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| Number | Title | Issue Date |
| 8022119 | Epoxy and silane group-containing oligomers and polymers and a method for the production and the use thereof Oligomers and polymers containing epoxide groups and silane groups and preparable by reacting (A) at least one low molecular mass, oligomeric or polymeric compound containing at least two epoxide groups (a1) with (B) at least one silane con... | 09/20/2011 |
| 7351784 | Chip-packaging composition of resin and cycloaliphatic amine hardener A chip-packaging composition includes a thermosetting resin and at least one of an N-heterocyclic carbene adduct, an imidazole, and a cycloaliphatic amine hardener. The chip-packaging composition is applied to flip-chip technology during no-flow underfill mounting o... | 04/01/2008 |
| 7329715 | Abrasion resistant coatings by siloxane oligomers A process including forming a siloxane oligomer from a mixture including at least one alkoxysilane, at least one phase transfer catalyst, and water, and adding at least one latent curing catalyst to the siloxane oligomer to form a coating composition is described. A... | 02/12/2008 |
| 7312261 | Thermal interface adhesive and rework A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved metho... | 12/25/2007 |
| 7282266 | Corrosion and alkali-resistant compositions and methods for using the same A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially mela... | 10/16/2007 |
| 7273687 | Toner fuser member having release layer formed from glycidyl end-capped polymer and perfluoroalkyl glycidyl-reactive compound A toner fuser member has a substrate, on which is formed a toner release surface layer from a composition that includes: about 95 wt. % to about 99.9 wt. % of a cross-linked, glycidyl end-capped bisphenolic polymer having the formula | 09/25/2007 |
| 7268174 | Homogeneous alumoxane-LCT-epoxy polymers and methods for making the same The present invention relates to homogeneous alumoxane-LCT-epoxy polymers and methods for making the same. The homogeneous alumoxane-LCT-epoxy polymers comprise alumoxane-containing sub-structures evenly dispersed and essentially completely co-reacted with the LCT-e... | 09/11/2007 |
| 7268181 | Volume-modified casting compounds based on polymeric matrix resins Bulk-modified potting composition based on a curable epoxy resin or on a mixture of these resins, where the resin or the mixture is composed of an epoxy resin, a hardener, where appropriate an accelerator, and also other additives, such as fillers, flexibilizers, an... | 09/11/2007 |
| 7241722 | Sliding component A sliding component has a metal base member and a coating layer. The metal base member has a sliding surface. The layer is made of silane-modified resin. The silane-modified resin is made from resin that is soluble in solvent and is equal to or higher in heat-resist... | 07/10/2007 |
| 7238755 | Branched siloxane polymers comprising alkenyl groups and used as antimisting additives for silicone coating compositions Highly branched alkenyl-functional organopolysiloxane polymers are highly efficient antimisting additives for use in the preparation of silicone release coatings in high speed coating operations. The antimisting additives are miscible with the crosslinkable silicone... | 07/03/2007 |
| 7183363 | Thermally conductive casting compound A resin-based casting compound which cures by a chemical reaction is described; it is suitable in particular for insulation of electric components and it contains an epoxy resin component (A), a silicone-containing component (B), a filler (C), by the choice of which... | 02/27/2007 |
| 7160963 | Toner fuser member with release layer formed from silsesquioxane-epoxy resin composition A toner fuser member contains a substrate on which is disposed a toner release surface layer formed from a composition that includes a silsesquioxane and a curable epoxy resin. On curing, the composition forms an interpenetrating polymer network of the silsesquioxan... | 01/09/2007 |
| 7147897 | Weldable compositions comprising a conductive pigment and silicon and methods for using the same A weldable coating composition is disclosed. The composition comprises a binder in which is dispersed a conductive pigment and a source of silicon. Enhanced corrosion protection is offered, without sacrificing weldability of the coating layer. The composition is app... | 12/12/2006 |
| 7108920 | Reworkable compositions incorporating episulfide resins This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of whic... | 09/19/2006 |
| 7105591 | Blends of polyarylether sulphone and polyamide, with improved viscosity and flowability The thermoplastic molding composition comprises components A, C, D, E and, where appropriate, B, F and G, the total weight of which is 100% by weight, and also component H: a) as component A, from 5 to 94.8% by weight of at least one polyaryl ether sulf... | 09/12/2006 |
| 7087304 | Polysulfide-based toughening agents, compositions containing same and methods for the use thereof In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polysulfides have been found to be useful toughening agents of comp... | 08/08/2006 |
| 7084194 | Halogen-free resin composition A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): | 08/01/2006 |
| 7064157 | Flame retardant resin and flame retardant composition containing the same The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: | 06/20/2006 |
| 7060761 | Epoxy resin compositions An epoxy resin composition comprising (i) a compound having at least two epoxy groups in a molecule as a main component, (ii) a fluorene skeleton-bearing, silicone-modified phenolic resin as a curing agent, and (iii) an organophosphorus compound, amine compound or i... | 06/13/2006 |
| 7056978 | Toughened epoxy-anhydride no-flow underfill encapsulant A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment... | 06/06/2006 |
