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| Number | Title | Issue Date |
| 8187055 | Polishing apparatus and polishing method A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tap... | 05/29/2012 |
| 8083571 | Polishing apparatus A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical, direction. The polishing apparatus also has a distance measuring sensor operable to detect a posit... | 12/27/2011 |
| 7927185 | Method for assessing workpiece nanotopology using a double side wafer grinder A method of processing a semiconductor wafer using a double side grinder of the type that holds the wafer in a plane with a pair of grinding wheels and a pair of hydrostatic pads. The method includes measuring a distance between the wafer and at least one sensor and... | 04/19/2011 |
| 7824246 | Wheel spindle device for grinding machine In a wheel spindle device wherein a plurality of grinding wheels are attached in a juxtaposed relation to a wheel spindle rotatably carried on a wheel head of a grinding machine, a reference position for specifying a position in the circumferential direction of the ... | 11/02/2010 |
| 7811153 | High throughput servo load cup with integrated wet chemistry delivery A work piece handling apparatus moves workpieces with a plurality of independently movable load cups that have combined multiple axes of motion. The apparatus can load and unload work pieces from a wet process station and move work pieces between wet process station... | 10/12/2010 |
| 7803036 | Method of using a contour follower A contour follower includes a plurality of sensors spaced around a waterjet nozzle, each of the sensors being configured to measure a distance between a working surface and a first plane, perpendicular to a longitudinal axis of the nozzle. The sensors may include ha... | 09/28/2010 |
| 7722437 | Manufacturing method of semiconductor integrated circuit device A polishing pad used in a CMP step in the manufacture of a semiconductor integrated circuit device is relatively expensive; thus, it is necessary to avoid a wasteful exchange of the pad. Accordingly, it is important to measure the abrasion amount of this pad precise... | 05/25/2010 |
| 7662023 | Double side wafer grinder and methods for assessing workpiece nanotopology A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned between the grinding wheels and part of the workpiece is positioned bet... | 02/16/2010 |
| 7628677 | Automated insulation milling machine An automatic insulation block milling machine is disclosed. The machine combines a series of operations into a single, automatic, production-line machine. Blocks of rigid insulation material, such as cellular glass blocks, are fed into the automated machine. The blo... | 12/08/2009 |
| 7601049 | Double side wafer grinder and methods for assessing workpiece nanotopology A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned between the grinding wheels and part of the workpiece is positioned bet... | 10/13/2009 |
| 7585205 | Substrate polishing apparatus and method A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against... | 09/08/2009 |
| 7524232 | Workpiece centering apparatus and method of centering workpiece The workpiece centering apparatus is capable of highly reducing damage of a workpiece. The workpiece centering apparatus comprises: a guide plate being provided in a tray and covering a water inlet so as to horizontally introduce water into the tray; and at least th... | 04/28/2009 |
| 7438775 | Lens layout block device A lens layout block device comprising a seal feeding device that supplies an elastic seal to a seal sticking position (A5). The elastic seal is loaded in a tape loading part in the form of a seal tape covered by a mount and a protective sheet and wound in a r... | 10/21/2008 |
| 7438628 | Device and control unit for belt sanding systems A belt sanding system comprising a segmented sanding block including a plurality of individually controllable segments and one or more sanding belt deflecting rollers, a plurality of sensing elements corresponding to the plurality of segments, and a device for inter... | 10/21/2008 |
| 7435158 | Initial position setting method of grinding wheel in vertical double disc surface grinding machine The present invention provides an initial position setting method of grinding wheels, before starting a grinding operation, in a vertical double disc surface grinding machine for surface grinding the upper and lower grinding surfaces of a work-piece simultaneously b... | 10/14/2008 |
| 7431632 | Control system and method for processing jewelry and the like A control system for controlling processing of workpieces such as jewelry has gantry and gimbal units having x, y, z translational and x, y, z rotational degrees of freedom, the units carrying a gripper for holding a piece of jewelry. Drive motors are associated wit... | 10/07/2008 |
| 7422511 | Element for detecting the amount of lapping having a resistive film electrically connected to the substrate An element for detecting an amount of lapping of a stacked structure that includes a substrate and a magnetic field detecting sensor is provided. The element comprises: a resistive film that is arranged on a lapping surface of the stacked structure, the resistive fi... | 09/09/2008 |
| 7416474 | Planarization apparatus The present invention is a planarization apparatus for planarizing a coating film applied on a substrate before the coating film is hardened, including a contact body such as a brush or sponge brought into contact with a front surface of the coating film on the subs... | 08/26/2008 |
| 7413499 | Grinding process and apparatus with arrangement for grinding with constant grinding load A process of grinding a surface of a workpiece, by a grinding tool rotated about its axis. The process includes a grinding step of grinding the workpiece surface, by pressing at least one of the grinding tool and the workpiece against the other of the grinding tool ... | 08/19/2008 |
| 7412999 | Label remover The present invention relates to a hand held label removal apparatus, which provides a safe and easy removal of otherwise hard to remove labels that are affixed to various types of containers such as carton packaging, plastic products and similar materials. The dist... | 08/19/2008 |
