Did You Know...
...that it was melting ice cream that inspired the invention of the outboard motor? It was a lovely August day and Ole Evinrude was rowing his boat to his favorite island picnic spot. As he rowed, he watched his ice cream melt and wished he had a faster way to get to the island. At that moment the idea for the outboard motor was born!
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| Number | Title | Issue Date |
| 7405189 | Surface treatment composition and method for removing Si component and reduced metal salt produced on the aluminum die cast material in etching process A surface treatment composition and method for removing Si and reduced metal salt produced during etching of an aluminum die cast material (“ALDC material”) without generation of nitrogen oxide (NOx) or hydrogen fluoride (HF). In surface treatment of an ALDC mat... | 07/29/2008 |
| 7253111 | Barrier polishing solution The polishing solution is useful for preferentially removing barrier materials in the presence of nonferrous interconnect metals with limited erosion of dielectrics. The polishing solution comprises 0 to 20 weight percent oxidizer, at least 0.001 weight percent inhi... | 08/07/2007 |
| 7216653 | Cleaning solution and cleaning method of a semiconductor device A cleaning method for removing foreign bodies during the fabrication of semiconductor devices including treating a substrate with a cleaning solution including an oxidizer to form a chemical oxide layer and then removing the chemical oxide layer, thereby removing fo... | 05/15/2007 |
| 7199091 | Photoresist stripper Recently, use is made of copper wiring as the wiring material for semiconductor devices, and of low dielectric constant films as the insulating film between the lines of wiring. In this connection, a photoresist stripper is in need which can inhibit corrosion or dam... | 04/03/2007 |
| 7166419 | Compositions substrate for removing etching residue and use thereof Compositions containing certain organic solvents and a fluorine source are capable of removing photoresist and etching residue. ... | 01/23/2007 |
| 7160847 | Water solution using in metal surface treating process and process for removing oxidized film and burred edge using the same A method for chemical etching is disclosed for taking away oxidized film and removing cut as well as punched edge burs of harden-treated carbon steel (SK3, SK4 and SK5). Thereby, the fillet edge of the cut section is achieved. An oxidized film with a thickness of se... | 01/09/2007 |
| 7129029 | Compositions substrate for removing etching residue and use thereof Compositions containing certain organic solvents and a fluorine source are capable of removing photoresist and etching residue. ... | 10/31/2006 |
| 7105475 | Cleaning solution and cleaning method of a semiconductor device A cleaning method for removing foreign bodies during the fabrication of semiconductor devices including treating a substrate with a cleaning solution including an oxidizer to form a chemical oxide layer and then removing the chemical oxide layer, thereby removing fo... | 09/12/2006 |
| 7041629 | Stripper for special steel The inventive aqueous pickling agent on the basis of sulfuric acid or phosphoric acid and hydrogen fluoride for stainless steels, which pickling agent is free of wetting and emulsifying agents, contains (each as 100 wt-% substance) | 05/09/2006 |
| 7033978 | Post-planarization clean-up Cleaning solutions for removing residuals from the surface of an integrated circuit device. Such cleaning solutions find particular application in the fabrication of a dual damascene structure following removal of excess portions of a silver-containing metal layer f... | 04/25/2006 |
| 7018560 | Composition for polishing semiconductor layers An aqueous polishing composition comprises a corrosion inhibitor for limiting removal of an interconnect metal with an acidic pH. The composition includes an organic-containing ammonium salt formed with R1, R... | 03/28/2006 |
| 7018552 | Method of manufacturing electronic device A method of manufacturing an electronic device comprises forming a wiring material layer made of aluminum or an aluminum alloy on the surface of an insulating film on a substrate, patterning the wiring material layer by a reactive ion etching treatment with a resist... | 03/28/2006 |
