Did You Know...
...that the inventor of the electric motor was a blacksmith named Thomas Davenport? Described as "a brilliantly unsuccessful inventor", Davenport invented the first rotary electric motor. In 1836 he headed out -- on foot -- from his Vermont home to file a patent application at the Patent Office in Washington, D.C. By the time he got there, he had squandered away his money and couldn't afford the $30 filing fee so he turned around and went home. When he later mailed in his application with money he'd raised, the Patent office was destroyed in a fire. He did finally get credit for his invention on Feb. 5, 1837.
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| Number | Title | Issue Date |
| 7919547 | Nanofiller-containing epoxy resins and stable aqueous dispersions thereof A water-dispersible composition including a nanofiller-containing epoxy resin and a low temperature nonionic surfactant having a molecular weight of less than about 7,000 Daltons; and optionally an anionic surfactant or optionally a high temperature nonionic surfact... | 04/05/2011 |
| 7723407 | Resin composition, method of its composition, and cured formulation It is an object of the present invention to provide a resin composition which can form cured formulations having various excellent properties such as an insulating property, thermal shock resistance, moldability/formability and strength, and exhibit an excellent app... | 05/25/2010 |
| 7560501 | Encapsulant of epoxy or cyanate ester resin, reactive flexibilizer and thermoplastic An encapsulant composition. The encapsulant composition includes a resin material consisting of epoxy or cyanate ester resins, from about 1.0% by weight to about 5% by weight of the composition of a flexibilizing agent including a flexibilizer containing functional ... | 07/14/2009 |
| 7432334 | Silicone-modified single-component casting compound A casting compound based on a resin which cures by a chemical reaction. The casting compound is suitable for insulation of electric components and contains an epoxy resin component, a silicone-containing component, a filler, and a thermal initiator. This casting com... | 10/07/2008 |
| 7405246 | Cure system, adhesive system, electronic device A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive syste... | 07/29/2008 |
| 7384682 | Electronic package with epoxy or cyanate ester resin encapsulant An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper sur... | 06/10/2008 |
| 7381359 | Method for making filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 06/03/2008 |
| 7368170 | Viscous chemical anchoring adhesive A chemical anchoring adhesive includes a first part having a viscosity of about 200,000 to about 4,000,000 centipoise and a second part having a viscosity of about 200,000 to about 4,000,000 centipoise. The chemical anchoring adhesive can be in the form of a slug or... | 05/06/2008 |
| 7358215 | Quaternary ammonium salts as thickening agents for aqueous systems This invention relates to the use of alkyl amido quaternary ammonium salts, and formulations thereof, as thickening agents in aqueous based fluids, especially those used in oil field applications. The quaternary ammonium salts of the present invention exhibit improv... | 04/15/2008 |
| 7332218 | Electrically disbonding materials An electrochemically disbondable composition is provided having a matrix functionality and an electrolyte functionality. The matrix functionality provides an adhesive bond to a substrate, and the electrolyte functionality provides sufficient ionic conductivity to th... | 02/19/2008 |
| 7321005 | Encapsulant composition and electronic package utilizing same A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity o... | 01/22/2008 |
| 7312104 | Resin composition for encapsulating semiconductor device A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide s... | 12/25/2007 |
| 7311972 | Filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 12/25/2007 |
| 7304102 | Process for making encapsulant for opto-electronic devices An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of r... | 12/04/2007 |
| 7303068 | Polymer grout compositions The present invention relates to a one-part polymer grout composition tintable to any desired color upon request, as well as to a method of tinting the grout composition. Advantageously, the present one-part polymer grout compositions may be tinted using any of the ... | 12/04/2007 |
| 7285602 | Granular epoxy resin, production method thereof, and granular epoxy resin package A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less ... | 10/23/2007 |
| 7282266 | Corrosion and alkali-resistant compositions and methods for using the same A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially mela... | 10/16/2007 |
| 7279223 | Underfill composition and packaged solid state device An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized c... | 10/09/2007 |
| 7262233 | Surface treated silicas Disclosed is a silica substrate treated with a polysiloxane, and an organosilane, wherein the organosilane is described by the formula: RSi(R′)x(OR″)3-x; wherein R is a long-chain hydrocarbon group having between about 8 to about 30 carbon ... | 08/28/2007 |
