Did You Know...
...that it was melting ice cream that inspired the invention of the outboard motor? It was a lovely August day and Ole Evinrude was rowing his boat to his favorite island picnic spot. As he rowed, he watched his ice cream melt and wished he had a faster way to get to the island. At that moment the idea for the outboard motor was born!
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| Number | Title | Issue Date |
| 8017671 | Thermosetting resin for expediting a thermosetting process The present invention discloses a thermosetting resin for expediting a thermosetting process. The thermosetting resin is composed of 100 parts of primary resin formed by mixing a brominized epoxy resin, a tetrafunctional epoxy resin and an epoxy resin with a high br... | 09/13/2011 |
| 7989523 | Alicyclic diepoxy compound, epoxy resin composition comprising the same, and cured article therefrom Disclosed is an alicyclic diepoxy compound which gives a cured article suffering from no deterioration in properties even when used in hot and humid surroundings or used under such conditions as to give a strong acid, which is highly reactive upon curing, and which ... | 08/02/2011 |
| 7846998 | Sealant epoxy-resin molding material, and electronic component device Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame r... | 12/07/2010 |
| 7799852 | Composition of biphenyl epoxy resin, phenolbiphenylaralkyl resin and filler An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and... | 09/21/2010 |
| 7754790 | Adhesive of epoxy acrylate, non-unsaturated resin and bis(methacryloylethyl) hydrogen phosphate An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured th... | 07/13/2010 |
| 7405246 | Cure system, adhesive system, electronic device A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive syste... | 07/29/2008 |
| 7390858 | Coating compositions and methods The present invention provides coating compositions that include an epoxy-modified fatty acid ester resin, an oxirane-functional resin different from the epoxy-modified fatty acid ester resin, a carboxyl functional polyester resin, and an alkyl acid phosphate. ... | 06/24/2008 |
| 7381359 | Method for making filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 06/03/2008 |
| 7345102 | Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same An epoxy resin composition for encapsulating optical semiconductor element, comprising the following (A) to (D): (A) an epoxy resin component comprising a novolak type epoxy resin having at least one of the biphenyl skeleton and na... | 03/18/2008 |
| 7322688 | Jettable ink A printing method includes printing an ultraviolet light curable jettable ink including a colorant, a photoinitiating system, and cationic reagent onto a substrate provide a marking, and exposing the marking to ultraviolet radiation after at least two second. The ul... | 01/29/2008 |
| 7311972 | Filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 12/25/2007 |
| 7304102 | Process for making encapsulant for opto-electronic devices An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of r... | 12/04/2007 |
| 7294660 | Epoxy resin composition An epoxy resin composition which comprises 100 parts by weight of an epoxy resin and 1 to 800 parts by weight of an aluminum borate whisker having an average fiber diameter of 0.25 μm or less. The epoxy resin composition contains a large amount of the aluminum bora... | 11/13/2007 |
| 7288606 | Transparent liquid resin material for SMT-enabled LED-applications at higher temperatures and higher luminosities A casting resin compound as an assembly and encapsulation material for electronic and optoelectronic component parts, modules and components, for example for casting out optoelectronic components on the basis of acid anhydride-curable epoxy compounds, particularly b... | 10/30/2007 |
| 7285602 | Granular epoxy resin, production method thereof, and granular epoxy resin package A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less ... | 10/23/2007 |
| 7268437 | Semiconductor package with encapsulated passive component A semiconductor package with an encapsulated passive component mainly includes at least a substrate having a surface, a passive component and a molding compound. A plurality of SMD pads (Solder Mask Defined pads) and a solder mask are formed on the surface of the su... | 09/11/2007 |
| 7247683 | Low voiding no flow fluxing underfill for electronic devices A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfil... | 07/24/2007 |
| 7244798 | (Meth) acrylic compound having an oxetanyl group and liquid crystal film produced by using same The present invention provides a novel compound which is suitable as the starting material of a side-chain type liquid crystalline polymeric substance having a reactive group which is excellent in reactivity upon fixation of the liquid crystal orientation structure.... | 07/17/2007 |
| 7186769 | Water-dispersible polyester stabilized fluoroalkyl compositions In this invention, an aqueous dispersion is provided to improve the oil and water repellency of materials. The aqueous dispersion comprises a polymer, at least one water dispersible polyester, and water; wherein the polymer comprises the repeating units from at leas... | 03/06/2007 |
| 7179552 | Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a ... | 02/20/2007 |
