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| Number | Title | Issue Date |
| 8097664 | Cationic electrodeposition coating composition A cationic electrodeposition coating composition including amino group-containing modified epoxy resin (A), blocked polyisocyanate curing agent (B), phenol resin (C), metal compound (D), and nitrogen oxide ion (E), wherein the metal compound (D) is contained in an a... | 01/17/2012 |
| 8097665 | Cationic electrodeposition coating composition A cationic electrodeposition coating composition including amino group-containing modified epoxy resin (A), blocked polyisocyanate curing agent (B), metal compound (C), and nitrogen oxide ion (E), wherein metal compound (C) is contained in an amount of 10 to 10,000 ... | 01/17/2012 |
| 8044119 | Insulating material of epoxy compound, acrylic resin, ceramic particles and curing agent An insulating material and the method of applying the insulating material to products and systems. The material, method and system may be applied to tubulars used in deep water projects. The insulating material is composed of ceramic particles, epoxy and an acrylate... | 10/25/2011 |
| 7745515 | Composition of dihydrobenzoxazine resin, epoxy resin(s), novolac resin and curing promoter The present invention relates to an epoxy resin varnish composition with high glass transition temperature for laminate plate, wherein the resin composition comprises: (A) a new dihydrobenzoxazine thermosetting resin obtained by reacting compounds: (a) phenolic prod... | 06/29/2010 |
| 7435451 | Coating with sides of amine curing agent and rubber toughener, and epoxy resin and epoxide-containing toughener This invention concerns an epoxy coating for use as a non-skid surface for applications such as the deck of an aircraft carrier. The epoxy coating can be formulated from (a) an amine curing agent, (b) an epoxide-containing toughening agent such as a polysulfide and/... | 10/14/2008 |
| 7435767 | Manufacturing sides of amine curing agent and rubber toughener, and epoxy resin and epoxide-containing toughener This invention concerns an epoxy coating for use as a non-skid surface for applications such as the deck of an aircraft carrier. The epoxy coating can be formulated from (a) an amine curing agent, (b) an epoxide-containing toughening agent such as a polysulfide and/... | 10/14/2008 |
| 7368057 | Method and system for removing residual water from excess washcoat by ultrafiltration A washcoat coating composition is disclosed that includes at least one water insoluble organic solvent and at least one polymer, such as an epoxy acrylic copolymer. A method of removing residual water from a mixture of residual water and washcoat using ultrafiltrati... | 05/06/2008 |
| 7361290 | Electroconductive resin, composition useful for forming electroconductive resin, and method of producing electroconductive resin An object of the present invention is to provide a composition useful for forming an electroconductive resin, the composition comprising a resin and a vapor-growth carbon fiber compounded with the resin, and which can be easily formed into a thin film, and to provid... | 04/22/2008 |
| 7351783 | Composition to be used in paints A paint composition has a resin constituent which includes (i) a non-aromatic epoxy resin, (ii) a polysiloxane and (iii) an epoxysilane. The paint composition has an anti-corrosive effect. ... | 04/01/2008 |
| 7301222 | Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages An apparatus and method for enhancing the formation of fillets around the periphery of assembled wafer-level chip scale packages when mounted onto substrates. The method includes fabricating a plurality of integrated circuit die on a first surface of a semiconductor... | 11/27/2007 |
| 7300610 | Method for forming cavities of complex configuration within concrete A form for creating cavities within large concrete structures, wherein the formed is created by interconnecting a plurality of section members, the section members having flexible mold skeleton members retaining polymer-aggregate panel members, and wherein the form ... | 11/27/2007 |
| 7294660 | Epoxy resin composition An epoxy resin composition which comprises 100 parts by weight of an epoxy resin and 1 to 800 parts by weight of an aluminum borate whisker having an average fiber diameter of 0.25 μm or less. The epoxy resin composition contains a large amount of the aluminum bora... | 11/13/2007 |
| 7247596 | Stabilized organoborane polymerization initiators and polymerizable compositions The invention is polymerizable compositions comprising in one part an organoboron compound capable of forming a free radical generating species and a stabilizing amount of one or more compounds comprising a dihydrocarbyl hydroxyl amine, an alicyclic hydroxyl amine, ... | 07/24/2007 |
| 7213739 | Underfill fluxing curative The invention is directed to a fluxing curative for curing an underfill that comprises an epoxy resin and for fluxing a solder during a solder assembly of an electronic component to an electronic device substrate and a method for producing the fluxing curative. Spec... | 05/08/2007 |
| 7204574 | Polyimide thickfilm flow feature photoresist and method of applying same A polyimide photoresist for thick film flow features adheres to a polyimide nozzle plate or other materials, without the use of an adhesive material between the two surfaces. Further, the photoresist can utilize an acrylate UV initiator, which can reduce the potenti... | 04/17/2007 |
| 7186442 | Constrained layer damper A method for installing a constrained layer damper on a product of manufacture is disclosed. The method includes applying a layer of first polymeric material to a substrate of the product, wherein the first polymeric material is visco-elastic when solidified. Then, ... | 03/06/2007 |
| 7179552 | Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a ... | 02/20/2007 |
| 7160962 | Elastomer-modified epoxy siloxane compositions Elastomer-modified Epoxy-polysiloxane compositions of this invention are prepared by combining a silicone intermediate, with an epoxy resin, an elastomeric resinous intermediate, a polyfunctional amine, an optional organometallic catalyst, and optional fillers, pigm... | 01/09/2007 |
