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| Number | Title | Issue Date |
| 8114925 | Intercalation agent free compositions useful to make nanocomposite polymers A method for preparing a filler composition useful for preparing a nanocomposite polymer is provided. The method includes a first step of dispersing a water dispersible filler material in a liquid comprising water to form a dispersion and a second step of replacing ... | 02/14/2012 |
| 8039530 | High thermal conductivity materials with grafted surface functional groups The present invention provides a continuous high thermal conductivity organic-inorganic composite material. The composite material features high thermal conductivity materials bonded to a host resin matrix by covalent linkages. The bonding takes place through surfac... | 10/18/2011 |
| 7947764 | Cationic electrodeposition coating compositions This invention provides a cationic electrodeposition coating composition which exhibits high paint stability, forms coating film excelling in conductivity, intimate adhesion, corrosion resistance, finished appearance and acid resistance, and is capable of forming un... | 05/24/2011 |
| 7910638 | Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device A semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) carbon black is prepared by mixing a carbon black feedstock and the curing agent with an organic solvent, filteri... | 03/22/2011 |
| 7439285 | Liquid thermosetting ink Liquid thermosetting ink for ink-jet applications includes at least a resin, at least one solid latent curing agent having a maximal particle size of less than 2 microns and an inert filler having fine particles. The single-pack or two-pack ink has a viscosity lower... | 10/21/2008 |
| 7405246 | Cure system, adhesive system, electronic device A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive syste... | 07/29/2008 |
| 7381359 | Method for making filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 06/03/2008 |
| 7368170 | Viscous chemical anchoring adhesive A chemical anchoring adhesive includes a first part having a viscosity of about 200,000 to about 4,000,000 centipoise and a second part having a viscosity of about 200,000 to about 4,000,000 centipoise. The chemical anchoring adhesive can be in the form of a slug or... | 05/06/2008 |
| 7357883 | Conductive adhesive, method of producing the same, and bonding method A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating ... | 04/15/2008 |
| 7312104 | Resin composition for encapsulating semiconductor device A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide s... | 12/25/2007 |
| 7311140 | Heat sink assembly with overmolded carbon matrix A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with... | 12/25/2007 |
| 7311972 | Filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 12/25/2007 |
| 7304102 | Process for making encapsulant for opto-electronic devices An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of r... | 12/04/2007 |
| 7294660 | Epoxy resin composition An epoxy resin composition which comprises 100 parts by weight of an epoxy resin and 1 to 800 parts by weight of an aluminum borate whisker having an average fiber diameter of 0.25 μm or less. The epoxy resin composition contains a large amount of the aluminum bora... | 11/13/2007 |
| 7282266 | Corrosion and alkali-resistant compositions and methods for using the same A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially mela... | 10/16/2007 |
| 7279223 | Underfill composition and packaged solid state device An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized c... | 10/09/2007 |
| 7271206 | Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability and high dielectric constant. The composition includes a) a high Tg ... | 09/18/2007 |
| 7247661 | Masterbatch pellet mixture A mixture including a high specific gravity masterbatch pellets group (A) with specific gravity within a range from 1.8 to 3.5, and a low specific gravity masterbatch pellets group (B) with specific gravity within a range from 0.5 to 1.6. The high specific gravity m... | 07/24/2007 |
| 7230047 | Reformable compositions The present invention relates to curable elastomer compositions and deformable thermoplastic compositions which are reshapable subsequent to cure or solidification. In particular, the present invention relates to compositions and articles of manufacture which are pr... | 06/12/2007 |
| 7223472 | Gloss pigments having high colour saturation The invention relates to coloured gloss pigments having specific particle dimensions comprising a transparent core of a silicon oxide of the composition SiO0.03 to SiO0.95 and, optionally, further coatings of silicon dioxide, carbon, a partiall... | 05/29/2007 |
| 7166669 | Laser beam weldable thermoplastic molding materials Dark-colored thermoplastic molding compositions are disclosed. The compositions are suitable for making molded parts which in the wavelength region from 700 to 1200 nm are laser-transmitting, at least in spectral partial regions, and may be welded to laser-absorbing... | 01/23/2007 |
| 7157507 | Ultraviolet curable silver composition and related method A photocurable silver composition is provided which comprises an ultraviolet light curable organic mixture, a photoinitiator, a silver powder, and a silver flake composition. The silver flake composition comprises at least 20% of the weight of the silver powder. The... | 01/02/2007 |
