidyloxy groups-containing polybutadiene or hydrogenated polybutadiene, a mono-oxetane compound or monofunctional epoxy compound, and a cationic photopolymerization initiator. ... | 09/09/2008 |
| 7396588 | Curable composition, varnish and laminate A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 μm, an aspect ratio of 5 or less, and the proporti... | 07/08/2008 |
| 7348057 | Acrylic adhesive sheet An adhesive sheet made of an acrylic adhesive composition comprising (A) an acrylic polymer containing carboxyl groups and having a Tg of 5-30° C., (B) a resol phenolic resin, (C) an epoxy resin, and (D) a curing accelerator has improved heat resistance, processing... | 03/25/2008 |
| 7320830 | Flame-retardant heat-resistant resin composition and adhesive film comprising the same The present invention provides a non-flammable heat-resistant resin composition that is provided with (A) modified polyamideimide resin, (B) thermosetting resin and (C) organic phosphor-based compound, and a cured film, obtained from the non-flammable heat-resistant... | 01/22/2008 |
| 7309558 | Use of salt-like structured silicas as charge control agents The present invention relates to the use of salt-like structured silicates, in which the cation is NH4+, H3O+, an alkali metal, alkaline earth metal, earth metal or transition metal ion or a low molecular weight organic ca... | 12/18/2007 |
| 7300534 | Bonds between metals and polymers for medical devices Various coupling agents are disclosed to form lap joints between metallic and polymeric surfaces within catheters and other medical devices. The coupling agents disclosed in the present invention can be applied directly to a metallic surface, or the coupling agents ... | 11/27/2007 |
| 7276470 | Glassware corrosion inhibitor Article for use in a dishwashing machine, which comprises a water-soluble glass or ceramic composition effective to reduce corrosion of glassware and at least one surfactant containing composition, wherein the amount of the glass or ceramic composition is within the... | 10/02/2007 |
| 7273901 | Flame retardant dispersion The invention relates to a novel flame retardant dispersion for thermoplastic and thermoset polymers, comprising, as component A, a phosphinic salt of the formula (I), and/or a diphosphinic salt of the formula (II), and/or polymers of these, ... | 09/25/2007 |
| 7208537 | Self-priming chromate free corrosion resistant coating composition and method A self-priming rapid curing chromate free corrosion resistant coating composition based on a random polyvinyl terpolymer and an alkyd resin with a hydroxyl number between 80–200 in association with a mineral acid catalyst, at least one organic solvent and a drying... | 04/24/2007 |
| 7202311 | Phosphine oxide hydroxyarl mixtures with novolac resins for co-curing epoxy resins There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition incl... | 04/10/2007 |
| 7201957 | Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition incl... | 04/10/2007 |
| 7183363 | Thermally conductive casting compound A resin-based casting compound which cures by a chemical reaction is described; it is suitable in particular for insulation of electric components and it contains an epoxy resin component (A), a silicone-containing component (B), a filler (C), by the choice of which... | 02/27/2007 |
| 7179776 | Ceramic dishwashing composition for inhibiting corrosion of glassware A ceramic composition is provided to protect glassware from corrosion in a dishwasher. The ceramic composition contains at least one compound which releases an active agent during washing and/or rinsing cycles of a dishwasher to protect glassware from corrosion.... | 02/20/2007 |
| 7169474 | Epoxy resin composition and semiconductor device An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an effective flux component selected from among abietic acid, palustric acid, levopimaric acid and dihydroabietic acid is low volatile and exhibits impr... | 01/30/2007 |
| 7160963 | Toner fuser member with release layer formed from silsesquioxane-epoxy resin composition A toner fuser member contains a substrate on which is disposed a toner release surface layer formed from a composition that includes a silsesquioxane and a curable epoxy resin. On curing, the composition forms an interpenetrating polymer network of the silsesquioxan... | 01/09/2007 |
| 7160609 | Curable composition, varnish, and layered product A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 μm, an aspect ratio of 5 or less, and the proporti... | 01/09/2007 |
