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| Number | Title | Issue Date |
| 7521494 | Epoxy resin, SMA copolymer and bis-maleimidetriazine resin This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition. ... | 04/21/2009 |
| 7435451 | Coating with sides of amine curing agent and rubber toughener, and epoxy resin and epoxide-containing toughener This invention concerns an epoxy coating for use as a non-skid surface for applications such as the deck of an aircraft carrier. The epoxy coating can be formulated from (a) an amine curing agent, (b) an epoxide-containing toughening agent such as a polysulfide and/... | 10/14/2008 |
| 7435767 | Manufacturing sides of amine curing agent and rubber toughener, and epoxy resin and epoxide-containing toughener This invention concerns an epoxy coating for use as a non-skid surface for applications such as the deck of an aircraft carrier. The epoxy coating can be formulated from (a) an amine curing agent, (b) an epoxide-containing toughening agent such as a polysulfide and/... | 10/14/2008 |
| 7286367 | Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the r... | 10/23/2007 |
| 7285579 | Solventless, non-polluting radiation curable coatings Solventless siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass are disclosed. The compositions are cationically curable in air by U.V. or by electron beam radiation. The siloxane epoxy coating compositions exhibit excellent film p... | 10/23/2007 |
| 7247667 | Particle containing solid surface material A liquid composition which is a precursor to a solid surface material comprises a liquid polymerizable component and two different solid particle distributions with an added polycarboxylic acid or salt retarding or preventing particle settling. ... | 07/24/2007 |
| 7217595 | Sealed three dimensional metal bonded integrated circuits The invention provides a sealing layer that seals metal bonding structures between three dimensional bonded integrated circuits from a surrounding environment. A material may be applied to fill a volume between the bonded integrated circuits or seal the perimeter of... | 05/15/2007 |
| 7170184 | Treatment of a ground semiconductor die to improve adhesive bonding to a substrate Methods are provided to improve the adhesive bonding of a semiconductor die to a substrate through an adhesive paste by forming a layer of silicon dioxide on the back surface of the semiconductor die prior to applying the adhesive paste. Contacting the semiconductor... | 01/30/2007 |
| 7144763 | Epoxy resin compositions, solid state devices encapsulated therewith and method Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal st... | 12/05/2006 |
| 7108919 | Reactive non-isocyanate coating compositions Reactive, non-isocyanate coating compositions prepared by mixing epoxy, tertiary amine, anhydride, hydroxy- and, optionally, acid functional compounds, a system of making the coating composition, a method of coating the composition on a substrate and a substrate coa... | 09/19/2006 |
| 7101933 | Process for producing high speed transmitting dielectric material A process for producing high speed transmitting dielectric materials comprises essentially mixing and reacting a proportion of polyphenylene ether (PPE) with a proportion of an epoxy resin of the type of low bromine content in a non-polar solvent in the presence of ... | 09/05/2006 |
| 7053133 | Ultraviolet activatable adhesive film An ultraviolet activatable adhesive film comprising an epoxy resin, an ultraviolet activatable cationic polymerization catalyst and cationic polymerization inhibitor and water in an amount effective to suppress the cationic polymerization of the film and prolong the... | 05/30/2006 |
| 7041736 | Anhydride polymers for use as curing agents in epoxy resin-based underfill material An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer cur... | 05/09/2006 |
| 7037958 | Epoxy coating This invention concerns an epoxy coating for use as a non-skid surface for applications such as the deck of an aircraft carrier. The epoxy coating can be formulated from (a) an amine curing agent, (b) an epoxide-containing toughening agent such as a polysulfide and/... | 05/02/2006 |
| 7012120 | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this... | 03/14/2006 |
| 6962948 | Solventless, non-polluting radiation and thermal curable coatings Solventless siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass are disclosed. The compositions are cationically curable in air by heat or by electron beam radiation. The siloxane epoxy coating compositions exhibit excellent film p... | 11/08/2005 |
| 6955739 | Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet radiation to provide an activated adhesive film having a first activated su... | 10/18/2005 |
| 6939431 | Paste for circuit connection, anisotropic conductive paste and uses thereof Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and... | 09/06/2005 |
| 6933179 | Method of packaging semiconductor device When a wafer, which has completed a wafer process and has a main surface on which a plurality of bumps respectively connected to a plurality of electrode pads are formed, is brought into a resin molded type package to thereby manufacture a semiconductor device, a me... | 08/23/2005 |
| 6924328 | Stabilized coating compositions A coating composition includes a thermoplastic dispersion and a stabilizer. The stabilizer includes the reaction product of an epoxy resin and an acid, wherein the stabilizer has at least two oxirane functional groups per molecule. ... | 08/02/2005 |