| 7244793 | Adhesive compositions Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive composition... | 07/17/2007 |
| 7238547 | Packaging integrated circuits for accelerated detection of transient particle induced soft error rates An IC device is packaged for accelerated transient particle emission by doping the underfill thereof with a transient-particle-emitting material having a predetermined, substantially constant emission rate. The emission rate may be tunable. In one aspect, a radioact... | 07/03/2007 |
| 7220793 | Curable film-forming composition exhibiting improved resistance to degradation by ultraviolet light A curable film-forming composition is provided comprising (i) 10 to 90 percent by weight based on the total weight of resin solids in the film-forming composition of a crosslinking agent; (ii) 10 to 90 percent by weight of a polymer containing a plurality of functio... | 05/22/2007 |
| 7192997 | Encapsulant composition and electronic package utilizing same A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexi... | 03/20/2007 |
| 7183363 | Thermally conductive casting compound A resin-based casting compound which cures by a chemical reaction is described; it is suitable in particular for insulation of electric components and it contains an epoxy resin component (A), a silicone-containing component (B), a filler (C), by the choice of which... | 02/27/2007 |
| 7172977 | Method for non-destructive removal of cured epoxy from wafer backside Disclosed is a method for non-destructive removal of cured epoxy from a wafer backside. A wafer back-coated with epoxy is soaked in an acetone bath for a period of time, allowing degradation of the epoxy coating adhesion strength. The epoxy coating is then peeled or... | 02/06/2007 |
| 7157119 | Method and compositions for applying multiple overlying organic pigmented decorations on ceramic substrates A pigmented curable composition adapted for decorating ceramic substrates (e.g., glass bottles) comprises curable organic binder and solid spherical particles (glass or polymer) having diameters of 10 to 50 microns for facilitating overprinting of additional layers.... | 01/02/2007 |
| 7147897 | Weldable compositions comprising a conductive pigment and silicon and methods for using the same A weldable coating composition is disclosed. The composition comprises a binder in which is dispersed a conductive pigment and a source of silicon. Enhanced corrosion protection is offered, without sacrificing weldability of the coating layer. The composition is app... | 12/12/2006 |
| 7125916 | Method for producing nanosilica plates The present invention relates to an exfoliating agent and to a process for producing random form of nanoscale silicate plates. Two types of exfoliating agents are applied in the present invention, which respectively have the formula: | 10/24/2006 |
| 7108920 | Reworkable compositions incorporating episulfide resins This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of whic... | 09/19/2006 |
| 7109061 | Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a... | 09/19/2006 |
| 7098276 | Flame-retardant epoxy resin composition and semiconductor device made using the same An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and... | 08/29/2006 |
| 7094822 | Thermally conductive elastomeric pad The present invention relates to thermally conductive, elastomeric pads. The pads can be made by injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally con... | 08/22/2006 |
| 7038009 | Thermally conductive elastomeric pad and method of manufacturing same The present invention relates to thermally conductive, elastomeric pads and methods for manufacturing such pads. The methods involve injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25... | 05/02/2006 |
| 7026382 | Conductive resin composition A conductive resin composition primarily comprising (A) 100 parts by weight of a thermosetting or thermoplastic resin, (B) 5–2,000 parts by weight of a conductive filler, and (C) 0.1–300 parts by weight of organic resin or rubber particulates has a low volume re... | 04/11/2006 |
| 7022410 | Combinations of resin compositions and methods of use thereof A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in c... | 04/04/2006 |
| 7019410 | Die attach material for TBGA or flexible circuitry An attachment material is provided between the die and the solder balls of a TBGA or other flexible circuitry package that is sufficiently compliant to absorb pressure between the two, so as not to apply stress to the solder balls. The attachment material is also su... | 03/28/2006 |
| 7012120 | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this... | 03/14/2006 |
| 7012320 | Semiconductor device and process for fabrication thereof A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not m... | 03/14/2006 |
| 7008982 | Surface treated silicas Disclosed is a silica substrate treated with a polysiloxane, and an organosilane, wherein the organosilane is described by the formula: RSi(R′)x(OR″)3-x; wherein R is a long-chain hydrocarbon group having between about 8 to about 30 carbon ... | 03/07/2006 |
| 7001560 | Molding resin composition and method of molding The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for post-processing such as polishing processing and laser processing. Such a resin ... | 02/21/2006 |
