Did You Know...
...that the inventor of the electric motor was a blacksmith named Thomas Davenport? Described as "a brilliantly unsuccessful inventor", Davenport invented the first rotary electric motor. In 1836 he headed out -- on foot -- from his Vermont home to file a patent application at the Patent Office in Washington, D.C. By the time he got there, he had squandered away his money and couldn't afford the $30 filing fee so he turned around and went home. When he later mailed in his application with money he'd raised, the Patent office was destroyed in a fire. He did finally get credit for his invention on Feb. 5, 1837.
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| Number | Title | Issue Date |
| 7868067 | Composition of epoxy resin, aliphatic amine curing agent and halogenated amine One aspect of the current invention is a halogen containing epoxy composition and a method of producing the same. A functional halogen group, fluorine in one case, is incorporated into an epoxy coating by using a functionalized amine curing agent in small amounts. F... | 01/11/2011 |
| 7381359 | Method for making filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 06/03/2008 |
| 7311972 | Filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 12/25/2007 |
| 7312104 | Resin composition for encapsulating semiconductor device A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide s... | 12/25/2007 |
| 7304102 | Process for making encapsulant for opto-electronic devices An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of r... | 12/04/2007 |
| 7192991 | Cationically curable composition A cationically curable composition comprises (a) at least one cationically curable species; (b) at least one cationic photoinitiator; and (c) at least one encapsulated, polymer-bound base. ... | 03/20/2007 |
| 7157119 | Method and compositions for applying multiple overlying organic pigmented decorations on ceramic substrates A pigmented curable composition adapted for decorating ceramic substrates (e.g., glass bottles) comprises curable organic binder and solid spherical particles (glass or polymer) having diameters of 10 to 50 microns for facilitating overprinting of additional layers.... | 01/02/2007 |
| 6887922 | Glass composite The invention describes a solid glass composite comprising glass granules and a binder resin which may be used in a wide range of applications, for example, flooring, furniture, lighting, work surfaces and architectural features. ... | 05/03/2005 |
| 6779656 | Polymerizable preparations based on epoxides that contain silicon The invention relates to polymerizable preparations which contain: (a) 3 to 80 wt. % of an epoxy or of a mixture of epoxies of general formula (I), whereby n and m, independent of one another, represent 0, 1, 2 or 3, and n+m ranges from 2 to 6, and whereby the molar... | 08/24/2004 |
| 6737157 | Coating type reinforcement composition of sheet metal The present invention provides a coating type reinforcement composition of sheet metal which can be applied under warming for ensuring satisfactory levels of tensile rigidity and resistance to dent of a thin sheet metal mainly due to weight reduction of an automobil... | 05/18/2004 |
| 6692664 | Printed wiring board conductive via hole filler having metal oxide reducing capability A conductive via filler for printed wiring boards capable of reducing copper oxides and thereby eliminating a cleaning step in printed wiring board construction, the conductive via filler consisting essentially of silver flake, a resin, a hardener, and a ... | 02/17/2004 |
| 6664307 | Low-shrinkage epoxy resin formulation Low-shrinkage positioning formulations include, in addition to the resin-forming composition, a filler comprised of fibrous and spherical elements, usually of glass, present in a defined ratio and amount. The resin formulation may desirably comprise epoxy... | 12/16/2003 |
| 6566422 | Connecting material A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high ... | 05/20/2003 |
| 6395823 | Thermoplastic polyurethane additives for improved polymer matrix composites and methods of making and using therefor The present invention relates to a composite made by the process of melt mixing (a) a polymer having at least one isocyanate reactive group, wherein the polymer is from 30 to 90% by weight of the composite; (b) a thermoplastic polyurethane at from 0.1 to ... | 05/28/2002 |
| 6383660 | Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same An epoxy resin composition for encapsulating a semiconductor device comprising as essential components (A) an epoxy resin; (B) a phenolic resin; (C) a curing accelerator; and (D) a hollow inorganic filler having an average particle size of 4 to 100 μm an... | 05/07/2002 |
| 6376100 | Flip-chip type semiconductor device underfill material and flip-chip type semiconductor device A composition comprising (A) 100 parts of a liquid epoxy resin, (B) 100-300 parts of a spherical inorganic filler having a maximum particle size of up to 50 μm and a mean particle size of 0.5-10 μm, (C) 0.1-6 parts of a reactive functional group-contain... | 04/23/2002 |
| 6353061 | , ω-methacrylate terminated macromonomer compounds A ,ω-methacrylate terminated epoxide-carboxylic acid macromonomer compound formed by reaction of at least one diepoxide, at least one dicarboxylic acid and at least one unsaturated mono-carboxylic acid and having the general formula 1: ##STR1... | 03/05/2002 |
| 6337037 | Printed wiring board conductive via hole filler having metal oxide reducing capability A conductive via filler for printed wiring boards capable of reducing copper oxides and thereby eliminating a cleaning step in printed wiring board construction, the conductive via filler consisting essentially of silver flake, a resin, a hardener, and a ... | 01/08/2002 |
| 6323263 | Semiconductor sealing liquid epoxy resin compositions In a semiconductor-sealing liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, and (C) an inorganic filler, the inorganic filler has such a controlled particle size distribution that the composition provides improved in... | 11/27/2001 |
| 6300402 | Compositions created by the separation and isolation of the metallic and non-metallic constituent components of printed wiring assemblies and printed wiring boards An apparatus separates a substantially metallic portion from a substantially non-metallic portion or constituent components of at least one electrical product, comprising a plurality of crushing machines, such as a first crushing machine and a second crus... | 10/09/2001 |
