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| Number | Title | Issue Date |
| 8182562 | Slurries containing abrasive grains having a unique morphology A slurry containing a plurality of monocrystalline diamond particles, wherein the average surface roughness of said particles is less than about 0.95; a major vehicle selected from the group of water-based vehicles, glycol-based vehicles, oil-based vehicles or hydro... | 05/22/2012 |
| 7744666 | Polishing medium for chemical-mechanical polishing, and method of polishing substrate member This invention provides a polishing medium for chemical-mechanical polishing, comprising an oxidizing agent for a conductor, a protective-film-forming agent for protecting a metal surface, an acid, and water; (1) the polishing medium having a pH of 3 or less, and th... | 06/29/2010 |
| 7404831 | Abrasive composite, method for making the same, and polishing apparatus using the same An abrasive composite, a method for making the abrasive composite, and a polishing apparatus using the abrasive composite are disclosed. The abrasive composite includes a matrix and a plurality of nano-particles distributed therein. The nano-particles are made of at... | 07/29/2008 |
| 7374592 | Cleaning and polishing composition for metallic surfaces A polish composition for metallic surfaces containing a polish and abrasive alumina nanoparticles in a water in oil emulsion composition composed of surfactants, suspending agents, and aluminum oxide particles of high purity of 200 nanometers or less having a median... | 05/20/2008 |
| 7312152 | Lactate-containing corrosion inhibitor The corrosion of aluminum-based metal films may be minimized by applying a lactate-containing solution to the aluminum-based metal films before the aluminum-based metal films are etched. The lactate-containing solution is applied to the aluminum-based metal film bef... | 12/25/2007 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7256091 | Method of manufacturing a semiconductor device with a self-aligned polysilicon electrode In a method of manufacturing a semiconductor device, an isolation pattern is formed on a substrate. The isolation pattern includes an opening that exposes a portion of the substrate. A preliminary polysilicon layer is formed on the substrate and the isolation patter... | 08/14/2007 |
| 7138180 | Hard carbon films formed from plasma treated polymer surfaces Hard-carbon films with unique structures, methods for producing the films, and articles coated by the films are provided. These hard-carbon films are synthesized by the plasma surface treatment of a polymer substrate or a polymer-coated substrate in a plasma contain... | 11/21/2006 |
| 7125477 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 10/24/2006 |
| 7119015 | Method for forming polysilicon plug of semiconductor device Disclosed is a method for forming a polysilicon plug of a semiconductor device. The method comprises the steps of: forming a stacked pattern of a wordline and a hard mask film on a semiconductor substrate comprising a cell region and a peripheral circuit region; for... | 10/10/2006 |
| 7112270 | Algorithm for real-time process control of electro-polishing Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In one embodiment, an endpoint is... | 09/26/2006 |
| 7077723 | Porous abrasive articles with agglomerated abrasives and method for making the agglomerated abrasives A bonded abrasive tool, having a structure permeable to fluid flow, comprises sintered agglomerates of a plurality of abrasive grains and a binding material, the binding material being characterized by a melting temperature between 500 and 1400° C., and the sintere... | 07/18/2006 |
| 7077721 | Pad assembly for electrochemical mechanical processing Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A... | 07/18/2006 |
| 7066800 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adap... | 06/27/2006 |
| 7029365 | Pad assembly for electrochemical mechanical processing Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an ... | 04/18/2006 |
| 6979248 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coat... | 12/27/2005 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupl... | 11/08/2005 |
| 6942780 | Method and apparatus for processing a substrate with minimal edge exclusion An apparatus for processing a material on a wafer surface includes a cavity defined by a peripheral wall and configured to direct a process solution and direct it to the surface to to a first wafer surface region without being directed to a second wafer surface regi... | 09/13/2005 |
| 6869336 | Methods and compositions for chemical mechanical planarization of ruthenium Methods and compositions are provided for the chemical mechanical planarization of ruthenium. The method includes polishing the ruthenium layer using a low contact pressure and exposing the ruthenium layer to a planarization composition while polishing. The planariz... | 03/22/2005 |
| 6780212 | Surface finishing composition A finishing composition for a variety of surfaces, including, without limitation, paints, metals, plastics and fiberglass, comprises water, wax, soap, scent, hair conditioner, mineral spirits and abrasives. ... | 08/24/2004 |
| 6746314 | Nitride CMP slurry having selectivity to nitride A nitride CMP slurry having selectivity to nitride over oxide. The slurry increases the polishing speed of a nitride film by varying the pH of the slurry, and polishes the nitride film faster than an oxide film by decreasing the polishing speed of the oxide film. As... | 06/08/2004 |
| 6733577 | Liquid polish The invention pertains to a liquid polish for metals, glass, plastics and their derivatives: the novel liquid polish reduces application and buffing time significantly compared to prior art polishes using animal fat, glycerides, oils, wetting agents or tallow and us... | 05/11/2004 |