| 7157119 | Method and compositions for applying multiple overlying organic pigmented decorations on ceramic substrates A pigmented curable composition adapted for decorating ceramic substrates (e.g., glass bottles) comprises curable organic binder and solid spherical particles (glass or polymer) having diameters of 10 to 50 microns for facilitating overprinting of additional layers.... | 01/02/2007 |
| 7157313 | Epoxy resin composition and semiconductor device using thereof The present invention provides an epoxy resin composition for packaging a semiconductor device, characterized in having improved mold releasability during a molding process, continuous-moldability and improved solder resistance. According to the present invention, t... | 01/02/2007 |
| 7147927 | Biaxially oriented polyester film and laminates thereof with copper Disclosed are biaxially oriented polyester film produced from a polyester comprising: (1) diacid residues comprising at least 90 mole percent of terephthalic acid residues, naphthalenedicarboylic acid residues or combinations thereof; and (... | 12/12/2006 |
| 7118837 | Photoimaged dielectric polymer and film, and circuit package containing the same Photoimagable polymers, as well as dielectric materials and their manufacture and use in the production of printed circuit boards and printed wiring boards are described. The polymers comprise between about 30 and about 70 parts of a polyfunctional resin and between... | 10/10/2006 |
| 7101596 | Liquid crystal sealant, liquid crystal display device using the same and method for producing the device A liquid crystal sealant comprising an epoxy resin represented by the following formula (1): [Formula 1] (in the formula, n denotes an average polymerization degree and is a positive number of 0–5) as a ... | 09/05/2006 |
| 7094822 | Thermally conductive elastomeric pad The present invention relates to thermally conductive, elastomeric pads. The pads can be made by injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally con... | 08/22/2006 |
| 7059665 | CFRP plate material and method for preparation thereof A light-weight, highly rigid, high-strength environment-friendly fiber-reinforced plastic (hereinafter, CFRP) board having a surface quality that can endure long-term use suitable for use in automobiles and the like is provided. A method for making the same is also ... | 06/13/2006 |
| 7060246 | Magnesium hydroxide particles, method of the production thereof, and resin composition containing the same Provided are magnesium hydroxide particles having a hexagonal crystal form and having an aspect ratio (H) which satisfies the following expression (I), 0.45·A·B | 06/13/2006 |
| 7053312 | Flexible wiring boards A flexible wiring board are formed by growing metal bumps using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps can be formed with good precision because laser beam is not used to form opening i... | 05/30/2006 |
| 7038009 | Thermally conductive elastomeric pad and method of manufacturing same The present invention relates to thermally conductive, elastomeric pads and methods for manufacturing such pads. The methods involve injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25... | 05/02/2006 |
| 7037953 | Radiation curable aqueous compositions A method for producing a solvent resistant, low-extractable, film from an actinic radiation curable homogenous aqueous composition containing a water soluble compound, having at least one alpha, beta-ethylenically unsaturated radiation polymerizable double bond, and... | 05/02/2006 |
| 7033013 | Pretreatment liquid for recording material and image recording method using the pretreatment liquid An image recording method including: applying a pretreatment liquid on a surface of a recording material; and discharging a recording ink according to image signals to form an ink image on the pretreatment liquid on the surface of the recording material before the p... | 04/25/2006 |
| 7022410 | Combinations of resin compositions and methods of use thereof A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in c... | 04/04/2006 |
| 7008981 | Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b)... | 03/07/2006 |
| 7008982 | Surface treated silicas Disclosed is a silica substrate treated with a polysiloxane, and an organosilane, wherein the organosilane is described by the formula: RSi(R′)x(OR″)3-x; wherein R is a long-chain hydrocarbon group having between about 8 to about 30 carbon ... | 03/07/2006 |
| 6979722 | Process for production of alkyllene oxide polymers According to a process for production of alkylene oxide polymers offered by the present invention, an alkylene oxide is subjected to a polymerization reaction under presence of a catalyst in a solvent containing an aliphatic hydrocarbon having from five to seven car... | 12/27/2005 |
| 6964994 | Polyreactions in non-aqueous miniemulsions The invention relates to a method of conducting polymerization in nonaqueous miniemulsions. ... | 11/15/2005 |
| 6946541 | Composition based on renewable raw materials The present invention relates to a composition based on renewable raw materials which is particularly characterized by containing at least one tin-containing compound, an article made thereof as well as a process for the preparation of such an article. The compositi... | 09/20/2005 |