| 7157313 | Epoxy resin composition and semiconductor device using thereof The present invention provides an epoxy resin composition for packaging a semiconductor device, characterized in having improved mold releasability during a molding process, continuous-moldability and improved solder resistance. According to the present invention, t... | 01/02/2007 |
| 7144763 | Epoxy resin compositions, solid state devices encapsulated therewith and method Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal st... | 12/05/2006 |
| 7138445 | Flame retardant thermoplastic resin composition The present invention relates to a flame retardant thermoplastic resin composition that contains a phenol resin derivative having good char formability, regardless of the base resin. A flame retardant thermoplastic resin composition according to the present inventio... | 11/21/2006 |
| 7132475 | Block copolymers for multifunctional self-assembled systems The invention provides methods for the preparation of multiblock copolymers, dispersions of multiblock copolymers, vesicles and micelles containing multiblock copolymers, and oxidative degradation products of multiblock copolymers. ... | 11/07/2006 |
| 7109065 | Bumped chip carrier package using lead frame and method for manufacturing the same An improved bumped chip carrier (BCC) package according to the present invention includes a resin-molded lead frame encapsulating an attached semiconductor integrated circuit (IC) and a plurality of interconnecting wire bonds attaching a plurality of contact pads on... | 09/19/2006 |
| 7084194 | Halogen-free resin composition A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): | 08/01/2006 |
| 7070861 | Flame retardant epoxy resin composition, and prepreg and fiber-reinforced composite materials made by using the composition A flame retardant epoxy resin composition containing (A) a phenolic novolak type epoxy resin including a phenolic novolak type epoxy resin of the following formula (1) and/or formula (2) in a total of at least 50 wt %: | 07/04/2006 |
| 7064157 | Flame retardant resin and flame retardant composition containing the same The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: | 06/20/2006 |
| 7053138 | Flame-proofing agents Compounds of formula (I) or (II), wherein R1 is C1–C18alkyl; C5–C12cycloalkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alk... | 05/30/2006 |
| 7041399 | Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to... | 05/09/2006 |
| 6994154 | Aluminum heat exchanger In an adsorber for an adsorption type refrigerator of the present invention, aluminum heat exchangers 120, 130 arranged in a casing 110 are provided with films which do not permit moisture to pass therethrough, such as SiO3 films, anodic oxi... | 02/07/2006 |
| 6992151 | Phosphorus-containing flame-retardant hardener, and epoxy resins cured by the same The present invention discloses an active-hydrogen-containing curing agent having a phosphorus group, and a flame retardant cured epoxy resin which can be prepared via an addition reaction between the active hydrogen and the epoxide group of an epoxy resin. The cure... | 01/31/2006 |
| 6955848 | Curable composition and multilayered circuit substrate This invention provides a multi-layer circuit board excellent in flame resistance, insulating property and adhesion and not generating detrimental substances when burnt, and a curable composition suitable for obtaining the multi-layer circuit board. The curable comp... | 10/18/2005 |
| 6955851 | Hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom The invention provides new compositions of matter that are capable of forming cross-linked polymeric materials upon reaction with various known epoxy-containing compositions. Thus, the compositions of this invention are useful in the manufacturing of prepregs and la... | 10/18/2005 |
| 6936646 | Flame-retardant molding compositions A flame-retardant molding composition that includes an epoxy resin, melamine cyanurate, and one or more hydrate metal salts capable of liberating water when heated. The hydrated metal salt may include one or more compounds selected from metal borate salts, Group IIB... | 08/30/2005 |
| 6933050 | Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board The present invention features phosphorus containing epoxy resin compositions useful for imparting flame retardant properties to prepregs, resin-clad metal foils, and laminate boards constructed therefrom. The phosphorus containing epoxy resin composition (a) compri... | 08/23/2005 |
| 6933332 | Powdered epoxy composition A cured epoxy coating comprising from about 30% to about 40% of at least one epoxy resin selected from the group consisting of diglycidyl ethers of bisphenol A, from about 55% to about 60% of a particulate flame retardant, from about 1% to about 4% of at least one m... | 08/23/2005 |
