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| Number | Title | Issue Date |
| 8177871 | Vitrified bonded grindstone In a vitrified bonded grinding wheel that is formed so that superabrasives formed of cubic boron nitride (CBN) grains or diamond grains are bonded and held with a vitrified binder, the vitrified binder is formed of oxide particles and amorphous glass, and the vitrif... | 05/15/2012 |
| 8123828 | Method of making abrasive shards, shaped abrasive particles with an opening, or dish-shaped abrasive particles By controlling the process parameters and by using a polymeric production tooling having a plurality of mold cavities, different types of shaped abrasive particles selected from the group consisting of abrasive shards, dish-shaped abrasive particles, and shaped abra... | 02/28/2012 |
| 7332224 | Cleaning article containing hydrophilic polymers The invention relates to a cloth that can function as a moisturizing cleanser. When the cloth is moistened with water, it works up into a warm, sudsy cleansing lotion that feels great and works well as a facial cleansing cloth. The cloth contains water, at least one... | 02/19/2008 |
| 7326378 | Process for producing polyurethane grinding tool A process for producing a polyurethane grinding tool is provided, the process including a step of mixing one or more types of polyol component selected from the group consisting of polyether polyols and polyester polyols with inorganic abrasive grains, a step of mix... | 02/05/2008 |
| 7311862 | Method for manufacturing microporous CMP materials having controlled pore size A method of manufacturing a chemical-mechanical polishing (CMP) pad comprises the steps of (a) forming a layer of a polymer resin liquid solution (i.e., a polymer resin dissolved in a solvent); (b) inducing a phase separation in the layer of polymer solution to prod... | 12/25/2007 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7217176 | Polishing tool with several pressure zones The invention refers to a polishing tool for optical lenses with at least one polishing pad adaptable at least partially to the shape of a lens surface of said lenses and drivable by means of a drive shaft, said polishing pad having a membrane, wherein said polishin... | 05/15/2007 |
| 7214125 | Method for controlling pH during planarization and cleaning of microelectronic substrates A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a p... | 05/08/2007 |
| 7183212 | Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device Described is a polishing technique adapted for multilevel metallization of an electronic circuit device, which comprises polishing a metal film with a polishing liquid containing an oxidizing substance, a phosphoric acid and a protection-layer forming agent. The pre... | 02/27/2007 |
| 7163437 | System with sealed polishing pad A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer with an aperture and a first portion that is permeable to liquid, and a ... | 01/16/2007 |
| 7134953 | Endless abrasive belt and method of making the same Endless abrasive belt useful for polishing or otherwise abrading surfaces. ... | 11/14/2006 |
| 7125477 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 10/24/2006 |
| 7112119 | Sealed polishing pad methods A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer with an aperture and a first portion that is permeable to liquid, and a ... | 09/26/2006 |
| 7112270 | Algorithm for real-time process control of electro-polishing Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In one embodiment, an endpoint is... | 09/26/2006 |
| 7077721 | Pad assembly for electrochemical mechanical processing Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A... | 07/18/2006 |
| 7066800 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adap... | 06/27/2006 |
| 7060119 | Therapeutic abrasive sponge The foot smoothing pad has a polyurethane foamed core which is coated with particulate abrasive material. The pad is water resistant and completely washable and may be used either wet or dry. It is used to remove buildup of rough, dry skin, especially on the feet an... | 06/13/2006 |
| 7037179 | Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates Methods and apparatuses for planarizing a microelectronic substrate. In one embodiment, a planarizing pad for mechanical or chemical-mechanical planarization includes a base section and a plurality of embedded sections. The base section has a planarizing surface, an... | 05/02/2006 |
| 7036592 | High strength particles and methods of their use in subterranean operations The present invention relates to composite particulates comprising a base material and a nanoparticle material. One embodiment of the present invention provides a method of using a sintered composite particulate in a subterranean application comprising providing a s... | 05/02/2006 |
| 7029747 | Integral polishing pad and manufacturing method thereof An integral polishing pad includes an elastic support layer and a polishing layer, which is formed on the elastic support layer and has a higher hardness than the elastic support layer. The elastic support layer and the polishing layer are made from materials chemic... | 04/18/2006 |
