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| Number | Title | Issue Date |
| 6957997 | Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner In a system and a method according to the present invention, a sensor signal, such as a motor current signal, from a drive assembly of a pad conditioning system is used to control a CMP system to compensate for a change in the conditions of consumables, thereby enha... | 10/25/2005 |
| 6955589 | Delivery system for magnetorheological fluid A magnetorheological fluid delivery system includes a mixing and tempering vessel. Fluid is admitted to the vessel via a plurality of tangential ports, creating a mixing of the fluid in the vessel and promoting homogeneity. Fluid may be reconstituted in the vessel b... | 10/18/2005 |
| 6955588 | Method of and platen for controlling removal rate characteristics in chemical mechanical planarization Methods and a platen control parameters of a removal rate characteristic in chemical mechanical planarization, while allowing a low-cost polishing pad to be used especially in fast edge operations, and while reducing the amount of fluid used to support the polishing... | 10/18/2005 |
| 6955583 | Apparatus for the diameter checking of eccentric portions of a mechanical piece in the course of the machining in a grinding machine An apparatus (10) for checking the diameter of an eccentric pin (8′) of a small-size shaft (8), for example a shaft for compressors, includes a support (16), a first arm (19) rotating with respect to the support (16), a se... | 10/18/2005 |
| 6953383 | Method of determining current position data of a machining tool and apparatus therefor Current position data is determined of a first machining tool in a machining space having a second machining tool, the second tool having known position data with regard to the position data of the first tool which are to be determined, the first tool and the second... | 10/11/2005 |
| 6953750 | Methods and systems for controlling belt surface temperature and slurry temperature in linear chemical mechanical planarization A linear chemical mechanical planarization (CMP) system includes a belt pad, a slurry bar having a plurality of nozzles, and a heating module for heating slurry. The heating module has a plurality of heating elements, each of which is coupled in flow communication w... | 10/11/2005 |
| 6953387 | Method and apparatus for measuring flow rate through and polishing a workpiece orifice A method and apparatus for comparing the flow rate through an orifice within a master part with the orifice within a workpiece by subjecting each orifice to an identical fluid at an identical temperature, under an identical pressure, and comparing the downstream pre... | 10/11/2005 |
| 6951502 | METHOD OF DETERMINING A FLATNESS OF AN ELECTRONIC DEVICE SUBSTRATE, METHOD OF PRODUCING THE SUBSTRATE, METHOD OF PRODUCING A MASK BLANK, METHOD OF PRODUCING A TRANSFER MASK, POLISHING METHOD, ELECTRONIC DEVICE SUBSTRATE, MASK BLANK, TRANSFER MASK, AND POLISHING APPARATUS A flatness of a substrate is determined to achieve a desired flatness of a mask blank by predicting the variation in flatness resulting from a film stress of a thin film formed on the substrate. The flatness is adjusted by measuring the flatness of the substrate as ... | 10/04/2005 |
| 6951503 | System and method for in-situ measuring and monitoring CMP polishing pad thickness A system for measuring and scanning a CMP polishing pad thickness is described. The system includes a first sensor arm capable of being moved in a direction substantially parallel with and at a substantially constant distance from a top surface of the CMP polishing ... | 10/04/2005 |
| 6950719 | Horizontally structured manufacturing process modeling: across file feature operability A method of manipulating manufacturing features in horizontally structured manufacturing process models for large parts, comprising: selecting a manufacturing feature from a plurality of manufacturing features; wherein the horizontally structured manufacturing proce... | 09/27/2005 |
| 6950783 | Method and related system for semiconductor equipment prevention maintenance management A method and related system for semiconductor equipment prevention maintenance management. The method includes recording process parameters of each piece of equipment, recording equipment parameters when each piece of equipment is processing, evaluating and recordin... | 09/27/2005 |
| 6949006 | Belt-disc sander having speed adjuster A speed adjuster is provided in a belt-disc sander for controlling the rotating speed of a motor of the belt-disc sander. A speed adjust knob is disposed outside the belt-disc sander. The speed adjuster has a control circuit, a current sensor, a drive circuit, and a... | 09/27/2005 |
| 6950289 | Embedded lapping guide for a magnetic head cluster A magnetic head cluster is provided along with a method of making a magnetic head cluster. The magnetic head cluster comprises a substrate having a plurality of magnetoresistive (MR) read and inductive magnetic write transducers and a plurality of terminals formed t... | 09/27/2005 |
| 6949007 | System and method for multi-stage process control in film removal A fabricating system. A processing tool executes a film removal process on a wafer using a chemical mechanism. A metrology tool monitors surface characteristics of the wafer to obtain a measured film thickness thereof before and after a first removal process, wherei... | 09/27/2005 |
| 6945861 | Polishing head of chemical mechanical polishing apparatus and polishing method using the same A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a ch... | 09/20/2005 |
| 6945848 | Lens shape data processing apparatus and lens grinding machine having the same apparatus A lens shape data processing apparatus and a lens grinding machine having the same apparatus in which the lens shape data reading out and the layout setting work for another spectacle lens can be conducted during the lens edge measurement or the grinding process is ... | 09/20/2005 |
| 6946052 | Separating apparatus and processing method for plate member This invention is to guarantee that in separating a plate member such as a bonded substrate stack, a fluid is injected to an appropriate portion of the plate member. While a bonded substrate stack (50) is rotated, the vertical position of its peripheral porti... | 09/20/2005 |
| 6945844 | Methods for dynamically controlling a semiconductor dicing saw A saw cutting pattern is dynamically established for a semiconductor dicing saw based on detection of the saw blade contacting a wafer or a portion of a wafer. The dynamic cutting pattern may terminate cuts if the saw blade no longer contacts the wafer or a portion ... | 09/20/2005 |
