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| Number | Title | Issue Date |
| 8187351 | Sol of spinous inorganic oxide particles, method of producing the sol, and polishing agent containing the sol The present invention provides a sol of spinous inorganic oxide particles not containing coarse particles, in which particles having extremely homogeneous particles are dispersed in a solvent. An acidic silicic acid is added to a dispersion liquid of core particles ... | 05/29/2012 |
| 8118898 | Spinous silica-based sol and method of producing the same The present invention provides a sol of spinous silica-based particles in which silica-based particles having peculiar forms, spinous forms are dispersed in a solvent. The spinous silica-based particles have verrucous projections formed on surfaces of spherical sili... | 02/21/2012 |
| 8114178 | Polishing composition for semiconductor wafer and polishing method The present invention relates to a polishing composition for a semiconductor wafer which is excellent in polishing property, and a polishing method. The polishing composition for a semiconductor wafer comprises colloidal silica consisting of non-spherical silica par... | 02/14/2012 |
| 8043393 | Bonded abrasive article and method of making A bonded abrasive article is provided that includes abrasive grains within a bond matrix, the abrasive grains including cubic boron nitride (cBN) and the bond matrix including a polycrystalline ceramic phase. The bonded abrasive may have a Modulus of Rupture (MOR) o... | 10/25/2011 |
| 7998229 | Polishing composition and polishing method The polishing composition contains polyoxyethylene sorbitan mono-fatty acid ester, silicon dioxide, water soluble cellulose, an alkaline compound, and water. The content of polyoxyethylene sorbitan mono-fatty acid ester in the polishing composition is less than 0.00... | 08/16/2011 |
| 7972398 | Polishing composition for glass substrate The present invention provides a polishing composition for a glass substrate having a pH of from 1 to 5 and containing silica particles having an average particle size of from 5 to 100 nm, wherein, in a projected image of the silica particles obtainable by an image ... | 07/05/2011 |
| 7959695 | Fixed abrasive articles utilizing coated abrasive particles An fixed abrasive article is provided which includes a matrix material and abrasive particles embedded within the matrix material. The abrasive particles have a core-shell structure that includes a polycrystalline alpha alumina core and a shell layer overlying the p... | 06/14/2011 |
| 7942945 | CMP slurry for polymeric interlayer dielectric planarization The proposed slurry can be used to planarize polymeric candidate ILD materials such Benzocylobutene (BCB), SILK, Polyimide, etc. The slurry consists of colloidal suspension of nanoparticle abrasives made up of Tetraethylorthosilicate (TEOS)-derived silica and Zircon... | 05/17/2011 |
| 7887609 | Polishing slurry for polishing aluminum film and polishing method for polishing aluminum film using the same A polishing slurry for polishing an aluminum film used for LSI or the like and a method for polishing an aluminum film using the same are provided. A polishing slurry for polishing an aluminum film comprising a polyvalent carboxylic acid having a first stage acid di... | 02/15/2011 |
| 7854777 | Polishing compound, method for production thereof, and polishing method A heterocyclic benzene compound such as benzotriazole, is dissolved in at least one substance selected from the group consisting of a primary alcohol having from 1 to 4 carbon atoms, a glycol having from 2 to 4 carbon atoms, an ether represented by the Formula 2 (wh... | 12/21/2010 |
| 7753974 | Polishing composition for semiconductor wafer, method for production thereof and polishing method The present invention relates to a polishing composition for a substrate including a metal such as wiring, etc., formed on a semiconductor wafer, which can provide a high polishing rate without causing scratches on the wiring metal, a method of producing the polishi... | 07/13/2010 |
| 7611552 | Semiconductor polishing composition A semiconductor polishing composition is disclosed. The composition includes fumed silica. The semiconductor polishing composition is an aqueous dispersion solution of fumed silica. Further, the number of particles of fumed silica having a particle diameter of 0.5 Î... | 11/03/2009 |
