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| Number | Title | Issue Date |
| 7087529 | Chemical-mechanical polishing (CMP) slurry and method of planarizing surfaces A chemical-mechanical abrasive composition for use in semiconductor processing uses abrasive particles having a non-spherical morphology. ... | 08/08/2006 |
| 7086394 | Grindable self-cleaning singulation saw blade and method A super abrasive impregnated singulation saw blade is made by depositing grindable friable super abrasive particles while electro depositing or electroless depositing a strong binder metal such as nickel on a form or mandrel. The deposited super abrasive on the uppe... | 08/08/2006 |
| 7083868 | Composite structured wear resistant coating The present invention relates to a cutting tool insert having a substrate and a coating, the coating is composed of one or more layers of refractory compounds of which at least one layer includes a composite structured (TiyAlxMe1−x−y | 08/01/2006 |
| 7081441 | Composition for cleaning and/or treating surfaces A composition for treating and/or cleaning surfaces comprises a nanoparticle component selected from the group consisting of metal oxyhydroxides, modified metal oxyhydroxides and mixtures thereof; a buffer/modifier component; optionally, an adjunct ingredient; and t... | 07/25/2006 |
| 7081424 | High-strength, highly thermally conductive sintered compact of cubic boron nitride The present high-strength, highly thermally conductive sintered compact of cubic boron nitride contains cubic boron nitride (cBN) grains and a binder binding the grains. More specifically, it is formed of at least 40% by volume and at most 85% by volume of cBN grain... | 07/25/2006 |
| 7080688 | Compositions and methods for degrading filter cake Improved methods and compositions for degrading filter cake deposited in a subterranean formation are provided. These methods and compositions utilize particulates coated with acid-releasing degradable material wherein the released acid is used to degrade a filter c... | 07/25/2006 |
| 7077879 | Composition for polishing pad and polishing pad using the same An object of the invention is to provide a polishing pad having the excellent slurry retaining properties and the large removal rate and a composition for a polishing pad which can form such the polishing pad. A composition for polishing pad of the invention is comp... | 07/18/2006 |
| 7077867 | Prosthetic knee joint having at least one diamond articulation surface Prosthetic joints, components for prosthetic joints, superhard bearing and articulation surfaces, diamond bearing and articulation surfaces, substrate surface topographical features, materials for making joints, bearing and articulation surfaces, and methods for man... | 07/18/2006 |
| 7077880 | Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization A composition and an associated method for chemical mechanical planarization (or other polishing) are described. The composition includes a surface-modified abrasive modified with at least one stabilizer and at least one catalyst differing from the at least one stab... | 07/18/2006 |
| 7077723 | Porous abrasive articles with agglomerated abrasives and method for making the agglomerated abrasives A bonded abrasive tool, having a structure permeable to fluid flow, comprises sintered agglomerates of a plurality of abrasive grains and a binding material, the binding material being characterized by a melting temperature between 500 and 1400° C., and the sintere... | 07/18/2006 |
| 7074247 | Method of making a composite abrasive compact There is provided a method of making a composite abrasive compact which comprises an abrasive compact bonded to a substrate. The abrasive compact will generally be a diamond compact and the substrate will generally be a cemented carbide substrate. The composite abra... | 07/11/2006 |
| 7073581 | Electroconductive proppant compositions and related methods Some embodiments provide methods of obtaining data from a portion of a subterranean formation comprising providing proppant particulates wherein at least a portion of the proppant particulates are coated with an electroconductive resin that comprises a resin and a c... | 07/11/2006 |
| 7070635 | Self sharpening polycrystalline diamond compact with high impact resistance A polycrystalline diamond compact for use in cutting operations with a renewable sharp cutting edge, high abrasion resistance and high impact strength. The polycrystalline diamond is a composite composed of a matrix of coarse diamond interspersed with large agglomer... | 07/04/2006 |
