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| Number | Title | Issue Date |
| 7875656 | Foamable sealant composition A foamable sealant composition having a density, when foamed, of from 0.4 to 1.8 g/cc, and containing a latex binder, foam-generating composition, foam stabilizer, rheology modifier and water, is provided. Also provided is a method of sealing a vehicle using the foa... | 01/25/2011 |
| 7842735 | Fluoropolymer foams, process to make them and applications thereof Described is a process for making closed cell fluoropolymer foam, and the foam so made. The process includes subjecting a fluoropolymer resin an inert gas at a pressure higher than atmospheric to drive gas into the resin, raising the temperature of the resin to or a... | 11/30/2010 |
| 7425288 | Method for preparing an open porous polymer material and an open porous polymer material A method for preparing an open pourous polymer material, comprises forming of a polymer solution, addition of a porogen to the polymer solution and precipitation with water of polymer from the polymer solution, and the method then comprises removal of solvent and po... | 09/16/2008 |
| 7335965 | Packaging of electronic chips with air-bridge structures A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A circuit assembly comprises an electronic chip and a conductive structur... | 02/26/2008 |
| 7311845 | Adsorbing material for blood and plasma cleaning method and for albumin purification The invention relates to an adsorbent material, a method for cleaning blood and plasma and purifying albumin, and to a method for producing said adsorbent material. The inventive adsorbent material is embodied in the form of a highly cross-linked and porous spherica... | 12/25/2007 |
| 7304017 | Sorbent for use in process of solid phase extraction A sorbent comprising a spherical, highly porous polymer with specific hydrophobic-hydrophilic properties, specific pore volume and its distribution, as well as a method of solid phase extraction using said sorbent. The sorbent is produced by suspension polymerizatio... | 12/04/2007 |
| 7301190 | Structures and methods to enhance copper metallization Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a meta... | 11/27/2007 |
| 7285196 | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at smaller dimensions than aluminum. However, use of copper typically requir... | 10/23/2007 |
| 7279504 | Expandable vinylaromatic polymers and process for their preparation Expandable vinylaromatic polymers which comprise: a) a matrix obtained by polymerizing 50-100% by weight of one or more vinylaromatic monomers and 0.50% by weight of a copolymerizable monomer; b) 1-10% by weight, calculated with respect to the polymer (a), of an exp... | 10/09/2007 |
| 7276788 | Hydrophobic foamed insulators for high density circuits A conductive system and a method of forming an insulator for use in the conductive system is disclosed. The conductive system comprises a foamed polymer layer on a substrate. The foamed polymer layer has a surface that is hydrophobic, and a plurality of conductive s... | 10/02/2007 |
| 7268413 | Bipolar transistors with low-resistance emitter contacts Many integrated circuits include a type of transistor known as a bipolar junction transistor, which has an emitter contact formed of polysilicon. Unfortunately, polysilicon has a relatively high electrical resistance that poses an obstacle to improving switching spe... | 09/11/2007 |
| 7262130 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits, the key components in thousands of electronic and computer products, include interconnected networks of electrical components. The components are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have... | 08/28/2007 |
| 7262505 | Selective electroless-plated copper metallization Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate, including depositing a thin film seed layer of Palladium (Pd) or Copper (Cu) on... | 08/28/2007 |
| 7260914 | Method and apparatus for packaging horticultural products In a method and apparatus for packaging a horticultural product, especially cut flowers, for transportation, one or more stems are inserted through a flexible foam block formed from a low density, low compression force material disposed in an opening of container su... | 08/28/2007 |
| 7253521 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits include networks of electrical components that are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have begun using copper in combination with diffusion barriers, rather than aluminum, to form the wi... | 08/07/2007 |
| 7238678 | Adhesive N,O-carboxymethylchitosan coatings which inhibit attachment of substrate-dependent cells and proteins The present invention relates to a method of inhibiting cellular and protein attachment to substrates by applying a composition containing an effective amount of adherent N,O-carboxymethylchitosan to a substrate with such that cellular and protein attachment are pre... | 07/03/2007 |
| 7230037 | Method for mixing a polyol component and an isocyanate component The present invention relates to a method for the continuous mixing of at least one polyol component and at least one isocyanate component and optionally additives to form a polyurethane reaction mixture in a stirrer mixer with an axially conveying stirrer. ... | 06/12/2007 |
| 7220665 | H plasma treatment Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive l... | 05/22/2007 |
| 7211512 | Selective electroless-plated copper metallization Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate. This method includes depositing a thin film seed layer of Palladium (Pd) or Cop... | 05/01/2007 |
| 7195818 | Sealable multi-layer opaque film A sealable multi-layer opaque film. In particular, a sealable multi-layer opaque film that is moisture permeable and water resistant. The sealable multi-layer opaque film is an oriented multilayer film with a core layer comprising an orientation-enhancing polymer, a... | 03/27/2007 |
| 7186457 | Cellulosic composite component A component such as a siding panel comprised of a PVC/wood flour composite. Another embodiment is a component such as a siding panel that is made from a PVC/CPE/wood flour composite. The cellulosic composite may be extruded through a die and then bent into the shape... | 03/06/2007 |
