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| Number | Title | Issue Date |
| 6953389 | Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching Metal CMP slurry compositions having relatively low chemical etch rate and relatively high mechanical polishing rate characteristics are provided. The relatively high mechanical polishing rate characteristics are achieved using relatively high concentrations of mech... | 10/11/2005 |
| 6953385 | System, method, and apparatus for non-traditional kinematics/tooling for efficient charging of lapping plates A system for charging lapping plates incorporates the use of individual ceramic inserts that are mounted into a stainless steel frame to form a novel charging tool. The charging tool is rotated clockwise against a counterclockwise rotating tin plate. This configurat... | 10/11/2005 |
| 6951577 | Abrasive articles and method of making and using the articles An abrasive article comprising abrasive particles and a UV-cured formulation and a filler, wherein the filler is substantially transparent to UV-radiation and the filler is present in a range from 20 to 80 percent by weight based on the combined weight of the formul... | 10/04/2005 |
| 6951578 | Polycrystalline diamond materials formed from coarse-sized diamond grains PCD materials of this invention comprise diamond crystals that are bonded together with a catalyst/binder material. The PCD material is prepared by combining diamond grains with a catalyst/binder material either as a premixture or by infiltration during sintering. T... | 10/04/2005 |
| 6949129 | Method for making resin bonded abrasive tools A method for producing organically bonded abrasive article includes combining an abrasive grain component and a phenol-based resin component. The combined components are molded and thermally cured in an atmosphere that comprises humidity, wherein the atmosphere cont... | 09/27/2005 |
| 6949128 | Method of making an abrasive product The invention provides a method of making an embossed abrasive article comprising providing a sheet-like foam backing having a first surface and an opposite second surface; providing an abrasive coating comprising abrasive particles and binder over said first surfac... | 09/27/2005 |
| 6946009 | Cerium-based abrasive material and abrasive material slurry, and method for producing cerium based abrasive material There is provided a cerium-based abrasive containing cerium oxide as a main component, in which the abrasive particles composing the abrasive are coated with a coating layer containing at least either one of a silicon component of silicon or a silicon compound and a... | 09/20/2005 |
| 6946010 | Method for making abrasive compositions and products thereof Method of making abrasive compositions comprised of water-insoluble abrasive polishing agents suspended in an aqueous medium in combination, which avoids the need and associated cost of dry milling the abrasive particle content, and products thereof. In particular, ... | 09/20/2005 |
| 6939506 | Diamond-silicon carbide composite and method for preparation thereof Fully dense, diamond-silicon carbide composites are prepared from ball-milled microcrystalline diamond/amorphous silicon powder mixture. The ball-milled powder is sintered (P=5-8 GPa, T=1400K-2300K) to form composites having high fracture toughness. A composite made... | 09/06/2005 |
| 6939607 | Cutting tool A ceramic cutting tool including a ceramic base member 4 of a tool main body 1 which is formed of a composite ceramic which contains a hard phase dispersed within an alumina matrix phase. The hard phase contains, as a predominant component, one or more... | 09/06/2005 |
| 6939211 | Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions A planarizing slurry for mechanical and/or chemical-mechanical polishing of microfeature workpieces. In one embodiment, the planarizing slurry comprises a liquid solution and a plurality of abrasive elements mixed in the liquid solution. The abrasive elements compri... | 09/06/2005 |
| 6938815 | Heat-resistant electronic systems and circuit boards Methods of making improved electronic systems and circuits boards, and more specifically to methods of making improved electronic systems and circuits boards using heat-resistant composite materials having superior mechanical, thermal, and electrical properties.... | 09/06/2005 |
| 6935618 | Valve component with multiple surface layers A sliding component, particularly a disk valve plate. The sliding component includes a multi-layer surface structure comprising a strengthening layer harder than the substrate material, and an amorphous diamond top layer. ... | 08/30/2005 |