| 6559056 | Aqueous dispersion for chemical mechanical polishing The object of the present invention is to provide an aqueous dispersion for chemical mechanical polishing which can be polished working film for semiconductor devices and which is useful for STI. The aqueous dispersion for chemical mechanical polishing of... | 05/06/2003 |
| 6500220 | Impregnated grinding wheel A vitreous bonded abrasive article, more particularly a grinding wheel, having improved grinding performance is provided wherein the open pores of the abrasive article contain an impregnant which comprises at least one water insoluble, sulfur bearing orga... | 12/31/2002 |
| 6443812 | Compositions for insulator and metal CMP and methods relating thereto A composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising an organic polymer having a backbone comprised of at least 16 carbon atoms, the polymer having a plurality of moieties with affinity to surface group... | 09/03/2002 |
| 6440319 | Method and apparatus for predicting process characteristics of polyurethane pads A measurement of polyurethane pad characteristics is used to predict performance characteristics of polyurethane pads used for chemical mechanical planarization (CMP) of semiconductor wafers, and to adjust process parameters for manufacturing polyurethane... | 08/27/2002 |
| 6419174 | Abrasive compositions and methods for making same Abrasive compositions comprised of water-insoluble abrasive polishing agents suspended in a liquid medium in combination with humectant, and methods for making same. The inventive abrasive compositions are rheologically stable, settling-resistant, and re-... | 07/16/2002 |
| 6391072 | Abrasive grain Alpha alumina abrasive grits which are particularly well-suited to medium to low pressure grinding applications wherein the grits comprise uniformly dispersed microvoids.... | 05/21/2002 |
| 6383332 | Endpoint detection method and apparatus which utilize a chelating agent to detect a polishing endpoint A method of planarizing a semiconductor wafer having a polishing endpoint layer that includes a ligand is disclosed. One step of the method includes polishing a first side of the wafer in order to remove the ligand from the wafer. Another step of the meth... | 05/07/2002 |
| 6375791 | Method and apparatus for detecting presence of residual polishing slurry subsequent to polishing of a semiconductor wafer A method of detecting presence of a polishing slurry on a semiconductor wafer subsequent to polishing of the wafer includes the step of adding a chemical marker to the polishing slurry. The method also includes the step of polishing a first side of the wa... | 04/23/2002 |
| 6312484 | Nonwoven abrasive articles and method of preparing same An abrasive article is provided having a rebulkable nonwoven web and a continuous sheet-like abrasive coating bonded to the first major surface of the nonwoven web. The abrasive coating comprising a plurality of abrasive particles dispersed in a binder.... | 11/06/2001 |
| 6300249 | Polishing compound and a method for polishing The present invention is a polishing compound comprising a colloidal solution containing 1~15 wt. % of silicon oxide particles of 8~500 nanometer average diameter, wherein said colloidal solution is prepared as a buffer solution which has buffering action... | 10/09/2001 |
| 6258205 | Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material An apparatus for planarizing a semiconductor wafer having a polishing endpoint layer that includes a catalyst material is disclosed. The apparatus is operable to detect the endpoint based upon the chemical slurry whether a catalytic reaction has occurred ... | 07/10/2001 |
| 6238449 | Abrasive article having an abrasive coating containing a siloxane polymer Structured abrasive articles having an abrasive coating including a binder which comprises the reaction product of a binder precursor and a reactive siloxane polymer are described as well as methods of making same. The reactive siloxane polymers have at l... | 05/29/2001 |
| 6235070 | Rigid sand body, method for producing the same, use thereof and method for producing grains of sand coated in wax The invention relates to a rigid sand body consisting of a plurality of sand grains adhering to one another and provided with a coating consisting of wax, wherein the sand body is abradable, as well as to a process for its preparation, which is characteri... | 05/22/2001 |
| 6214067 | Magnesium oxychloride plug-filled magnesium oxychloride bonded abrasive Corrugated abrasive discs such as grinding wheels are treated by applying a water-resistant coating to the interiors of the corrugations before the corrugations are plugged. Discs having water-sensitive matrices such as magnesium oxychloride cement are th... | 04/10/2001 |
| 6183346 | Abrasive article with embossed isolation layer and methods of making and using An abrasive article including (i) an embossed isolation layer defining inversely contoured first and second surfaces with a plurality of peaks on the first surface producing a plurality of pockets on the second surface, (ii) grinding aid-containing protru... | 02/06/2001 |
| 6086648 | Bonded abrasive articles filled with oil/wax mixture An abrasive article is provided for precision grinding purposes, and the article comprises 3 to 25 volume % vitreous bond, 3 to 56 volume % MCA abrasive grain, and 28 to 63 volume % open porosity. Substantially all porosity in the abrasive article is impr... | 07/11/2000 |
| 6048375 | Coated abrasive Abrasive tools, such as coated abrasives, made using radaition curable resin binders can be given a greater depth of cure of the binder if they include an acylphosphine oxide initiator.... | 04/11/2000 |
| 5954844 | Abrasive article comprising an antiloading component An abrasive article, for example, a coated, bonded, or nonwoven abrasive article comprising a binder, a plurality of abrasive particles, and an antiloading component.... | 09/21/1999 |