| 7597729 | Polishing composition and polishing method using the same A polishing composition contains an abrasive such as colloidal silica, at least one kind of compound selected from imidazole and an imidazole derivative, and water. The polishing composition preferably further contains an alkali compound, a water-soluble polymer, or... | 10/06/2009 |
| 7582127 | Polishing composition for a tungsten-containing substrate The invention provides a method of chemically-mechanically polishing a substrate comprising tungsten through use of a composition comprising a tungsten etchant, an inhibitor of tungsten etching, and water, wherein the inhibitor of tungsten polishing is a polymer, co... | 09/01/2009 |
| 7575615 | Process for preparing a polishing composition The present invention relates to a process for preparing a polishing composition comprising a colloidal silica prepared from a silicate. The first step involves adjusting the pH of a silica dispersion comprising colloidal silica, having an average particle size of p... | 08/18/2009 |
| 7534277 | Slurry composition for secondary polishing of silicon wafer Disclosed is a slurry composition for secondary polishing of silicon wafers comprising: 2˜10 weight % of colloidal silica having an average particle size of 30˜80 nm; 0.5˜1.5 % by weight of ammonia; 0.2˜1 weight % of a hydroxyalkycellulose-based polymer for modi... | 05/19/2009 |
| 7485162 | Polishing composition A polishing composition of the present invention, to be used in polishing for forming wiring in a semiconductor device, includes: a specific surfactant; a silicon oxide; at least one selected from the group consisting of carboxylic acid and alpha-amino acid; a corro... | 02/03/2009 |
| 7435276 | Abrasive particles having coatings with tortuous surface topography The present invention relates to abrasive composites having improved abrasive particle retention due to unique coating designs. The present invention describes coated abrasive particles having tortuous surface topography, a process for producing such coated abrasive... | 10/14/2008 |
| 7427305 | Free radical-forming activator attached to solid and used to enhance CMP formulations This invention relates to a method of making selected oxidizers or other free radical-producing compounds become more effective chemical etchants and/or oxidizers for CMP activities by promoting the formation of the free radicals in a CMP composition with one or mor... | 09/23/2008 |
| 7427587 | Polishing compound A cleaning and polishing composition contains mineral spirits, a first abrasive component of particles having a median size in a range of 1-4 microns, a second abrasive component of particles having a median size in a range of 15-30 microns and a fatty acid. The com... | 09/23/2008 |
| 7419519 | Engineered non-polymeric organic particles for chemical mechanical planarization An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeri... | 09/02/2008 |
| 7413832 | Method of producing a glass substrate for a mask blank, method of producing a mask blank, and method of producing a transfer mask In a method of producing a glass substrate for a mask blank, a surface of the glass substrate is polished by the use of a polishing liquid having a pH value between 7.0 and 7.6 that contains abrasive grains, and the abrasive grains include colloidal silica abrasive ... | 08/19/2008 |
| 7407523 | Cutting tool insert and method for producing the same An improved cutting tool insert and a method for the preparation of such cutting tool insert, having a sintered alumina and silicon carbide whisker composite material body, comprising the steps of milling and mixing the powdered starting materials of said composite ... | 08/05/2008 |
| 7404831 | Abrasive composite, method for making the same, and polishing apparatus using the same An abrasive composite, a method for making the abrasive composite, and a polishing apparatus using the abrasive composite are disclosed. The abrasive composite includes a matrix and a plurality of nano-particles distributed therein. The nano-particles are made of at... | 07/29/2008 |
| 7399330 | Agglomerate abrasive grains and methods of making the same An abrasive agglomerate includes a plurality of abrasive grains bonded together in a three-dimensional structure by a substantially continuous, non-porous inorganic binder, wherein the abrasive grains have an average size of between about 0.5 microns and about 1500 ... | 07/15/2008 |
| 7396372 | Abrasive grain and method for producing it, polishing tool and method for producing it, grinding wheel and method for producing it, and polishing apparatus An abrasive grain including a porous particle material in which a large number of secondary particles contain gaps between primary particles bonded to each other. The secondary particles are produced by growing primary particles into secondary particles, which are f... | 07/08/2008 |