| 7067465 | Cleaning composition useful in semiconductor integrated circuit fabricating A composition for use in semiconductor processing wherein the composition comprises water, phosphoric acid, and an organic acid; wherein the organic acid is ascorbic acid or is an organic acid having two or more carboxylic acid groups (e.g., citric acid). The water ... | 06/27/2006 |
| 7067466 | Cleaning composition useful in semiconductor integrated circuit fabrication A composition for use in semiconductor processing wherein the composition comprises water, phosphoric acid, and an organic acid; wherein the organic acid is ascorbic acid or is an organic acid having two or more carboxylic acid groups (e.g., citric acid). The water ... | 06/27/2006 |
| 7067203 | Wear resistant coating with enhanced toughness The present invention relates to a cutting tool insert comprising a substrate and a coating. The coating composed of one or more layers of refractory compounds of which at least one layer comprises a so called MAX-phase defined as Mn+1AXn where... | 06/27/2006 |
| 7067191 | Method to increase wear resistance of a tool or other machine component A layer system in particular for tools or machine components operated under insufficient lubrication or under dry operation conditions, is proposed, which system, starting from the base body, comprises a hard substance layer system, subsequently a metallic layer and... | 06/27/2006 |
| 7067462 | UV curable lubricant compositions The present invention discloses an ultraviolet light curable lubricating composition and method for making such a composition that may be used to produce a lubricating layer. The disclosed composition does not contain any significant amount of volatile organic solve... | 06/27/2006 |
| 7063150 | Methods for preparing slurries of coated particulates Methods of creating a stable slurry of coated particulates wherein the slurry is capable of being stored for at least 2 hours before use comprising the steps of: providing resin coated particulates wherein the resin comprises a resin that does not completely cure un... | 06/20/2006 |
| 7063597 | Polishing processes for shallow trench isolation substrates Methods and compositions are provided for planarizing a substrate surface with reduced or minimal topographical defect formation during a polishing process for dielectric materials. In one aspect a method is provided for polishing a substrate containing two or more ... | 06/20/2006 |
| 7060641 | Diamond-silicon carbide composite Fully dense, diamond-silicon carbide composites are prepared from ball-milled microcrystalline diamond/amorphous silicon powder mixture. The ball-milled powder is sintered (P=5–8 GPa, T=1400K–2300K) to form composites having high fracture toughness. A composite ... | 06/13/2006 |
| 7060345 | Coated tool Coating-film furnished coated tools that are lubricative while maintaining resistance to wear are realized by coated tools in which a plurality of coating films is furnished on a base part. Furnished as the coating are one or more layers of, respectively: a first fi... | 06/13/2006 |
| 7056192 | Ceria-based polish processes, and ceria-based slurries By adding silica to ceria-based CMP slurries the polish process starts much faster than without silica thereby eliminating dead time in the polish process and eliminating process instability caused by changes in the dead time with operating conditions. A slurry for ... | 06/06/2006 |
| 7056602 | Precipitation hardened wear resistant coating The present invention relates to a cutting tool insert having a substrate and a coating, the coating is composed of one or more layers of refractory compounds of which at least one layer includes a precipitation hardened (TiyAlxMe1-x-y | 06/06/2006 |
| 7052373 | Systems and slurries for chemical mechanical polishing Systems and methods are disclosed for polishing a semiconductor substrate having a polymer film surface deposited thereon by chemishearing the surface; and performing chemical mechanical polishing (CMP) on the chemisheared surface. ... | 05/30/2006 |
| 7052522 | Polishing composition and polishing method using the same A polishing composition of the present invention, which is used in polishing the edge of a wafer for semiconductor devices, effectively suppresses remaining amounts of abrasives on the wafer. The polishing composition includes silicon dioxide, an alkaline compound, ... | 05/30/2006 |
| 7052995 | Process of manufacturing semiconductor device including chemical-mechanical polishing A buried film and a barrier film are polished together using a slurry in which the polishing rate on a substrate material (in particular, silicon oxide), that on a buried-film material (in particular, tungsten) and that on a barrier-film material (in particular, tit... | 05/30/2006 |
