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| Number | Title | Issue Date |
| 7503831 | System and method for cutting soluble scintillator material A system and method for cutting soluble scintillator material are disclosed. The system includes a scintillator cutting apparatus including a filament rotated around a plurality of pulleys in at least one direction and in operative proximity to the material thereby ... | 03/17/2009 |
| 7500902 | Thickness-measuring method during grinding process In a thickness-measuring method during a grinding process, which suppresses wear of a probe coming into contact with a chuck table subjected to self-grind and accurately grinds a workpiece, measurement of wafer thickness is performed only at the commencement and ter... | 03/10/2009 |
| 7485026 | Sander A sander can include a housing, an indicator coupled to the housing, and a motor assembly in the housing. The motor assembly can include an output member. A platen can be driven by the output member. A DC generator can be driven by the output member. The DC generato... | 02/03/2009 |
| 7476144 | Sander A sander can include housing, and a motor assembly in the housing. The motor assembly can include an output member. A platen can be driven by the output member. A user feedback assembly can be coupled to the housing and have a sensor assembly, a controller and an in... | 01/13/2009 |
| 7473161 | Lapping machine and head device manufacturing method A lapping machine that polishes a head block in which plural head devices are connected in a row includes a jig that has a bottom surface that opposes to a grinding plane, and fixes the head block onto the bottom surface, a pressure mechanism that applies a pressure... | 01/06/2009 |
| 7458879 | Dressing apparatus and substrate holding apparatus A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against the polishing surface. The substrate holding apparatus... | 12/02/2008 |
| 7448941 | Apparatus and method to test abrasion resistance of material using airborne particulate An apparatus and method to test the abrasion resistance of materials. In one embodiment, the apparatus comprises a conduit network, a primary air stream generating device to generate a primary air stream in the conduit network, a secondary air stream generating devi... | 11/11/2008 |
| 7442112 | Nozzle for spraying sublimable solid particles entrained in gas for cleaning surface A nozzle for spraying sublimable solid particles and preventing frost from forming at surfaces of the nozzle. The nozzle includes: a cleaning agent block for phase-changing a cleaning agent into a snow containing sublimable solid particles; a nozzle block for growin... | 10/28/2008 |
| 7438626 | Apparatus and method for removing material from microfeature workpieces Machines and systems for removing materials from microfeature workpieces using fixed-abrasive mediums. One embodiment of a method for removing material from a microfeature workpiece comprises rubbing the workpiece against a surface of a fixed-abrasive medium having ... | 10/21/2008 |
| 7438627 | Polishing state monitoring method A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a lig... | 10/21/2008 |
| 7431633 | Plating removing apparatus for three-piece wheel To provide a plating removing apparatus for 3-piece wheels, which can easily and neatly remove plating at the welding planned portion of the superimposed part of the inner rim and the outer rim. A plating removing apparatus that removes plating of a welding planned ... | 10/07/2008 |
| 7429207 | System for endpoint detection with polishing pad A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing s... | 09/30/2008 |
| 7428064 | Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through th... | 09/23/2008 |
| 7427227 | Method and apparatus for fluid polishing In a fluid polishing method for processing a fine aperture by slurry 7, the slurry is supplied from a cylinder 2a in a slurry flow rate target process until the flow rate increases to a target value of a slurry feed flow rate. When the flow rate... | 09/23/2008 |
| 7425172 | Customized polish pads for chemical mechanical planarization A polishing pad for chemical mechanical planarization of a film on a substrate is customized by obtaining one or more characteristics of a structure on a substrate. For example, when the structure is a chip formed on a semiconductor wafer, the one or more characteri... | 09/16/2008 |
| 7419418 | CNC abrasive fluid-jet milling A method and apparatus for milling a desired pocket in a solid workpiece uses an abrasive fluid-jet by moving and suitably orienting the abrasive fluid-jet relative to the workpiece. The method includes defining a path of the abrasive fluid-jet necessary to mill a d... | 09/02/2008 |
| 7416473 | Numeric-control work-centre for machining plates of glass, stone, marble or the like, with two or more machining heads A numeric-control work-centre for machining plates of glass, marble and natural or synthetic stones comprises: a bench, defining a work surface, designed to receive the plates to be machined; two fixed side members, set at the two sides of the work surface; an overh... | 08/26/2008 |
| 7416472 | Systems for planarizing workpieces, e.g., microelectronic workpieces This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is planarized in first and second planarizing processes and a total change ... | 08/26/2008 |
| 7413500 | Methods for planarizing workpieces, e.g., microelectronic workpieces This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is planarized in first and second planarizing processes and a total change ... | 08/19/2008 |
| 7413497 | Chemical mechanical polishing slurry pump monitoring system and method According to one embodiment of the invention, a chemical mechanical polishing monitoring system includes a pump delivering a slurry to a polishing pad and a rotation sensing device coupled to the pump. The rotation sensing device senses a rotation of the pump and ge... | 08/19/2008 |
| 7413499 | Grinding process and apparatus with arrangement for grinding with constant grinding load A process of grinding a surface of a workpiece, by a grinding tool rotated about its axis. The process includes a grinding step of grinding the workpiece surface, by pressing at least one of the grinding tool and the workpiece against the other of the grinding tool ... | 08/19/2008 |