| 6942545 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wa... | 09/13/2005 |
| 6942546 | Endpoint detection for non-transparent polishing member A sensing apparatus for detecting a processing endpoint of a multi-layer semiconductor wafer includes a light source to emit light against a surface of the semiconductor wafer, a color sensor to sense a reflection color from the surface of the semiconductor wafer in... | 09/13/2005 |
| 6939209 | Method and apparatus for global die thinning and polishing of flip-chip packaged integrated circuits A reliable, inexpensive “back side” thinning process and apparatus therefor, capable of globally thinning an integrated circuit die to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the packa... | 09/06/2005 |
| 6939212 | Porous material air bearing platen for chemical mechanical planarization A platen for use in chemical mechanical planarization (CMP) systems includes a platen plate that has at least one recess defined therein. The at least one recess has an input port formed therein. A porous material is disposed in the at least one recess. The porous m... | 09/06/2005 |
| 6939207 | Method and apparatus for controlling CMP pad surface finish A method and apparatus for pre-conditioning a polishing pad for use in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a pre-conditioning member having a smooth surface. The method includes providing a pre-conditioning ... | 09/06/2005 |
| 6939796 | System, method and apparatus for improved global dual-damascene planarization A system and method for planarizing a patterned semiconductor substrate includes receiving a patterned semiconductor substrate. The patterned semiconductor substrate having a conductive interconnect material filling multiple of features in the pattern. The conductiv... | 09/06/2005 |
| 6939201 | Grinding tool, and method and apparatus for inspection conditions of grinding surface of the same The grindstone is configured so that at least the surface of each abrasive grain is colored differently from the surface of a base. ... | 09/06/2005 |
| 6939200 | Method of predicting plate lapping properties to improve slider fabrication yield A method of predicting the lapping property of a charged lapping plate uses samples with a known lap surface. The samples are lapped on the plate and a non-invasive sensor is used to determine the lapping rate under a fixed load and rotation speed. The total frictio... | 09/06/2005 |
| 6939202 | Substrate retainer wear detection method and apparatus An apparatus and method are provided for detecting wear in substrate retainers used for chemical mechanical planarization processes. A substrate retainer is provided that is adapted to enable a sensor to detect when the wear edge of the retainer has worn to a critic... | 09/06/2005 |
| 6939198 | Polishing system with in-line and in-situ metrology A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the sub... | 09/06/2005 |
| 6939199 | Method and apparatus for cutting semiconductor wafers Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to... | 09/06/2005 |
| 6935924 | Method for deciding a bevel curve, method for determining a locus of a bevel, method for processing a lens and apparatus for processing a lens When a forming a bevel on a lens, the value of the bevel curve is calculated based on the value of the curve of the concave face, a reference axis of the bevel curve is determined to be in the same direction as the curvature of the concave face, a reference position... | 08/30/2005 |
| 6935925 | System, method, and apparatus for in-situ acoustic emission monitoring of burnish heads in production during magnetic media cleaning or burnish process An in-situ technique for the acoustic emission monitoring of burnish heads while they are cleaning or burnishing magnetic media is described. The burnishing process is monitored and controlled to identify interaction or contact between the head and media due to, for... | 08/30/2005 |
| 6935922 | Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing are provided. One method includes scanning a specimen with a measurement device during polishing to gen... | 08/30/2005 |
| 6935935 | Measuring apparatus A measuring apparatus includes a heating unit for applying heat to a first point within a workpiece or on a surface of a workpiece and propagating the heat to a second point within the workpiece or on the surface of the workpiece. The measuring apparatus further inc... | 08/30/2005 |
| 6935930 | Polishing apparatus and method, and wafer evacuation program In a wafer polishing apparatus which polishes a wafer surface or in a wafer cleaner, there are provided a transfer and cleaning chamber which shuts off a wafer from the outside air and an inert gas supply device which fills an inert gas into the transfer and cleanin... | 08/30/2005 |
| 6935923 | Sensor stripe encapsulation layer in a read/write head A magnetoresistive read head has read head layers that are shaped to form an air bearing surface and a sensor stripe cavity with an open side at the air bearing surface. A sensor stripe is deposited in the sensor stripe cavity. The sensor stripe has a front surface ... | 08/30/2005 |
| 6934928 | Method and apparatus for designing a pattern on a semiconductor surface A method of forming a pattern of elements is shown. In one embodiment, the method is used to create a reticle. In another embodiment, the method is used to further form a number of elements on a surface of a semiconductor wafer. Identified problem structures or regi... | 08/23/2005 |
| 6932675 | Plated grinding wheel life maximization method A method of determining the condition of a grinding wheel is provided to avoid over use or premature changing of the grinding wheel in a grinding machine, such as for crankshaft or camshaft grinding. The grinding machine has a motor which drives a grinding spindle c... | 08/23/2005 |
| 6932679 | Apparatus and method for loading a wafer in polishing system The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt... | 08/23/2005 |
| 6931749 | Apparatus and methods for measuring the pin diameter of a crankshaft at the place of grinding An apparatus for checking diametral dimensions of crankpins and main journals in the course of grinding is provided. The apparatus includes a head with a Vee-shaped reference device and an axially movable feeler that contacts the surface of the pin to be checked, an... | 08/23/2005 |
| 6932674 | Method of determining the endpoint of a planarization process A method of determining the endpoint of a planarizing process is disclosed. An endpoint detection signal is selectively sampled from at least one predetermined location within a planarizing region defined on a planarizing web. Planarization is stopped when the endpo... | 08/23/2005 |