| 7052620 | Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device A polishing slurry for an aluminum-based metal includes an oxidizing agent having a standard electrode potential of 1.7 V or more, amino acid or amino acid compound, and bi- or higher than bi-valent aromatic carboxylic acid having a carbocycle or a heterocycle. ... | 05/30/2006 |
| 7049256 | SiAlON containing ytterbium and method of making A SiAlON ceramic body made from a starting powder mixture that includes silicon nitride powder, and one or more powders that provide aluminum, oxygen, nitrogen and ytterbium to the SiAlON ceramic. The SiAlON ceramic body includes a two phase composite comprising alp... | 05/23/2006 |
| 7044990 | Vitrified bond tool and method of manufacturing the same A vitrified bond tool including: (a) a support body; (b) a vitrified bond layer which is formed on a working surface of the support body; and (c) a plurality of abrasive grains which are held by the vitrified bond layer so as to be fixed relative to the working surf... | 05/16/2006 |
| 7044220 | Compositions and methods for improving proppant pack permeability and fracture conductivity in a subterranean well The present invention relates to enhancing fluid flow from subterranean formations. More particularly, this invention relates to providing improved proppant matrixes within fractures in a subterranean formation. An example of the methods of increasing the conductivi... | 05/16/2006 |
| 7045001 | Multi-component kit and method for pretreatment, resurfacing, and restoration of plastic material A multi-component kit and method is provided to pretreat, resurface, and restore a plastic material, and in particular, the plastic lens covers over the headlights and taillights of an automobile. The multi-component kit includes a pretreatment formulation, a resurf... | 05/16/2006 |
| 7044224 | Permeable cement and methods of fracturing utilizing permeable cement in subterranean well bores The present invention relates to methods of stimulating a subterranean formation. More particularly, but not by way of limitation, the present invention relates to methods of fracturing subterranean formations utilizing a fracturing fluid comprising a permeable ceme... | 05/16/2006 |
| 7044836 | Coated metal oxide particles for CMP The invention provides a method of polishing a substrate, which method comprises the steps of (i) providing a polishing composition, (ii) providing a substrate comprising at least one metal layer, and (iii) abrading at least a portion of the metal layer with the pol... | 05/16/2006 |
| 7041599 | High through-put Cu CMP with significantly reduced erosion and dishing High through-put Cu CMP is achieved with reduced erosion and dishing by a multi-step polishing technique. Deposited Cu is polished with fixed abrasive polishing pads initially at a high removal rate and subsequently at a reduced removal rate and high Cu:barrier laye... | 05/09/2006 |
| 7037352 | Polishing particle and method for producing polishing particle By providing an abrasive having a ratio of volume-cumulative (95%) average particle size (D95) to volume-cumulative (50%) average particle size (D50) (D95/D50) falling within a range of 1.2 to 3.0 or an abrasive having a volume-cumulative (95%) average particle size... | 05/02/2006 |
| 7037451 | Chemical-mechanical planarization slurries and powders and methods for using same Chemical-mechanical planarization slurries and methods for using the slurries wherein the slurry includes abrasive particles. The abrasive particles have a small particle size, narrow size distribution and a spherical morphology and the particles are substantially u... | 05/02/2006 |
| 7037351 | Non-polymeric organic particles for chemical mechanical planarization An abrasive composition comprising non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The inventive compositions preferably comprise soft water in combination with 0... | 05/02/2006 |
| 7036915 | Composition for forming piezoelectric film, producing method for piezoelectric film, piezoelectric element and ink jet recording head A composition for forming a piezoelectric film containing a dispersoid obtained from a metallic compound includes at least one of 1,8-diazabicyclo[5.4.0]-7-undecene, 1,5-diazabicyclo[4.3.0]non-5-ene, and 1,4-diazabicyclo[2.2.2]octane. ... | 05/02/2006 |
| 7036587 | Methods of diverting treating fluids in subterranean zones and degradable diverting materials Methods of diverting treating fluids in subterranean zones penetrated by well bores are provided. The methods basically comprise the following steps. A degradable particulate diverting material is placed in a subterranean zone that contains releasable water. A treat... | 05/02/2006 |
