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| Number | Title | Issue Date |
| 7384682 | Electronic package with epoxy or cyanate ester resin encapsulant An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper sur... | 06/10/2008 |
| 7365135 | Method for preparing a novolac phenolic resin/silica hybrid organic-inorganic nanocomposite The method of the present invention includes grafting a glycidyl alkylene trialkoxy silane to a novolac phenolic resin in an organic solvent to form a modified novolac phenolic resin; mixing a tetralkoxy silane, an acid and water with the resulting organic solution ... | 04/29/2008 |
| 7321005 | Encapsulant composition and electronic package utilizing same A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity o... | 01/22/2008 |
| 7271206 | Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability and high dielectric constant. The composition includes a) a high Tg ... | 09/18/2007 |
| 7226970 | Resin composition and molded article thereof A resin composition comprising a 2-(1-arylalkylidene) acetic ester and at least one resin selected from a methyl methacrylate resin, a styrene resin and a methyl methacrylate-styrene copolymer resin is provided, wherein the acetic ester is contained in the compositi... | 06/05/2007 |
| 7192997 | Encapsulant composition and electronic package utilizing same A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexi... | 03/20/2007 |
| 7157507 | Ultraviolet curable silver composition and related method A photocurable silver composition is provided which comprises an ultraviolet light curable organic mixture, a photoinitiator, a silver powder, and a silver flake composition. The silver flake composition comprises at least 20% of the weight of the silver powder. The... | 01/02/2007 |
| 7109591 | Integrated circuit device An integrated circuit device having a semiconductor device and an encapsulating material on at least a portion of the semiconductor device and a method for encapsulating an integrated circuit device is disclosed. The encapsulating material includes a plurality of na... | 09/19/2006 |
| 7098276 | Flame-retardant epoxy resin composition and semiconductor device made using the same An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and... | 08/29/2006 |
| 7083888 | External additive for electrostatically charged image developing toner An external additive for electrostatically charged image developing toner is provided. The additive includes spherical hydrophobic fine silica particles having primary particles with a particle diameter of from 0.01 to 5 μm and having been treated with a compound s... | 08/01/2006 |
| 7041737 | Coating powder composition, method of use thereof, and articles formed therefrom The present invention provides a low temperature curing coating powder composition comprising a mixture of a high gloss film-forming system and a low gloss film-forming system. Preferably, the high gloss film-forming system comprises a GMA (glycidyl methacrylate) re... | 05/09/2006 |
| 7008981 | Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b)... | 03/07/2006 |
| 7004799 | High temperature inhibitor material and methods of making and using the same High-temperature inhibitor materials for use with electrical connections in energy transmission and distribution systems where operating temperatures exceed 150° C. The high-temperature inhibitor materials comprise base oils and conductive particles, wherein the hi... | 02/28/2006 |
| 6974847 | Melt compounded fusion bonded marine anti-fouling coating Anti-fouling coating composition containing high amounts of zinc, and novel methods of applying melt compounded anti-fouling coating compositions to components by heat fusion techniques. The components that can be treated include fresh water or salt water exposed co... | 12/13/2005 |
| 6939932 | Initiator systems, polymerisable compositions, and uses thereof for bonding low surface energy substrates Use of an initiator system comprising: a combination of an organoborane and a polyaziridine, in a ratio of aziridine groups to boron atoms of greater than 1.3:1, as an initiator of polymerisation in an ad... | 09/06/2005 |
| 6855197 | Tooth cavity restoration with nanocomposite of epoxy resin and nanoparticles A method of restoring a tooth cavity is conducted by a direct or indirect method with a visible light curable nanocomposite of a dental restorative material with a low polymerization shrinkage, wherein the dental restorative material comprises an epoxy resin, inorga... | 02/15/2005 |
| 6830815 | Low wear and low friction coatings for articles made of low softening point materials The present invention relates to an anti-friction and anti-wear liquid coating composition for use with parts made of materials that have softening points below about 300° F. and articles so coated. The present invention also relates to a method of coating parts ma... | 12/14/2004 |
| 6737157 | Coating type reinforcement composition of sheet metal The present invention provides a coating type reinforcement composition of sheet metal which can be applied under warming for ensuring satisfactory levels of tensile rigidity and resistance to dent of a thin sheet metal mainly due to weight reduction of an automobil... | 05/18/2004 |
| 6730402 | Flame-retardant epoxy resin composition and laminate made with the same A flame-retardant epoxy resin composition includes an epoxy resin, a curing agent, and a metal hydroxide, wherein the curing agent as a phenolic resin (C) containing, in the molecular chain, structural units derived from a phenol (A) and structural units derived fro... | 05/04/2004 |
| 6706405 | Composite coating for imparting particel erosion resistance Erosion resistant coating compositions comprising a poly(Bisphenol A-co-epichlorohydrin) glycidyl end-capped component, an active hydrogen compound, a linear siloxane and a silsesquioxane. Protective coatings formed from such a composition impart particle-erosion re... | 03/16/2004 |
| 6699351 | Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after conne... | 03/02/2004 |