| 6935013 | Apparatus and method for precise lapping of recessed and protruding elements in a workpiece A lapping method utilizing textured and conditioned lapping plates most suitable for finishing magnetic heads resulting in improved surface quality, less sensitivity to electrical shorts due to smears, and reduced surface height difference between the head elements ... | 08/30/2005 |
| 6936083 | Treated backing and method of making the same A treated backing comprises a fabric and a composition that comprises epoxy resin preparable by reaction of epichlorohydrin with at least one of bisphenol A or bisphenol F, polyfunctional (meth)acrylate, dicyandiamide, and photoinitiator. ... | 08/30/2005 |
| 6936543 | CMP method utilizing amphiphilic nonionic surfactants The invention provides methods of polishing a substrate comprising (i) contacting a substrate comprising at least one metal layer comprising copper with a chemical-mechanical polishing (CMP) system and (ii) abrading at least a portion of the metal layer comprising c... | 08/30/2005 |
| 6933049 | Abrasive tool inserts with diminished residual tensile stresses and their production An abrasive tool insert includes (a) a substrate having a support face that includes (1) an inner support table, (2) an outer shoulder having a width, Sw, and (3) a downwardly sloping interface from the support table to the shoulder, which interface has a... | 08/23/2005 |
| 6929669 | Abrasive solid An abrasive solid is composed of an organic high polymer matrix and an abrasive material dispersed in the matrix to form a solid mass, whose cutting resistance is from 2 kgf (19.6 N) to 15 kgf (147 N) so that the abrasive solid is severable into two with use of a kn... | 08/16/2005 |
| 6929851 | Coated substrate Method for removing a portion of the binder phase from the surface of a substrate that is composed of particles of at least a first phase joined together by the binder phase, and wherein the surface is etched by contacting it with a gas flow of an etchant gas and a ... | 08/16/2005 |
| 6923840 | Flexible abrasive product and method of making and using the same The present invention provides a flexible abrasive product comprised of an open cell foam backing, a foraminous barrier coating and a shaped foraminous abrasive coating. The flexible abrasive article of the invention is made by applying a curable barrier coating ove... | 08/02/2005 |
| 6924227 | Slurry for chemical mechanical polishing and method of manufacturing semiconductor device A method of manufacturing a semiconductor device uses a slurry for chemical polishing during the manufacturing process, the slurry containing polishing particles comprising colloidal particles whose primary particles have a diameter ranging from 5 to 30 nm, wherein ... | 08/02/2005 |
| 6921422 | Ductile binder phase for use with A1MgB14 and other hard materials This invention relates to a ductile binder phase for use with AlMgB14 and other hard materials. The ductile binder phase, a cobalt-manganese alloy, is used in appropriate quantities to tailor good hardness and reasonable fracture toughness for hard materi... | 07/26/2005 |
| 6918938 | Polishing composition A polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition; a process for reducing a surface defect of a substrate comprising applying to... | 07/19/2005 |
| 6918937 | Abrasive polishing composition The present invention is based on the practice of abrasive machining with no sealed working chamber by the employment of a visco-elastic abrasive medium, behaving predominantly as an elastic solid at the applied strain of the orbital working motion, and applying orb... | 07/19/2005 |
| 6913843 | Cemented carbide with binder phase enriched surface zone A cutting tool insert has a cemented carbide substrate and a coating. The cemented carbide substrate includes 73-93 wt % WC, 4-12 wt % binder phase, and cubic carbide phase with a binder phase enriched surface zone essentially free of cubic carbide phase. The cubic ... | 07/05/2005 |
| 6914002 | Differential planarization Method and structure for optimizing and controlling chemical mechanical planarization are disclosed. Embodiments of the invention include planarization techniques to make nonplanar surfaces comprising alternating metal and intermetal layers. Relative protrusion dime... | 07/05/2005 |
| 6913633 | Polycrystalline abrasive grit A method is provided for producing a plurality of polycrystalline ultra-hard abrasive grit. The method includes the steps of providing a mass of ultra-hard abrasive particles or a mass of a combination of a precursor for such particles and a suitable solvent/catalys... | 07/05/2005 |