| 7407433 | Pad characterization tool Tools and methods for in-situ characterizing of a surface of a polishing pad are described. A characterization tool is integrated with polishing tool so that the polishing pad can be monitored in-situ. The characterization tool and the polishing pad can be rotated o... | 08/05/2008 |
| 7393261 | Cylindrical grinding method for producing hard metal tools and cylindrical grinding machine for grinding cylindrical starting bodies during the production of hard metal tools The invention relates to a grinding method and to a cylindrical grinding machine, in which a sintered hard metal round rod is completely pushed through a chuck of a workpiece spindle head, said chuck having chuck jaws. Two backrest seats are ground on the freely pro... | 07/01/2008 |
| 7393262 | Apparatus including pin adapter for air bearing surface (ABS) lapping A system is provided for measuring a head during a lapping process. First provided is a wafer including at least one head each having an electrical lapping guide (ELG), a plurality of wafer contacts in electrical communication with the ELG, and a closure formed ther... | 07/01/2008 |
| 7384327 | Method for grinding a bar of thin film magnetic elements utilizing a plurality of resistive films A method is presented for grinding a surface of an elongate bar having a plurality of thin film magnetic elements aligned in a line, each of the thin film magnetic elements having a magnetoresistive sensor for reading a magnetic record from a recording medium and an... | 06/10/2008 |
| 7377836 | Versatile wafer refining Methods of refining using a plurality of refining elements are discussed. A refining apparatus having refining elements that can be smaller than the workpiece being refined are disclosed. New refining methods, refining apparatus, and refining elements disclosed. Met... | 05/27/2008 |
| 7367867 | Two-side working machine A two-side working machine, comprising an upper and a lower working disc which hold on, and are fixed to, an upper and a lower carrier disc, and which are disposed coaxially with each other and are adapted to be rotationally driven relative to each other by a workin... | 05/06/2008 |
| 7369971 | Method and apparatus for generating three-dimensional shape data The present invention provides a method and an apparatus for generating post-machining three-dimensional shape data for a workpiece on the basis of an NC program. The three-dimensional shape data generating apparatus comprises: a stock blank lattice point generating... | 05/06/2008 |
| 7370306 | Method and apparatus for designing a pattern on a semiconductor surface A method of forming a pattern of elements is shown. In one embodiment, the method is used to create a reticle. In another embodiment, the method is used to further form a number of elements on a surface of a semiconductor wafer. Identified problem structures or regi... | 05/06/2008 |
| 7367866 | Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the pivotable load/unload cups a... | 05/06/2008 |
| 7366575 | Wafer polishing control Methods of controlling polishing of wafers are disclosed. In one aspect, a method may include measuring one or more pre-polish thicknesses of one or more layers of a wafer. The one or more layers may then be polished. Then a post-polish thickness of a layer of the w... | 04/29/2008 |
| 7361600 | Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus According to the present invention, a chemical and mechanical polishing apparatus (100) for a sample such as a wafer includes a built-in inspection apparatus (25) incorporated therein. The polishing apparatus (100) further comprises a load unit ... | 04/22/2008 |
| 7357696 | Method and apparatus for reconditioning digital discs An automated method for reconditioning a plurality of digital discs within a reconditioning apparatus is disclosed. The method comprises holding the digital discs in a load area, and then transferring each of the digital discs from the load area to at least one work... | 04/15/2008 |
| 7354332 | Technique for process-qualifying a semiconductor manufacturing tool using metrology data A technique of the present invention utilizes qualification characteristics from a single wafer for qualifying a semiconductor manufacturing tool. Generally speaking, the technique commences with the processing of a wafer by the manufacturing tool. During processing... | 04/08/2008 |
| 7354333 | Detection of diamond contamination in polishing pad Methods for reconditioning a polishing pad and detecting diamond contamination of the polishing pad, are disclosed. In particular, the methods include the step of exposing the reconditioned polishing pad to an energy source to induce the diamond contamination to flu... | 04/08/2008 |
| 7351129 | Ballbar equipment A ballbar is used to assess the accuracy of relative motion between an arbor and a table 4—of a machine tool. Mounting components are secured respectively to the arbor and the table-4. Each mounting component comprises a block that has provision on t... | 04/01/2008 |
| 7351504 | Photomask blank substrate, photomask blank and photomask In a quadrangular photomask blank substrate with a length on each side of at least 6 inches, which has a pair of strip-like regions that extend from 2 to 10 mm inside each of a pair of opposing sides along an outer periphery of a substrate top surface, with a 2 mm e... | 04/01/2008 |
| 7347770 | Two-sided surface grinding apparatus A two-sided surface grinding apparatus capable of eliminating undulations of concentric circles produced in the work surfaces by grinding, thereby further improving the degree of flatness of the work surfaces after grinding includes a pair of support pads which hold... | 03/25/2008 |
| 7344432 | Conductive pad with ion exchange membrane for electrochemical mechanical polishing An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing sur... | 03/18/2008 |
| 7337672 | Method for inspecting grinding wheels This invention discloses a method of evaluating the internal structure of a grinding wheel through ultrasonic inspection. ... | 03/04/2008 |
