Did You Know...
...that the x-ray was discovered purely by accident? When German physicist Wilhelm Konrad von Roentgen was experimenting with cathode rays in 1895, he put an activated Crookes tube in a book and went out to lunch. When he returned, he discovered that a key that had also been placed in the book showed up as an image on the developed film!
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| Number | Title | Issue Date |
| 8183195 | Peroxide activated oxometalate based formulations for removal of etch residue Highly alkaline, aqueous formulations including (a) water, (b) at least one metal ion-free base at sufficient amounts to produce a final formulation alkaline pH, (c) from about 0.01% to about 5% by weight (expressed as % SiO2) of at least one water-solubl... | 05/22/2012 |
| 8110535 | Semi-aqueous stripping and cleaning formulation for metal substrate and methods for using same The present invention relates to semi-aqueous formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, as well as contaminations. The formulation comprises: an alkanolamine, a water miscible organic co-solvent, a quar... | 02/07/2012 |
| 8026201 | Stripper for coating layer The invention relates to compositions and methods of removing silicon-based anti-reflective coatings/hardmask layers. ... | 09/27/2011 |
| 8012922 | Wet cleaning solution A wet cleaning solution, comprising 0.01-3 wt % of an amphoteric imidazolium surfactant capable of forming a complex with metal ions, a pH adjuster, and balanced deionized water. The wet cleaning solution is substantially free of corrosion inhibitor other than the i... | 09/06/2011 |
| 7947639 | Non-aqueous, non-corrosive microelectronic cleaning compositions containing polymeric corrosion inhibitors Photoresist strippers and cleaning compositions of this invention are provided by non-aqueous cleaning compositions that are essentially non-corrosive toward copper as well as aluminum and that comprise at least one polar organic solvent, at least one hydroxylated o... | 05/24/2011 |
| 7935665 | Non-corrosive cleaning compositions for removing etch residues A non-corrosive cleaning composition that is aqueous-based, non-hazardous and will not harm the environment and is useful primarily for removing both fresh and aged plasma etch residues from a substrate. The composition comprises (a) water; and (b) a synergistic com... | 05/03/2011 |
| 7879784 | Stripping agent composition for a resist A stripping agent composition for a resist, containing (A) 0.1 to 10% by weight of an amine; (B) 80 to 99% by weight of an organic solvent having a Hansen's solubility parameter of from 18 to 33 MPa1/2; (C) 0.01 to 3% by weight of a sugar; and (D) 0 to 5%... | 02/01/2011 |
| 7851427 | Compositions for reducing metal etch rates using stripper solutions containing copper salts Resist stripping agents, useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits with reduced metal etch rates, particularly copper etch rates, are provided with methods for their use. The preferred st... | 12/14/2010 |
| 7838483 | Process of purification of amidoxime containing cleaning solutions and their use The invention relates to processes for producing and using amidoxime compounds with low trace metal impurities. The invention further relates to compositions comprising amidoxime compounds with low trace metal impurities, such compositions useful for cleaning or rem... | 11/23/2010 |
| 7825078 | Non-aqueous microelectronic cleaning compositions containing fructose Back end photoresist strippers and residue compositions are provided by non-aqueous compositions that are essentially non-corrosive toward copper as well as aluminum and that comprise a polar organic solvent, a hydroxylated amine, and as a corrosion inhibitor fructo... | 11/02/2010 |
| 7825079 | Cleaning composition comprising a chelant and quaternary ammonium hydroxide mixture The invention relates to compositions and methods for cleaning integrated circuit substrates. The compositions are in the form of an aqueous solution and include a quaternary ammonium hydroxide compound and a chelating compound. The chelating compound includes eithe... | 11/02/2010 |
| 7772174 | Polymer-stripping composition Compositions useful for removing a polymer material from a substrate, such as an electronic device, and methods of using such compositions are provided. These compositions and methods reduce the corrosion of any underlying metal surfaces, and are particularly suited... | 08/10/2010 |