| 7157399 | Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components In one embodiment the invention is a polymerizable composition comprising a) an organoborane amine complex; b) one or more of monomers, oligomers or polymers having olefinic unsaturation which is capable of polymerization by free radical polymerization; c) one or mo... | 01/02/2007 |
| 7094844 | Liquid epoxy resin composition and semiconductor device A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is useful for semiconductor encapsulation. The composition is adherent to the... | 08/22/2006 |
| 7071263 | Epoxy adhesives and bonded substrates Epoxy adhesives are reported that comprise: (i) about 20% to about 40% weight of a reactive oligomer having a glass transition temperature of about −40° C. or less after curing and having at least two functional groups selected from epoxide, isocyanate, and amine... | 07/04/2006 |
| 7063413 | Fluid ejection cartridge utilizing a two-part epoxy adhesive A fluid ejection cartridge, including a substrate carrier having a substrate receiving surface, and a substrate having at least one fluid ejector actuator disposed on the substrate. In addition the fluid ejection cartridge includes a two-part adhesive disposed betwe... | 06/20/2006 |
| 7064157 | Flame retardant resin and flame retardant composition containing the same The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: | 06/20/2006 |
| 7037958 | Epoxy coating This invention concerns an epoxy coating for use as a non-skid surface for applications such as the deck of an aircraft carrier. The epoxy coating can be formulated from (a) an amine curing agent, (b) an epoxide-containing toughening agent such as a polysulfide and/... | 05/02/2006 |
| 7037586 | Film for circuit board The present invention relates to a film for a circuit board characterized in that the following A layer is adjacent to the following B layer is disclosed in the present application. A circuit board excellent in adhesion strength of a conductor layer can easily be pr... | 05/02/2006 |
| 7026398 | Air-drying silane coating compositions The present invention relates to an air-drying silane coating composition containing an epoxy or acrylic resin, an optional silicic ester or alkyl silicate, an aminoalkylsilane component, an optional organoalkyoxysilane, and possible auxiliaries; methods of use ther... | 04/11/2006 |
| 7012120 | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this... | 03/14/2006 |
| 7009008 | Transparent liquid resin material for SMT-enabled led-applications at higher temperatures and higher luminosities A casting resin compound as an assembly and encapsulation material for electronic and optoelectronic component parts, modules and components, for example for casting out optoelectronic components on the basis of acid anhydride-curable epoxy compounds, particularly b... | 03/07/2006 |
| 7005185 | Quick cure carbon fiber reinforced epoxy resin An epoxy composition includes an epoxy resin, a latent curing agent, and a catalyst. The composition includes two epoxide groups per molecule, and the latent curing agent is preferably a dicyanopolyamide, and most preferably dicyandiamide. The catalyst includes 2,4-... | 02/28/2006 |
| 6994891 | Method for producing an epoxy composition An epoxy composition for application to the surface of a marine vessel. The epoxy composition comprises an epoxy resin and an iron particulate combined with one or more materials, preferably dry materials, which are piped into a feeder and then into a mixer. The dry... | 02/07/2006 |
| 6949603 | Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components In one embodiment the invention is a polymerizable composition comprising a) an organoborane amine complex; b) one or more of monomers, oligomers or polymers having olefinic unsaturation which is capable of polymerization by free radical polymerization; c) one or mo... | 09/27/2005 |
| 6936676 | One-part, room temperature moisture curable resin composition This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at α position and a polyamine having at least two amino groups within its molecule wherein α posit... | 08/30/2005 |
| 6936664 | Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a ... | 08/30/2005 |
| 6906120 | Poly(arylene ether) adhesive compositions An adhesive for thermoplastic film is formed from a composition comprising a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, an optional plasticizer, and a cure agent. The adhesive finds particular utility in circuit board applications. | 06/14/2005 |
| 6884854 | Composition of epoxy resin, low glass transition temperature copolymer, latent hardener and carboxy-terminated polyamide and/or polyamide Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder component for epoxy resin compo... | 04/26/2005 |
| 6844379 | Long and short-chain cycloaliphatic epoxy resin, cyanate ester and Lewis and Bronsted catalysts Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Pr... | 01/18/2005 |
| 6825315 | Method of making thermally removable adhesives A method of making a thermally-removable adhesive is provided where a bismaleimide compound, a monomeric furan compound, containing an oxirane group an amine curative are mixed together at an elevated temperature of greater than approximately 90° C. to form a homog... | 11/30/2004 |
| 6805958 | Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same The present invention provides an epoxy resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight o... | 10/19/2004 |
| 6770965 | Wiring substrate using embedding resin A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an... | 08/03/2004 |
| 6713535 | Low-friction chromate-free coating of epoxy resins and sulfonyldianiline The present invention is directed to a low-friction coating composition, comprising: about 10 to about 30 wt % of an epoxy resin composition consisting essentially of 4-glycidyloxy-N,N′-diglycidylaniline; about 30 to about 60 wt % of an epoxide resin composition c... | 03/30/2004 |