| 7377836 | Versatile wafer refining Methods of refining using a plurality of refining elements are discussed. A refining apparatus having refining elements that can be smaller than the workpiece being refined are disclosed. New refining methods, refining apparatus, and refining elements disclosed. Met... | 05/27/2008 |
| 7364492 | On-line grinding method for work roll An on-line roll grinding method for a work roll, which can decrease an overshoot, by which the pressing load of a rotating grinding wheel on a work roll exceeds a set grinding pressing load, is provided. This method is an on-line grinding method for a work roll, ada... | 04/29/2008 |
| 7357031 | Precision sensor assembly for rotating members in a machine tool A precision sensor assembly for rotating members in a machine tool comprises a rotor unit (16) rigidly fixed to a rotor portion (2a) of the machine tool and including a sensor (5) for detecting vibrations produced by the operation of the ... | 04/15/2008 |
| 7354332 | Technique for process-qualifying a semiconductor manufacturing tool using metrology data A technique of the present invention utilizes qualification characteristics from a single wafer for qualifying a semiconductor manufacturing tool. Generally speaking, the technique commences with the processing of a wafer by the manufacturing tool. During processing... | 04/08/2008 |
| 7351131 | Method for manufacturing semiconductor device and polishing apparatus In manufacturing a semiconductor device, a part of an element is formed on the surface of a substrate, and at least a periphery of the substrate is polished using a polishing member stretched around the periphery of the substrate so that a polishing face of the poli... | 04/01/2008 |
| 7347765 | Honing installation with several work stations A honing installation for honing workpieces comprises a plurality of work stations, each work station being configured for performing at least one working step on a workpiece and at least part of the work station is set up as a honing station for performing at least... | 03/25/2008 |
| 7341501 | Gear grinding machine, method for dressing threaded grinding wheel and method for grinding work A gear grinding machine, a method for dressing a threaded grinding wheel, and a method for grinding a work are disclosed. A dressing tool is rotated in a vertical plane, with its position being fixed. The position of a threaded grinding wheel is NC-controlled, where... | 03/11/2008 |
| 7331842 | Contour follower for tool A contour follower includes a plurality of sensors spaced around a waterjet nozzle, each of the sensors being configured to measure a distance between a working surface and a first plane, perpendicular to a longitudinal axis of the nozzle. The sensors may include ha... | 02/19/2008 |
| 7320265 | Article transfer system A system for controlling an axial movement of an article is presented. The system comprises a support stage assembly and a spring suspension arrangement mounted on the support stage assembly. The spring suspension arrangement comprises first and second assemblies ar... | 01/22/2008 |
| 7318767 | Device and method for machine control A data set (D) is provided for machine control of a grinding machine to determine time-efficient, collision-free travel paths. The data set has a collision parameter of “0” or “1” in each separate coordination point (X, Y, Z, A) as well as for each combinati... | 01/15/2008 |
| 7306849 | Method and device to clean probes A probe cleaning system automatically detects a surface of a probe cleaning device during a cleaning process by providing a predetermined finish on the surface of the probe cleaning device. The predetermined finish can include a textured or machined finish or a mark... | 12/11/2007 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7300333 | Control system and method for processing jewelry and the like A control system for controlling processing of workpieces such as jewelry has gantry and gimbal units having x, y, z translational and x, y, z rotational degrees of freedom, the units carrying a gripper for holding a piece of jewelry. Drive motors are associated wit... | 11/27/2007 |
| 7278902 | Enabling location specific burnishing of a disk Various embodiments of the present invention pertain to enabling location specific burnishing of a disk. According to one embodiment, the smoothness of a disk is evaluated by gliding over a disk to determine if there is an asperity on the disk. If there is an asperi... | 10/09/2007 |
| 7278901 | Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film A method and apparatus for measuring an abrasion amount and a friction force of a polishing pad using a thickness change of a slurry film in a chemical mechanical polishing operation are provided. In a preferred method, for example, a first displacement of a semicon... | 10/09/2007 |
| 7278909 | Method for manufacturing semiconductor device and polishing apparatus In manufacturing a semiconductor device, a part of an element is formed on the surface of a substrate, and at least a periphery of the substrate is polished using a polishing member stretched around the periphery of the substrate so that a polishing face of the poli... | 10/09/2007 |
| 7275979 | Apparatus for treating edges of panels and method An apparatus for treating edge surfaces of panels, comprises conveyor tables to displace panels in sequence, two of the conveyor tables being configured such that panels are sequentially displaced in longitudinal alignment between the two conveyor tables with a long... | 10/02/2007 |
| 7274464 | Position measuring device A position measuring device for detecting the spatial position of a movable element in relation to a base body, the device including a linear measuring device that measures a distance between a movable element and a base body and an angle-measuring apparatus that me... | 09/25/2007 |
| 7273406 | Glass treatment system and method A system for abrading and scoring glass. An abrading/scoring station includes a table for supporting a large sheet of glass on a generally flat support. A first tool support moves an abrading tool for abrading a coating material from the glass. A second tool support... | 09/25/2007 |
| 7270593 | Light beam targeting and positioning system for a paint or coating removal blasting system A blasting system for the removal of coatings or paint from an underlying surface uses an optical device to position the blasting nozzle an appropriate stand-off distance from the surface. The blasting media can use a variety of blasting media including abrasives, w... | 09/18/2007 |