| 7001533 | Chromate-free method for surface etching of aluminum and aluminum alloys Non-chromate solutions for treating and/or etching metals, particularly, aluminum, aluminum alloys, steel and titanium, and method of applying same wherein the solutions include either a titanate or titanium dioxide as a “drop-in replacement” for a chromium-cont... | 02/21/2006 |
| 6927198 | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and a fluoride ... | 08/09/2005 |
| 6851432 | Cleaning compositions An aqueous cleaning composition comprising an alkanolamine, a tetraalkylammonium hydroxide, nonmetallic fluoride salt, a corrosion inhibitor, e.g. ascorbic acid or its derivatives alone or in combination, balance water. Such cleaning compositions are effective to re... | 02/08/2005 |
| 6821351 | Hydrofluoric acid generating composition and method of treating surfaces The present invention relates to compositions, kits and processes for the brightening of metal surfaces by the application of the chemical compositions. These compositions act to release hydrofluoric acid as a brightening agent. The solutions are preferably mixed du... | 11/23/2004 |
| 6787293 | Photoresist residue remover composition A photoresist residue remover composition is provided that includes one type or two or more types of fluoride compound and one type or two or more types chosen from the group consisting of glyoxylic acid, ascorbic acid, glucose, fructose, lactose, and mannose (but e... | 09/07/2004 |
| 6773873 | pH buffered compositions useful for cleaning residue from semiconductor substrates A semi-aqueous cleaning formulation useful for removing particles from semiconductor wafer substrates formed during a dry etching process for semiconductor devices, the cleaning formulation comprising a buffering system a polar organic solvent, and a fluoride source... | 08/10/2004 |
| 6673757 | Process for removing contaminant from a surface and composition useful therefor Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing aqueous composition comprising a fluoride containing compound; a dicarboxylic acid and/or sa... | 01/06/2004 |
| 6645926 | Fluoride cleaning masking system The present invention relates to a maskant system for use with a fluoride cleaning system. The maskant system comprises a parting compound applied to a surface which requires protection and a chromium rich maskant for substantially preventing intergranula... | 11/11/2003 |
| 6627587 | Cleaning compositions An aqueous cleaning composition comprising an alkanolamine, a tetraalkylammonium hydroxide, nonmetallic fluoride salt, a corrosion inhibitor, e.g. ascorbic acid or its derivatives alone or in combination, balance water. Such cleaning compositions are effe... | 09/30/2003 |
| 6593282 | Cleaning solutions for semiconductor substrates after polishing of copper film A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and ... | 07/15/2003 |
| 6579377 | Hydrofluoric acid generating composition and method of treating surfaces The present invention relates to compositions, kits and processes for the brightening of metal surfaces by the application of the chemical compositions. These compositions act to release hydrofluoric acid as a brightening agent. The solutions are preferab... | 06/17/2003 |
| 6565664 | Method for stripping copper in damascene interconnects An inexpensive and safe copper removal method in the fabrication of integrated circuits is described. Copper is stripped or removed by a chemical mixture comprising an ammonium salt, an amine, and water. The rate of copper stripping can be controlled by v... | 05/20/2003 |
| 6554912 | Polymer remover Compositions for the removal of polymeric material from a substrate are provided where the compositions include a polyol compound selected from (C3 -C20)alkanediols, substituted (C3 --C20)alkanediols, (C3 | 04/29/2003 |
| 6521575 | Method and unit for regeneration of solution for cleaning glass, method and unit for cleaning silicate glass, and cathode-ray tube A treatment solution (2) containing fluoride is added to a cleaning solution (1) drained from a cleaning tank (11). Fluoride is allowed to react with fluorosilicic acid in the cleaning solution to settle a precipitate (4) containing fluorosilicate, and th... | 02/18/2003 |
| 6465404 | Aqueous cleaning composition with controlled PH Aqueous cleaning compositions in which the pH is controlled comprise an acidic metal cleaning compound; at least one nitrogen containing compound to provide a stabilized pH; an emulsifier, a nonionic surfactant and optionally at least one water soluble so... | 10/15/2002 |