| 6268425 | Glass/polymer melt blends This invention is directed to the preparation of alloy articles consisting essentially of 65 wt. % or more glass and high temperature organic thermoplastic or thermosetting polymers having working temperatures which are compatible with that of the glass a... | 07/31/2001 |
| 6246123 | Transparent compound and applications for its use A mold compound made from a polymer resin and an isorefringent, transparent filler is used to form optical electronic components (10, 20, 30). The mold compound can be used to form a lens (13) on a display device (10), to form the outer housing (21) of a ... | 06/12/2001 |
| 6060540 | Modeling pastes The present invention provides a modeling paste comprising a latent material which can be applied as a thick layer to a substrate and which after activation rapidly crosslinks to a machinable surface.... | 05/09/2000 |
| 6043313 | Thermoplastic polyurethane additives for improved polymer matrix composites and methods of making and using therefor The present invention relates to a composite made by the process of melt mixing (a) a polymer having at least one isocyanate reactive group, wherein the polymer is from 30 to 90% by weight of the composite; (b) a thermoplastic polyurethane at from 0.1 to ... | 03/28/2000 |
| 5919842 | Water-based latex phenolic coating composition A matrix board coating composition for use in the formation of a mold in which flexographic printing plates are produced, the coating is a water-based, latex emulsion having a two step phenolic component to increase shelf life, reduce volatiles and improv... | 07/06/1999 |
| 5902755 | High Strength composite materials A ternary composite with thermal stability of up to at least 200° C. Is formed using a thermally stable matrix resin, high tensile fibers, and borosilicate or sodium tetra borate glass particulates. The composite has stability to acids, toxic wastes and ... | 05/11/1999 |
| 5876210 | Dental polymer product The invention concerns a process for preparing a polymer composition, that is free-radical/photochemical and thermal curing epoxide-methacrylate and/or isocyanate-methacrylate adhesives in broadest terms, dental/medical adhesives, and dental restoratives.... | 03/02/1999 |
| 5834537 | Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin The present invention relates to a curable thermosetting resin composition having enhanced fracture toughness as a results of the incorporation of reactive thermoplastic oligomers therein. More specifically, the present invention relates to a composition ... | 11/10/1998 |
| 5827908 | Naphthalene and or biphenyl skeleton containing epoxy resin composition An epoxy resin composition is provided that mainly comprises an epoxy resin, a curing agent, and an inorganic filler, and that cures into a product having a coefficient of water diffusion of up to 1×10-4 cm2 /hr. at a thickness of 3... | 10/27/1998 |
| 5827907 | Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin A composition having enhanced fracture resistance comprising a heat curable reaction product of a fluorine-containing thermoset material and a fluorine-containing homopolymer, wherein the cured reaction product comprises the thermoset material having a pl... | 10/27/1998 |
| 5747557 | Method of manufacturing a castable epoxy resin composition comprising acrylic rubber particles predispersed in an anhydride hardener A method of manufacturing a castable epoxy resin composition which comprises as components an epoxy resin, an acid anhydride in an amount sufficient for hardening, an inorganic filler, and acrylic rubber particles having a thermoplastic resin skin, said t... | 05/05/1998 |
| 5677367 | Graphite-containing compositions Disclosed herein is a precursor powder composition comprising a resin, a combination of zinc dust, zinc powder and zinc-coated microspheres and graphite, said powder being soluble in a solvent blend at a facility remote from the powder manufacturing facil... | 10/14/1997 |
| 5621025 | Polymer concrete coating for pipe tubular shapes, other metal members and metal structures The improved coating of the present invention provides a protective coating for pipe, tubular shapes, other metal members, and metal structures. The protective coating comprises a polymer concrete, which is preferably a mixture of an organic resin, a fill... | 04/15/1997 |
| 5616633 | Liquid epoxy resin composition The present invention provides a liquid epoxy resin composition that includes an epoxy resin, at least one filler and an inorganic thixotropic agent in an amount effective to reduce settling of said filler at ambient temperatures. The composition further ... | 04/01/1997 |
| 5604270 | Chemical treating composition for glass fibers having emulsified epoxy with good stability and the treated glass fibers A simplified aqueous sizing composition utilizing a variety of components achieves improved stability, wettability and strength characteristics. The composition utilizes one or more aqueous, soluble, dispersible or emulsifiable bisphenol A type polyester ... | 02/18/1997 |
| 5439766 | Composition for photo imaging According to the present invention, good image resolution of a cationically polymerized epoxy based coating, such as a solder mask or dielectric or etch resist, is provided by combining a cationically polymerized epoxy based coating with conventional epox... | 08/08/1995 |
| 5368922 | Prepreg of thermoplastic polymer particles in liquid thermosettable resin A thermosettable resin composition having a viscosity that decreases during processing temperatures and increases as the temperature is raised to curing temperatures is provided. The composition comprises thermosettable resins and thermoplastic particles ... | 11/29/1994 |
| 5367013 | Process for producing reinforced crystalline engineering plastic composition A process for producing a reinforced crystalline engineering plastic composition is disclosed, comprising melt-kneading (A) from 60 to 97 parts by weight of a crystalline engineering plastic and (B) from 5 to 100 parts by weight, per 100 parts by weight o... | 11/22/1994 |
| 5324767 | Thermosetting resin composition for casting high-voltage coil, and molded coil and panel formed by casting and curing the composition A thermoplastic resin composition for casting high-voltage coils containing two kinds of fillers (A) and (B), and products as molded coils and panels obtained by casting and curing the composition. The composition of the present invention contains 60%-85% by w... | 06/28/1994 |
| 5280053 | Machinable, high strength epoxy tooling compositions A machinable, high strength epoxy tool which is the polymeric reaction product of a mixture containing 5 to 12 weight percent of a bisphenol A epoxy, 3 to 8 weight percent of at least one polyoxypropylene amine catalyst, 60 to 85 weight percent of a mixtu... | 01/18/1994 |