| 6911059 | Abrasive pad and process for the wet-chemical grinding of a substrate surface An abrasive pad is suitable for the wet-chemical grinding of a substrate surface. The novel abrasive pad has a polymer matrix with a defined water-solubility. The water-solubility is realized by the level of nonpolar and polar repeat units in the polymers. ... | 06/28/2005 |
| 6910952 | Polishing composition A polishing composition for a substrate for memory hard disk, comprising silica particles in an aqueous medium, wherein the silica particles satisfy a specified relationship between an average particle size of the silica particles on the number basis and a standard ... | 06/28/2005 |
| 6905526 | Fabrication of an ion exchange polish pad Embodiments of the invention include an ion exchange polish pad for polishing a semiconductor substrate, on which various conductive, semiconductive, and/or insulative layers are formed, for example a conductive copper layer. Embodiments also include the method for ... | 06/14/2005 |
| 6905527 | Method of manufacturing cerium-based polishing agent This invention aims to provide a method of manufacturing a cerium-based abrasive containing coarse particles in lower concentration and having higher polishing ability and excellent cleanability for a polished face. Further, the present invention provides a method o... | 06/14/2005 |
| 6901684 | Method for producing cerium-based abrasive and cerium-based abrasive produced thereby This invention is a method for producing a cerium-based abrasive which includes: a step of grinding raw material for the cerium-based abrasive; a step of roasting the ground raw material; and a step of subjecting the roasted raw material to wet processing, the metho... | 06/07/2005 |
| 6902591 | Polishing composition A polishing composition comprising an abrasive, water and an organic acid or a salt thereof, wherein the composition has a specified viscosity of from 1.0 to 2.0 mPa·s at a shearing rate of 1500 s−1 and 25° C.; a roll-off reducing agent comprising a B... | 06/07/2005 |
| 6896710 | Abrasives for CMP applications The present invention provides a novel, structurally improved, abrasive agent, with improved surface properties resulting, inter alia, in enhanced wettability, dispersability and bonding. More specifically, the present invention provides according to an aspect there... | 05/24/2005 |
| 6893476 | Composition and associated methods for chemical mechanical planarization having high selectivity for metal removal A composition and associated methods for chemical mechanical planarization (or other polishing) are described. The composition may comprise an abrasive and a dispersed hybrid organic/inorganic particle. The composition may further comprise an alkyne compound. Two di... | 05/17/2005 |
| 6893477 | Cerium-based abrasive material slurry and method for producing cerium-based abrasive material slurry The present invention provides a cerium-based abrasive slurry particles including a cerium-based abrasive particle of no less than 95% by weight of total rare earth oxides (TREO), in which the cerium-based abrasive particle has less than 3% by weight of fluorine con... | 05/17/2005 |
| 6890632 | Coated cutting tool insert Coated cemented carbide inserts (cutting tool), particularly useful for milling at high cutting speeds in steels and milling in hardened steels are characterised by a WC—Co cemented carbide containing NbC and TaC and a W-alloyed binder phase and a coating includin... | 05/10/2005 |
| 6890655 | Diamond coated cutting tool and method for making the same A diamond coated cutting tool that has a treated substrate and a diamond coating thereon. In the process of making the substrate, the sintered substrate is re-sintered to form a re-sintered substrate and the re-sintered substrate is chemically treated to remove coba... | 05/10/2005 |
| 6887289 | Cerium oxide sol and abrasive There is provided an abrasive used for polishing a substrate which comprises silica as a main component, for example a rock crystal, a quartz glass for photomask, for CMP of an organic film, Inter Layer Dielectric (ILD) and shallow trench isolation of a semiconducto... | 05/03/2005 |
| 6887137 | Chemical mechanical polishing slurry and chemical mechanical polishing method using the same Slurries for chemical mechanical polishing (CMP) are provided including a high planarity slurry and high selectivity ratio slurry. A high planarity slurry includes at least one kind of metal oxide abrasive particle and an anionic polymer passivation agent having a f... | 05/03/2005 |