| 7176250 | Fluororesin powder coating composition A non-vinylidene fluororesin powder coating material having blocking resistance and high impact resistance, is provided. A fluororesin powder coating composition comprising a non-vinylidene fluororesin having a Tg higher than 40° C. and a resin having a Tg of from ... | 02/13/2007 |
| 7173081 | Processes to produce water-dispersible polyester stabilized fluoroalkyl compositions A process is provided to produce an aqueous dispersion wherein the aqueous dispersion enhances the water and oil repellency of materials. The process comprises: 1) contacting at least one fluoroalkyl monomer, at least one water-dispersible polyester, water, and opti... | 02/06/2007 |
| 7127812 | Process for producing a multi-layer printed wiring board A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30b and an opening 3a through which a via hole is formed. A camera senses this register mark 30b so that the pos... | 10/31/2006 |
| 7122585 | Coating powders, methods of manufacture thereof, and articles formed therefrom Coating powders with enhanced electrostatic attraction to low conductivity substrates such as engineered wood are disclosed. The addition of conductive fillers to low temperature cure coating powder compositions improves the coating of difficult to coat substrates s... | 10/17/2006 |
| 7115976 | Method and apparatus for epoxy LOC die attachment A plurality of lead frames is supplied in a lead frame-by-lead frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an application device. An attaching device attaches a device to each lead fr... | 10/03/2006 |
| 7105614 | Curable epoxy resin composition A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is u... | 09/12/2006 |
| 7098276 | Flame-retardant epoxy resin composition and semiconductor device made using the same An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and... | 08/29/2006 |
| 7083831 | Chromium-free corrosion preventive and corrosion prevention method A chromium-free corrosion inhibitor containing at least one titanium, silicon and/or zirconium compound corresponding to general formula (I): in which Me is a titanium, silicon or zirconium ion, at least one othe... | 08/01/2006 |
| 7070861 | Flame retardant epoxy resin composition, and prepreg and fiber-reinforced composite materials made by using the composition A flame retardant epoxy resin composition containing (A) a phenolic novolak type epoxy resin including a phenolic novolak type epoxy resin of the following formula (1) and/or formula (2) in a total of at least 50 wt %: | 07/04/2006 |
| 7064157 | Flame retardant resin and flame retardant composition containing the same The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: | 06/20/2006 |
| 7056978 | Toughened epoxy-anhydride no-flow underfill encapsulant A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment... | 06/06/2006 |
| 7037586 | Film for circuit board The present invention relates to a film for a circuit board characterized in that the following A layer is adjacent to the following B layer is disclosed in the present application. A circuit board excellent in adhesion strength of a conductor layer can easily be pr... | 05/02/2006 |
| 7009008 | Transparent liquid resin material for SMT-enabled led-applications at higher temperatures and higher luminosities A casting resin compound as an assembly and encapsulation material for electronic and optoelectronic component parts, modules and components, for example for casting out optoelectronic components on the basis of acid anhydride-curable epoxy compounds, particularly b... | 03/07/2006 |
| 7005185 | Quick cure carbon fiber reinforced epoxy resin An epoxy composition includes an epoxy resin, a latent curing agent, and a catalyst. The composition includes two epoxide groups per molecule, and the latent curing agent is preferably a dicyanopolyamide, and most preferably dicyandiamide. The catalyst includes 2,4-... | 02/28/2006 |
| 6955739 | Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet radiation to provide an activated adhesive film having a first activated su... | 10/18/2005 |
| 6946541 | Composition based on renewable raw materials The present invention relates to a composition based on renewable raw materials which is particularly characterized by containing at least one tin-containing compound, an article made thereof as well as a process for the preparation of such an article. The compositi... | 09/20/2005 |
| 6936664 | Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a ... | 08/30/2005 |
| 6924438 | Epoxy sight bowls for use in power transformers A cured filler-less epoxy compound formed as a rigid, three-dimensional, transparent structure, including a cylindrical sight bowl of a utility or industrial high voltage bushing. A process for making a three-dimensional (e.g., cylindrical), transparent structure wi... | 08/02/2005 |
| 6919420 | Acid-cleavable acetal and ketal based epoxy oligomers Reworkable thermoset acid-cleavable acetal and ketal based epoxy oligomers can be B-staged into a tack free state. Compositions containing the epoxy oligomers are employed in a reworkable assembly such as a wafer-level underfilled microelectronic package. ... | 07/19/2005 |
| 6902689 | Epoxy, epoxy system, and method of forming a conductive adhesive connection The invention encompasses epoxies, epoxy systems, and methods of forming conductive adhesive connections between electrical nodes. An epoxy contains: a) a liquid mixture of a hardener and a base epoxy; and b) a concentration of an ionic salt within the liquid mixtur... | 06/07/2005 |