| 7393371 | Nonwoven abrasive articles and methods Nonwoven abrasive articles, particularly lofty nonwoven abrasive articles, with a textured, non-planar surface and an abrasive coating thereon. The coating may cover the entire surface or only portions of the surface. The textured surface, composed of peaks or high ... | 07/01/2008 |
| 7384437 | Apparatus for making abrasive article The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providi... | 06/10/2008 |
| 7384438 | Fused Al2O3-Y2O3-ZrO2 eutectic abrasive particles, abrasive articles, and methods of making and using the same Fused abrasive particles comprising eutectic material. The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and abrasive brushes. ... | 06/10/2008 |
| 7384871 | Chemical mechanical polishing compositions and methods relating thereto The present invention provides an aqueous composition useful for polishing nonferrous metal interconnects on a semiconductor wafer comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.01 to 5% by wei... | 06/10/2008 |
| 7367870 | Polishing fluid and polishing method A polishing slurry including an oxidant, a metal oxide dissolver, a metal inhibitor and water and having a pH from 2 to 5. The metal oxide dissolver contains one or more compounds selected from one or more acids (A-group) selected from acids of which the negative va... | 05/06/2008 |
| 7368387 | Polishing composition and polishing method A polishing composition includes fumed alumina, alumina other than fumed alumina, colloidal silica, a first organic acid, a second organic acid, an oxidizing agent, and water. When the second organic acid is citric acid, the first organic acid is preferably malic ac... | 05/06/2008 |
| 7364600 | Slurry for CMP and method of polishing substrate using same Disclosed herein is a polishing slurry and a method of producing the same. The polishing slurry has high selectivity in terms of a polishing speed of an oxide layer to that of a nitride layer used in CMP of an STI process which is essential to produce ultra highly i... | 04/29/2008 |
| 7361419 | Substrate for a perpendicular magnetic recording medium, perpendicular magnetic recording medium, and manufacturing methods thereof A substrate for a perpendicular magnetic recording medium has a soft magnetic underlayer that functions as a soft magnetic backing layer of a perpendicular magnetic recording medium. The substrate for a perpendicular magnetic recording medium has a nonmagnetic base ... | 04/22/2008 |
| 7351354 | Tungsten metal removing solution and method for removing tungsten metal by use thereof A removing solution for removing tungsten metal which causes a film formation on a semiconductor substrate or adheres to it, wherein orthoperiodic acid and water are contained. ... | 04/01/2008 |
| 7351662 | Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization A low solids-content slurry for polishing (e.g., chemical mechanical planarization) of substrates comprising a dielectric and an associated method using the slurry are described. The slurry and associated method afford high removal rates of dielectric during polishi... | 04/01/2008 |
| 7344574 | Coated abrasive article, and method of making and using the same A coated abrasive article has a backing treatment preparable by at least partially polymerizing an isotropic backing treatment precursor comprising polyepoxide, polyfunctional urethane (meth)acrylate, non-urethane polyfunctional (meth)acrylate, acidic free-radically... | 03/18/2008 |
| 7344575 | Composition, treated backing, and abrasive articles containing the same A curable composition comprises epoxy resin preparable by reaction of epichlorohydrin with at least one of bisphenol A or bisphenol F, polyfunctional urethane(meth)acrylate, dicyandiamide and photoinitiator. The curable composition is useful for preparing treated ba... | 03/18/2008 |
| 7332104 | Slurry for CMP, polishing method and method of manufacturing semiconductor device Disclosed is a CMP slurry comprising a first colloidal particle having a primary particle diameter ranging from 5 nm to 30 nm and an average particle diameter of d1, the first colloidal particle being incorporated in an amount of w1 by weight and a second colloidal ... | 02/19/2008 |
| 7332453 | Ceramics, and methods of making and using the same Ceramics (including glasses and glass-ceramics) comprising nitrogen, and methods of making the same. ... | 02/19/2008 |