| 7037586 | Film for circuit board The present invention relates to a film for a circuit board characterized in that the following A layer is adjacent to the following B layer is disclosed in the present application. A circuit board excellent in adhesion strength of a conductor layer can easily be pr... | 05/02/2006 |
| 7033670 | LCT-epoxy polymers with HTC-oligomers and method for making the same The present invention relates to homogenous LCT-epoxy polymers with oligomers containing grafted nano-sized HTC-materials and methods for making the same. The homogenous LCT-epoxy polymers with oligomers containing grafted nano-sized HTC-materials comprise HTC-oligo... | 04/25/2006 |
| 7026400 | Ambient temperature curing coating composition Ambient temperature curing coating composition comprising a polysiloxane having the formula: wherein each R1 is selected from the group consisting of alkyl, aryl, and alkoxy groups having up ... | 04/11/2006 |
| 7019042 | Thixotropic agent that can be activated using actinic radiation, a method for its production and the use thereof A novel thixotropic agent comprising urea crystals which comprises at least one compound containing at least one functional group having at least one bond which can be activated with actinic radiation; a novel process for preparing a thixotropic agent comprising ure... | 03/28/2006 |
| 7012320 | Semiconductor device and process for fabrication thereof A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not m... | 03/14/2006 |
| 6960636 | Thermosetting resin compositions containing maleimide and/or vinyl compounds In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. ... | 11/01/2005 |
| 6805958 | Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same The present invention provides an epoxy resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight o... | 10/19/2004 |
| 6800373 | Epoxy resin compositions, solid state devices encapsulated therewith and method Epoxy resin compositions are disclosed which comprise (A) at least one silicone resin, (B) at least one epoxy resin, (C) at least one anhydride curing agent, (D) at least one siloxane surfactant, and (E) at least one ancillary curing catalyst. Also disclosed are a p... | 10/05/2004 |
| 6779656 | Polymerizable preparations based on epoxides that contain silicon The invention relates to polymerizable preparations which contain: (a) 3 to 80 wt. % of an epoxy or of a mixture of epoxies of general formula (I), whereby n and m, independent of one another, represent 0, 1, 2 or 3, and n+m ranges from 2 to 6, and whereby the molar... | 08/24/2004 |
| 6743510 | Composition comprising a cationic polymerization compound and coating obtained from the same A composition comprising a cationic polymerization compound and a porous fine particle, a coating made from the composition and a laminated plate comprising a substrate and the coating are provided. The coating is superior in adhering properties to a substrate and i... | 06/01/2004 |
| 6740469 | Developer-soluble metal alkoxide coatings for microelectronic applications Anti-reflective compositions and methods of using these compositions to form circuits are provided. The compositions comprise a polymer dissolved or dispersed in a solvent system. In a preferred embodiment, the polymers of the composition include recurring units hav... | 05/25/2004 |
| 6720077 | Resin composition, and use and method for preparing the same The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has... | 04/13/2004 |
| 6645631 | Flame retardant phosphorus element-containing epoxy resin compositions A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including: (I) a non-halogenated epoxy resin material selected from: (A) a non-halogenated phosphorus element-containing epoxy resin; (B) a mixture of... | 11/11/2003 |
| 6632860 | Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener A process for coating a solid surface comprises 1) applying onto a solid surface a primer coating prepared from an amine curing agent, a polysulfide toughening agent, an epoxy resin, a rubber toughening agent, a fire retardant, a glass fiber thixotrope, an... | 10/14/2003 |
| 6624216 | No-flow underfill encapsulant A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst. In an alternative embodiment, the compo... | 09/23/2003 |
| 6617028 | Phosphorus and nitrogen containing resin hardener and a flame retarding resin composition containing said hardener The present invention discloses a phosphorus- and nitrogen-containing resin hardener, which has a structure represented by the following formula: ##STR1## wherein R2 represents a hydrogen atom or a group represented by the following formula: ... | 09/09/2003 |
| 6555601 | Process for impregnating electrical coils, and selected epoxy composition for carrying out the impregnation A process for impregnating an electrical coil which comprises a winding comprising two or more layers consisting of more than one turn of an electrically conducting wire-form material with a polymer material which electrically insulates the individual tur... | 04/29/2003 |
| 6508910 | Self-adhesive prepreg face sheet for sandwich panels Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control... | 01/21/2003 |
| 6509395 | Defoamers for pigment dispersants Branched polymer defoamers for pigment dispersants. The branched polymers are the reaction products of a linking agent defined by formula (I): R(Y)3 (I) wherein each Y group is a halogen atom or one Y group is a halogen atom and two Y groups togeth... | 01/21/2003 |
| 6506822 | Epoxy resin composition An epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a silicone stress-reducing agent further includes (D) a foam-suppressing composition comprising (D-i) an oil compound consisting of a hydrophobic organopolysiloxane and ... | 01/14/2003 |