| 7029365 | Pad assembly for electrochemical mechanical processing Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an ... | 04/18/2006 |
| 7015268 | Method for making microabrasive tools A microabrasive tool is formed from a slurry including liquid, abrasive grains, a bonding material, and a polymer—for example, gellan gum. The slurry is cast in a mold, and the polymer is ionically cross-linked. Cross-linking the polymer fixes the structure of the... | 03/21/2006 |
| 6998166 | Polishing pad with oriented pore structure The invention provides a polishing pad for chemical-mechanical polishing comprising a body, a polishing surface, and a plurality of elongated pores, wherein about 10% or more of the elongated pores have an aspect ratio of about 3:1 or greater and are substantially o... | 02/14/2006 |
| 6979248 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coat... | 12/27/2005 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupl... | 11/08/2005 |
| 6913523 | Method for controlling pH during planarization and cleaning of microelectronic substrates A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a p... | 07/05/2005 |
| 6887288 | Superfinishing grindstone A superfinishing grindstone suitable for precision grinding, that contains either RB (rice bran) ceramic fine grains or CRB (carbonized rice bran) ceramic fine grains or a combination of both, for use as abrasive grains. The grains of RB ceramic fine grains and CRB ... | 05/03/2005 |
| 6887287 | Vitrified superabrasive tool and method of manufacture An abrasive tool includes a superabrasive grain component, a filler component that comprises hollow bodies and a vitreous bond. Natural and synthetic diamond, cubic boron nitride and combinations thereof can be employed as the superabrasive grain component. The vitr... | 05/03/2005 |
| 6860959 | Nonwoven abrasive material An abrasive material comprises an integral mass of discrete lengths, not bonded to each other, of abrasive-coated non-woven synthetic fibres. In particular, the entanglement force between the said lengths is great enough to maintain a wad of the material when in use... | 03/01/2005 |
| 6860913 | Method for making abrasive compositions and products thereof Method of making abrasive compositions comprised of water-insoluble abrasive polishing agents suspended in an aqueous medium in combination, which avoids the need and associated cost of dry milling the abrasive particle content, and products thereof. In particular, ... | 03/01/2005 |
| 6790126 | Agglomerate abrasive grain and a method of making the same Agglomerate abrasive grain is disclosed. The agglomerate abrasive grain can be incorporated into abrasive products such as coated abrasives, bonded abrasives, nonwoven abrasives, and abrasive brushes. A method of making agglomerate abrasive grain is also disclosed. | 09/14/2004 |
| 6773473 | Supercritical fluid extraction A method is provided for fabricating an abrasive article having porosity. The method includes blending a mixture of abrasive grain, bond material, and pore inducer, in which the pore inducer is soluble in a supercritical fluid, and the abrasive grain and bond materi... | 08/10/2004 |
| 6749485 | Hydrolytically stable grooved polishing pads for chemical mechanical planarization An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron... | 06/15/2004 |
| 6733876 | Flexible abrasive article The present invention provides a flexible abrasive article containing minimal releaseable amounts of physical and chemical contaminants that may be used to clean surfaces. The abrasive article is made of a foraminous substrate, at least one binder and abrasive parti... | 05/11/2004 |
| 6719818 | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a lase... | 04/13/2004 |
| 6685755 | Porous abrasive tool and method for making the same An abrasive article including from about 40 to about 80 volume percent interconnected porosity, the article being useful as a segment for a segmented grinding wheel, and a method for fabricating the same. The method includes blending a mixture of abrasive... | 02/03/2004 |
| 6676717 | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of genera... | 01/13/2004 |
| 6645263 | Cellular abrasive article Abrasive articles abrasive articles (e.g., abrasive wheels) comprised of abrasive agglomerate particles dispersed within cellular polymeric material, and methods of making and using the abrasive articles.... | 11/11/2003 |
| 6641627 | Abrasive articles Abrasive articles (e.g., abrasive wheels) comprised of abrasive particles and polymeric material such as a polymeric reaction product of components comprising saturated polyol, saturated polyisocyanate, and a free radical source, and methods of making and... | 11/04/2003 |
| 6575824 | Abrasive molding and abrasive disc provided with same An abrasive molding comprising at least 90% by weight, based on the abrasive molding, of an inorganic material having a stock hardness of 50-400 kg/mm2, and said abrasive molding having a relative density of 20-70% and an average particle diame... | 06/10/2003 |