| 6924438 | Epoxy sight bowls for use in power transformers A cured filler-less epoxy compound formed as a rigid, three-dimensional, transparent structure, including a cylindrical sight bowl of a utility or industrial high voltage bushing. A process for making a three-dimensional (e.g., cylindrical), transparent structure wi... | 08/02/2005 |
| 6919385 | Energy-ray curing resin composition An energy-ray curing resin composition comprising a photopolymerizable resin component which can be cured by irradiation with an energy ray, a photopolymerization initiator component which makes it possible to cure the above photopolymerizable resin component by irr... | 07/19/2005 |
| 6918984 | Photocurable adhesive compositions, reaction products of which have low halide ion content The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractab... | 07/19/2005 |
| 6916889 | Epoxy resin compositions, solid state devices encapsulated therewith and method Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal st... | 07/12/2005 |
| 6884854 | Composition of epoxy resin, low glass transition temperature copolymer, latent hardener and carboxy-terminated polyamide and/or polyamide Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder component for epoxy resin compo... | 04/26/2005 |
| 6881768 | Water-based epoxy grout A tile grout composition and method of using the tile grout composition to grout set tiles are provided. The tile grout composition is a water-based epoxy grout composition which has excellent stain and chemical resistant properties and is workable and easy to clean... | 04/19/2005 |
| 6844379 | Long and short-chain cycloaliphatic epoxy resin, cyanate ester and Lewis and Bronsted catalysts Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Pr... | 01/18/2005 |
| 6787606 | Electrochromic device with composition of epoxy resin, toughener and latent curative A composition useful as a sealing element for electrochromic devices comprises (a) an epoxy resin component including at least two of a dicyclopentadiene epoxy resin, a naphthalene epoxy resin, a bisphenol A epoxy resin, a bisphenol F epoxy resin and a novola... | 09/07/2004 |
| 6770965 | Wiring substrate using embedding resin A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an... | 08/03/2004 |
| 6743510 | Composition comprising a cationic polymerization compound and coating obtained from the same A composition comprising a cationic polymerization compound and a porous fine particle, a coating made from the composition and a laminated plate comprising a substrate and the coating are provided. The coating is superior in adhering properties to a substrate and i... | 06/01/2004 |
| 6506820 | Method for manufacture of particles for powder coating A method for manufacture of particles for powder coating is disclosed in which the particles are prepared from a suspension obtained from a mixture of a thermosetting resin solution and an aqueous solution containing a water-soluble polymer. The thermoset... | 01/14/2003 |
| 6500564 | Semiconductor encapsulating epoxy resin composition and semiconductor device An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 μm is suited for semiconductor package encapsula... | 12/31/2002 |
| 6489380 | Long and short-chain cycloaliphatic epoxy resins with cyanate ester Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid c... | 12/03/2002 |
| 6387990 | Curable epoxy resin compositions with brominated triazine flame retardants A curable composition is formulated from an epoxy resin; a flame-retardant additive essentially free of phenolic groups and of epoxy groups; and a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ethe... | 05/14/2002 |
| 6388009 | Carboxyl or anhydride-functional styrene/p-alkylstyrene copolymer, epoxy resin and curing agent A low dielectric constant composition used in electric circuit boards is disclosed. The composition includes (a) 20-99.9 parts by weight of a functionalized syndiotactic styrene/para-alkystyrene copolymer having microfoaming when being cured; (b) 0.01-80 ... | 05/14/2002 |
| 6376053 | Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same An inter-laminar adhesive composition containing: (A) a liquid epoxy resin; (B) a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and (C) a latent e... | 04/23/2002 |
| 6359038 | Arc-quenching fuse tubes Arc-quenching fuse tubes comprising an elongated tubular body having an inner arc-quenching surface layer which comprises an arc-quenching matrix comprising a fibrous material and an arc-quenching composition. The arc-quenching compositions comprise a cur... | 03/19/2002 |
| 6316528 | Thermosetting resin compositions The present invention provides a thermosetting resin composition useful as an underfilling sealing resin which enables a semiconductor device, such as a CSP/BGA assembly which includes a semiconductor chip mounted on a carrier substrate, to be securely co... | 11/13/2001 |
| 6265469 | Epoxy resin adhesive for flexible printed circuits Epoxy resin adhesive formulations are disclosed which improve the bonding strength of laminates without loss of flexibility. These epoxy resin adhesive formulations comprise one or more epoxy resins, rubber compounds, curing compounds, a hindered piperidi... | 07/24/2001 |
| 6235842 | Phase-separated carboxyl group-containing elastomer modified phoenoxy resin optionally with epoxy resin The present invention provides a phase-separation structure comprising a phenoxy resin modified with a carboxylated elastomer, prepared from a phenoxy resin and a carboxylated elastomer, the resin and the elastomer constituting a phase-separation structur... | 05/22/2001 |