| 7687448 | Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition A composition for removing a photoresist includes about 5 to about 20 percent by weight of an alcoholamide compound, about 15 to about 60 percent by weight of a polar aprotic solvent, about 0.1 to about 6 percent by weight of an additive, and pure water. The alcohol... | 03/30/2010 |
| 7655608 | Reduced metal etch rates using stripper solutions containing a copper salt Resist stripping agents, useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits with reduced metal etch rates, particularly copper etch rates, are provided with methods for their use. The preferred st... | 02/02/2010 |
| 7531492 | Composition for the removal of sidewall residues A composition for the production of semiconductors, comprising H2SiF6 and/or HBF4 in a total amount of 10-500 mg/kg, 1-17 % by weight of H2S04, 1-15% by weight of H202, optionally in combination with additives, in aqueous solution and a process of removing residual ... | 05/12/2009 |
| 7435711 | Cleaning agent for removing solder flux and method for cleaning solder flux The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like a... | 10/14/2008 |
| 7435712 | Alkaline chemistry for post-CMP cleaning This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an alkaline chemistry for the post-CMP cleaning of wafers containing metal, part... | 10/14/2008 |
| 7419945 | Microelectronic cleaning compositions containing oxidizers and organic solvents Cleaning compositions suitable for cleaning microelectronic structures having silicon dioxide, low-k or high-k dielectrics and copper or aluminum metallizations contain an oxidizing agent and a polar organic solvent selected from amides, sulfones, sulfolenes, seleno... | 09/02/2008 |
| 7417016 | Composition for the removing of sidewall residues The present invention relates to a composition for the removal of so-called “sidewall residues” from metal surfaces, in particular from aluminium or aluminium-containing surfaces, in particular from aluminium or aluminium-containing surfaces, during the producti... | 08/26/2008 |
| 7413848 | Method of removing photoresist and photoresist rework method A method of removing photoresist is provided. In the whole process of removing the photoresist, plasma is not used. Instead, a first solution is used in a first removal step to remove a photoresist layer. Then, a second solution is used in a second removal step to c... | 08/19/2008 |
| 7402552 | Non-corrosive cleaning composition for removing plasma etching residues A non-corrosive cleaning composition for removing residues from a substrate. The composition comprises: (a) water; (b) at least one hydroxylammonium compound; (c) at least one basic compound, preferably selected from the group consisting of amines and quaternary amm... | 07/22/2008 |
| 7399365 | Aqueous fluoride compositions for cleaning semiconductor devices The present invention relates to dilute fluoride solutions and methods for cleaning plasma etch residue from semiconductor substrates including such dilute solutions. The compositions and methods according to the invention can advantageously provide both cleaning ef... | 07/15/2008 |
| 7387130 | Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials A composition for removing resists and etching residue from substrates containing at least one nucleophilic amine compound having oxidation and reduction potentials, at least one organic solvent, water and, optionally, a chelating agent is described. The chelating a... | 06/17/2008 |
| 7381694 | Composition and method for removing photoresist materials from electronic components Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the co... | 06/03/2008 |
| 7365045 | Aqueous cleaner with low metal etch rate comprising alkanolamine and tetraalkylammonium hydroxide A cleaning solution is provided for cleaning metal-containing microelectronic substrates, particularly for post etch, via formation and post CMP cleaning. The cleaning solution consists of a quaternary ammonium hydroxide, an organic amine, and water. A preferred cle... | 04/29/2008 |
| 7361631 | Compositions for the removal of organic and inorganic residues A composition and method using same for removing photoresist and/or processing residue from a substrate are described herein. In one aspect, there is provided a composition for removing residue consisting essentially of: an acidic buffer solution having an acid sele... | 04/22/2008 |
| 7326673 | Treatment of semiconductor substrates using long-chain organothiols or long-chain acetates Chemical formulations and methods for removing unwanted material, such as unexposed photoresist, metal oxides, CMP residue, and the like, from semiconductor wafers or other substrates. The formulations utilize a supercritical fluid-based cleaning composition, which ... | 02/05/2008 |