| 6462005 | Cleaning agent for a semiconductor device and a method of manufacturing a semiconductor device A cleaning agent for use in the manufacture of a semiconductor device comprising an aqueous solution containing a quarternary ammonium salt and a fluoro compound, or an aqueous solution containing a quarternary ammonium salt and a fluoro compound, as well... | 10/08/2002 |
| 6440224 | Hydrofluoric acid generating composition and method of treating surfaces A method of treating a surface of a metal is provided. A source of fluoride ion is mixed with a source of acid to form hydrofluoric acid and, when applied to a metal surface to be treated, the hydrofluoric acid acts as a brightening agent.... | 08/27/2002 |
| 6407047 | Composition for desmutting aluminum This invention provides an improved composition and process for pretreatment of aluminum prior to electroplating. The invention is an aqueous composition comprised of an acid, an oxidizing agent, and, optionally, a halogenated compound. This composition i... | 06/18/2002 |
| 6394114 | Method for stripping copper in damascene interconnects An inexpensive and safe copper removal method in the fabrication of integrated circuits is described. Copper is stripped or removed by a chemical mixture comprising an ammonium salt, an amine, and water. The rate of copper stripping can be controlled by v... | 05/28/2002 |
| 6387859 | Method and cleaner composition for stripping copper containing residue layers A cleaner composition for removing from within a microelectronic fabrication a copper containing residue layer in the presence of a copper containing conductor layer, and a method for stripping from within a microelectronic fabrication the copper containi... | 05/14/2002 |
| 6361712 | Composition for selective etching of oxides over metals A composition for selective etching of oxides over a metal. The composition contains water, hydroxylammonium salt, carboxylic acid, a fluorine containing compound, and optionally, a base. The pH of the composition is about 2 to 6.... | 03/26/2002 |
| 6355605 | Composition and method for removing iron stain and scale A cleaning composition and method are provided for removing iron stains and scale from the external surfaces of duck decoys. An illustrative composition contains hydrochloric acid, stannous chloride, ammonium bifluoride, and water. The compositions are ap... | 03/12/2002 |
| 6346505 | Cleaning solution for electromaterials and method for using same A cleaning solution for electromaterials including hydrogen fluoride and either oxygen or hydrogen gas dissolved in water. The cleaning solution may alternatively include hydrogen fluoride, hydrochloric acid or nitric acid, and hydrogen or oxygen gas diss... | 02/12/2002 |
| 6323169 | Resist stripping composition and process for stripping resist An aqueous resist stripping composition contains (a) an oxidizing agent, (b) a chelating agent, (c) a water-soluble fluorine compound, and optionally (d) an organic solvent. Also provided is a process of stripping resist films and resist residues remainin... | 11/27/2001 |
| 6316115 | Non-chromate chemical treatments used on magnesium alloys Formulations and a process are disclosed for chemically treating a surface of a product made from magnesium alloys. One formulation comprises an acid pickle comprising hydrofluoric acid and a binary alcohol and a second formulation comprises a conversion ... | 11/13/2001 |
| 6310018 | Fluorinated solvent compositions containing hydrogen fluoride A homogeneous compositions containing a fluorinated solvent, hydrogen fluoride, and a co-solvent, and the use of these compositions for cleaning and etching of substrates is described.... | 10/30/2001 |
| 6245155 | Method for removing photoresist and plasma etch residues A method for the removing of plasma etch residues on a substrate comprising the steps of: (i) contacting the substrate with a cleaning composition, and (ii) contacting the substrate with ozonated water. The preferred cleaning composition has a pH from 2 t... | 06/12/2001 |
| 6235693 | Lactam compositions for cleaning organic and plasma etched residues for semiconductor devices A composition for the cleaning of residues from substrates from about 0.01 percent by weight to about 10 percent by weight of one or more fluoride compounds, from about 20 percent by weight to about 50 percent by weight water, from about 20 percent by wei... | 05/22/2001 |