| 6592783 | Anisotropic conductive adhesive film An anisotropic conductive adhesive film contains a first insulating adhesive layer, a second insulating adhesive layer whose modulus of elasticity after curing is less than the modulus of elasticity of the cured first insulating adhesive layer, and electr... | 07/15/2003 |
| 6565772 | Conductive resin composition A conductive resin composition includes between 40 and 140 parts by weight of reactive epoxy resin, between 15 and 40 parts by weight of a reactive monofunctional glycidyl material, a cure accelerant, and 40 to 200 parts by weight of a conductive particul... | 05/20/2003 |
| 6566422 | Connecting material A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high ... | 05/20/2003 |
| 6562179 | High relative-permittivity B-staged sheet, high relative-permittivity prepreg, its production process, and printed wiring board comprising any one of these A high relative-permittivity B-staged sheet obtained by incorporating an insulating inorganic filler having a relative permittivity of at least 500 at room temperature into a solvent-less resin component so as to have an insultaing inorganic filler conten... | 05/13/2003 |
| 6528552 | Resist composition excellent in flame resistance A resist composition for permanent protective coating of a printed wiring board, which resist composition is excellent in flame resistance and is obtained by incorporating as essential components a flame retardant containing 100 to 140 parts by weight of ... | 03/04/2003 |
| 6518332 | Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 μm and a specific surface of 1... | 02/11/2003 |
| 6337362 | Ultraviolet resistant pre-mix compositions and articles using such compositions The compositions described include micronized zinc oxide UV blocking agents with at least one organic UV protective compound. Premix compositions are provided for imparting improved UV resistance to paints, coatings, finishes and plastic articles comprisi... | 01/08/2002 |
| 6329475 | Curable epoxy vinylester composition having a low peak exotherm during cure The invention is a curable resin composition comprising A) an epoxy vinylester resin or a polyester resin; B) a polymerizable monomer; C) a chelating agent; and D) a copper salt or complex of copper with an alcohol, aldehyde or ketone; and E) an inhibitor... | 12/11/2001 |
| 6322620 | Conductive ink composition A thermoset conductive ink for use in through hole interconnections or similar electric and electronic applications to provide stable electrical connections. The conductive ink of this invention comprises a thermal curable resin system having an admixing ... | 11/27/2001 |
| 6319619 | Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device The present invention relates to a semiconductor encapsulating resin composition which is safe and superior in moisture resistance, flame retardance and moldability, and to a highly reliable semiconductor device which is fabricated by encapsulating a semi... | 11/20/2001 |
| 6300402 | Compositions created by the separation and isolation of the metallic and non-metallic constituent components of printed wiring assemblies and printed wiring boards An apparatus separates a substantially metallic portion from a substantially non-metallic portion or constituent components of at least one electrical product, comprising a plurality of crushing machines, such as a first crushing machine and a second crus... | 10/09/2001 |
| 6294597 | Curable polymeric composition and use in protecting a substrate A curable polymeric composition which is a liquid at 20° C. and which comprises 25 to 60% by weight of a resin component which comprises an epoxy, 5 to 25% by weight of a curing agent which comprises two components, a first component which is a cycloalip... | 09/25/2001 |
| 6193910 | Paste for through-hole filling and printed wiring board using the same A paste for filling through-holes of a printed wiring board contains 100 parts by weight of an epoxy resin composition containing 90 to 99.5 parts by weight of an epoxy resin and 0.5 to 10 parts by weight of a curing agent; and (B) 500 to 1000 parts by we... | 02/27/2001 |
| 6146488 | Weld bonding method The present invention is a weld bonding method providing adhesion by both an adhesive and resistance spot welding, and includes application of an adhesive including a thermosetting epoxy resin, a latent curing agent and 1 to 15 vol % of one or more additi... | 11/14/2000 |
| 6120858 | Black sealant for liquid crystal cell and liquid crystal cell Provided is a black sealant for liquid crystal cell comprising (a) an epoxy resin, (b) a novolac resin, (c) a curing accelerator and (d) a titanium-type black pigment. The use of the black sealant for liquid crystal cell of the present invention can provi... | 09/19/2000 |
| 6110993 | Thermosetting epoxy resin composition The present invention provides a thermosetting epoxy resin composition which copes with both storage stability and curing properties at a low temperature. A thermosetting epoxy resin composition of the present invention comprises (A) an epoxy resin, and (... | 08/29/2000 |
| 6017983 | Color indicator for completion of polymerization for thermosets An indicator for complete polymerization and cure of base-catalyzed epoxy thermoset resin systems is disclosed. In particular, the present invention makes use of an diazo dye having amino groups which forms a salt or complex with hardeners used in various... | 01/25/2000 |
| 6008462 | Mar resistant, corrosion inhibiting, weldable coating containing iron powder for metal substrates A weldable heat curable liquid coating composition for steel is provided that exhibits improved mar resistance without impairing the weldability characteristics of the coating. To this end, the composition contains a conductive welding aid of iron dust. T... | 12/28/1999 |
| 5981629 | Epoxy system for bonding to unsanded polymer-coated fiberglass surfaces A two-component system for forming a sealing composition for bonding to unsanded, polymer-coated fiberglass surfaces. The system includes a resin component containing a major amount of epoxy resin, glycidoxy silane (0-2.5 wt. %) and hydrophilic-modified p... | 11/09/1999 |