| 7182897 | Method of storing material into which gas saturates A method of storing a material into which a gas saturates, before the material is foamed in a metal mold. The material into which a gas saturates is stored at a predetermined ambient pressure and predetermined ambient temperature to maintain a gas saturated state, t... | 02/27/2007 |
| 7166247 | Foamed mechanical planarization pads made with supercritical fluid Foamed thermoplastic polymeric mechanical planarization polishing pads (“MP pads”) made with supercritical fluids are presented. A supercritical fluid foaming agent is dissolved in a thermoplastic polymer. A rapid change in the solubility and volume of the super... | 01/23/2007 |
| 7166348 | Core material for vacuum heat insulation material, and vacuum heat insulation material Description is made of an open cell polystyrene resin foam having a content of organic volatile matters of less than 100 ppm. The open cell foam is suitable as a core material for a sound insulating material or a vacuum heat insulating material. The open cell... | 01/23/2007 |
| 7153583 | Liquid silicone rubber coating composition and airbag Liquid silicone rubber coating compositions which include specific amounts of an organopolysiloxane bearing at least two alkenyl groups, an organohydrogenpolysiloxane bearing at least two silicon-bonded hydrogen atoms, a crosslinking reaction catalyst which is an or... | 12/26/2006 |
| 7144925 | Fire resistance acoustic foam A macrocellular foam is described having improved cell size and Fire-test-response Characteristics, among other features, which is obtained by selecting a particle size less than 1 micron for the flame retardant adjuvant. The inventors found that the amount of fire ... | 12/05/2006 |
| 7140865 | Apparatus for making a corrugation-free foam A method and apparatus for extruding a corrugation-free polystyrene foam with 100% carbon dioxide as the blowing agent by extruding the extrudate through an annular die opening so that it contacts a choke ring inner surface. A foam made with the apparatus according ... | 11/28/2006 |
| 7141621 | Gels from controlled distribution block copolymers The present invention relates to gels prepared from novel anionic block copolymers of mono alkenyl arenes and conjugated dienes, and to blends of such block copolymers with other polymers. The block copolymers are selectively hydrogenated and have mono alkenyl arene... | 11/28/2006 |
| 7128973 | Expanded polystyrene bead having functional skin layer, manufacturing process thereof, and functional EPS product and manufacturing process thereof using the same Expanded polystyrene particles having a polyvinyl acetate resin-based functional skin layer, and a process thereof are provided. The particle includes an inner expanded polystyrene layer; and a functional skin layer. The inner expanded polystyrene layer is formed by... | 10/31/2006 |
| 7129287 | Clay nanocomposites prepared by in-situ polymerization A method for preparing exfoliated clay nanocomposites by in-situ polymerization comprising the steps of (a) providing a mixture of at least one type of monomer and at least one type of organophilic clay; and (b) initiating an in-situ polymerization reaction in the m... | 10/31/2006 |
| 7123738 | Loudspeaker The present invention is directed to a speaker using lightweight, highly rigid diaphragm having excellent frequency characteristic and improving resistance to environment (including resistance to UV and resistance to fading). For this end, the speaker utilizes a con... | 10/17/2006 |
| 7114503 | Process for producing an open celled foam The invention relates to a foam for purifying and filtrating air, particularly filtrating toxic compounds, such as for instance tar and polycyclic aromatic hydrocarbons (PAHs) from tobacco smoke, and to a method to prepare this foam. The foam according to the invent... | 10/03/2006 |
| 7107601 | Foam molding method and apparatus According to this invention, there is provided a molding method and apparatus which increase the gas permeation speed in obtaining a foamed resin molded product by letting a gas permeate a molten resin material. To achieve this object, a chip- or pellet-like resin m... | 09/12/2006 |
| 7105914 | Integrated circuit and seed layers Structures are provided which improve performance in integrated circuits. The structures include a diffusion barrier and a seed layer in an integrated circuit both formed using a low energy ion implantation followed by a selective deposition of metal lines for the i... | 09/12/2006 |
| 7091611 | Multilevel copper interconnects with low-k dielectrics and air gaps Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by electroless, selectively deposited copper in a streamlined process which ... | 08/15/2006 |
| 7086507 | Controllable magneto-rheological elastomer vibration isolator A tunable vibration isolation device comprising a magneto-rheological elastomer (MRE), and methods of using such a device, are provided. By manipulating a magnetic field within the MRE the device's stiffness is controlled. The vibration isolator can be constructed t... | 08/08/2006 |
| 7087670 | Flame-resistant intumescent mixtures The invention relates to mixtures containing a) a polymer which may be produced from ethylene, vinyl acetate and optionally further monomers having a vinyl acetate content in the range of 40 to 85 wt. %, b) at leas... | 08/08/2006 |
| 7083403 | Apparatus for supplying a resin material to an injection molding machine An apparatus for supplying a resin material to an injection molder comprises a vessel for storing a resin material, gas supplying means for supplying an inert gas to the vessel which is not a super-critical state, and material supplying means for supplying the resin... | 08/01/2006 |
| 7074880 | Polyimide aerogels, carbon aerogels, and metal carbide aerogels and methods of making same A preparation process of polyimide aerogels that composed of aromatic dianhydrides and aromatic diamines or a combined aromatic and aliphatic diamines is described. Also descried is a process to produce carbon aerogels derived from polyimide aerogel composed of a ri... | 07/11/2006 |
| 7067421 | Multilevel copper interconnect with double passivation Structures and methods provide multilevel wiring interconnects in an integrated circuit assembly which alleviate problems associated with integrated circuit size and performance and include methods for forming multilevel wiring interconnects in an integrated circuit... | 06/27/2006 |