| 7316793 | Formulation of a liquid composition to form an electrical insulator, an antioxidant or a degreaser Formulation of a liquid composition to form an electrical insulator, an antioxidant or a degreaser, obtained from the combination of by-products with mineral origin, whose formulation shall vary to meet different characteristics, becoming an electrical insulator, an... | 01/08/2008 |
| 7316940 | Chip dicing A semiconductor structure and method for chip dicing. The method includes (a) providing a semiconductor substrate and (b) forming first and second device regions in and at top of the substrate. The first and second device regions are separated by a semiconductor bor... | 01/08/2008 |
| 7312186 | Cleaning solution for semiconductor substrate A cleaning solution for semiconductor substrates comprising a nonionic surface active agent of the formula (1) and/or the formula (2), a chelating agent and a chelating accelerator: CH3—(CH2)l—O—(CmH2m... | 12/25/2007 |
| 7309683 | Cleaning composition and method of cleaning a semiconductor device using the same A cleaning composition comprises an alkali solution, pure water, and a surfactant represented by the following chemical formula: R1-OSO3—HA+ wherein R1 is one selected from a group consisting of a butyl group, an isobutyl group, an isooctyl g... | 12/18/2007 |
| 7299810 | Substrate treating apparatus with circulating and heating mechanism for removal liquid A substrate treating apparatus includes a spin chuck for supporting a substrate to be rotatable in a plane including a principal surface of the substrate, a motor for rotating the spin chuck, a circulating pump for circulating a removal liquid and transmitting the r... | 11/27/2007 |
| 7294610 | Fluorinated sulfonamide surfactants for aqueous cleaning solutions Described are anionic N-substituted fluorinated sulfonamide surfactants, and use thereof in cleaning and in acid etch solutions. The cleaning and etch solutions are used with a wide variety of substrates, for example, in the cleaning and etching of silicon oxide-con... | 11/13/2007 |
| 7273060 | Methods for chemically treating a substrate using foam technology The present invention relates to methods and compositions for treating a surface of a substrate by foam technology that includes at least one treatment chemical. The invention more particularly relates to the removal of undesired matter from the surface of substrate... | 09/25/2007 |
| 7271140 | Composition for removing stains from textiles A stain removing composition having a mixture of N-methyl pyrrolidinone and at least one solvent from the group consisting of 3-pentanol, dipropylene glycol monomethyl ether, propylene glycol n-propyl ether, and diethylene glycol monobutyl ether. Preferably, the sta... | 09/18/2007 |
| 7264010 | Detergent, cleaning method and cleaning apparatus An environmental friendly cleaning method and a cleaning apparatus are disclosed. The method comprising cleaning an article using a composition comprising material extracted from the fruit of a plant, such as a plant of the genus Garcinia, for example the fru... | 09/04/2007 |
| 7264680 | Process and apparatus for treating a workpiece using ozone A method for cleaning a semiconductor workpiece having a metal layer in a processing chamber includes the steps of introducing a liquid solution including dissolved carbon dioxide onto the workpiece, and introducing ozone into the processing chamber. The ozone oxidi... | 09/04/2007 |
| 7252718 | Forming a passivating aluminum fluoride layer and removing same for use in semiconductor manufacture A composition for the cleaning of residues from substrates can contain from about 0.01 percent by weight to about 5 percent by weight of one or more fluoride compounds, from about 20 percent by weight to about 50 percent by weight water, from about 20 percent by wei... | 08/07/2007 |
| 7250391 | Cleaning composition for removing resists and method of manufacturing semiconductor device The cleaning composition for removing resists includes a salt of hydrofluoric acid and a base not containing a metal (A component), a water-soluble organic solvent (B1 component), at least one organic acid or inorganic acid (C component), water (D component), and, o... | 07/31/2007 |
| 7247208 | Microelectronic cleaning compositions containing ammonia-free fluoride salts Ammonia-free, HF-free cleaning compositions for cleaning photoresist and plasma ash residues from microelectronic substrates, and particularly to such cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized b... | 07/24/2007 |
