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| Number | Title | Issue Date |
| 8057280 | Chemical mechanical planarization apparatus A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a car... | 11/15/2011 |
| 8038509 | Chemical mechanical polishing apparatus Disclosed herein is a chemical mechanical polishing apparatus. The apparatus comprises a carrier to hold a wafer and being capable of lifting, lowering and rotating, a polishing pad compressed onto the wafer through the lowering of the carrier to polish the wafer, a... | 10/18/2011 |
| 8029333 | Device for polishing peripheral edge of semiconductor wafer A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same... | 10/04/2011 |
| 8025554 | Method of polishing work In the method of precisely polishing a work, torque of a sun gear and an internal gear are kept constant and a load applied to a carrier is reduced and maintained. The method comprises the steps of: changing a rotational speed of at least one of the sun gear, the in... | 09/27/2011 |
| 8025555 | System for measuring and controlling the level of vacuum applied to a conditioning holder within a CMP system A method and apparatus for conditioning polishing pads that utilizes an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilizes a vacuum capa... | 09/27/2011 |
| 8021210 | Polishing head and polishing apparatus having the same The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber fil... | 09/20/2011 |
| 7972196 | Methods of crystallographically reorienting single crystal bodies A method of changing the crystallographic orientation of a single crystal body is disclosed that includes the steps of characterizing a crystallographic orientation of the single crystal body and calculating a misorientation angle between a select crystallographic d... | 07/05/2011 |
| 7972195 | Tire grinding method and grinding device In a grinding device, first, an eddy-current-sensor detects a distance from the eddy-current-sensor to an outer peripheral surface of a belt layer while a tire to be retreaded held by a pair of half rims is caused to rotate. Thus, an eccentricity amount and an eccen... | 07/05/2011 |
| 7963823 | Machining machine with means for acquiring machining parameters A machining machine with an upper rotatingly drivable machining disc, the annular machining plane of which has a machining coating and is facing a lower machining plane, wherein the machining planes form a machining gap between each other. Plural rotor discs are arr... | 06/21/2011 |
| 7950982 | Method for achieving stripe height control at bow compensated lapping A lapping device comprises a mounting surface for coupling at least one non-parted slider row. At least one lever arm is coupled to at least one distal end of the mounting surface. The lever arm comprises a coupling feature at an end of the lever arm for receiving a... | 05/31/2011 |
| 7946906 | Tile saw with laser guide A tile cutting machine includes a tub for receiving water and a tile to be cut therein. A cutting head assembly having a motor driven blade is positioned above a tile supporting surface located in the tub and is movable with respect thereto. A laser projects a line ... | 05/24/2011 |
| 7922562 | Systems and methods for reducing electrostatic charge of semiconductor wafers A chemical-mechanical polishing machine and associated methods are disclosed. One embodiment of the machine includes a polishing pad, a wafer carrier corresponding to the polishing pad and configured to carry a semiconductor wafer, and a transfer station proximate t... | 04/12/2011 |
| 7909676 | Independent measuring apparatus for grinding machines Measuring apparatus (50) of geometrical parameters of cylinders, rolls and similar elements (11), used for the rolling of flat products operating on a machine for the grinding of said cylinders with an autonomous movement, i.e. with a movement independ... | 03/22/2011 |
| 7887392 | Platen assembly and work piece carrier head employing flexible circuit sensor A platen assembly is provided for supporting a polish pad of the type utilized to planarize a wafer. The platen assembly comprises a sensor system and a polish platen having a first surface for supporting the polish pad. The sensor system comprises a flexible sensor... | 02/15/2011 |
| 7846009 | Method and a device for automatically preparing an ophthalmic lens for mounting The method includes: automatic measurement of the marking characteristics of the lens in a measurement position in order to produce a marking reference of the ophthalmic lens; transfer of the lens in a second transfer movement from the measurement position to an int... | 12/07/2010 |
| 7824245 | Automated chemical polishing system adapted for soft semiconductor materials At least one wafer is suspended on a respective jig shaft above a polishing platen. The degree of parallelism between the wafer and the polishing platen is controlled using a three-point suspension, which allows for planar pitch adjustments using vertical actuation ... | 11/02/2010 |
| 7789730 | Method of manufacturing treatment device and treatment device A tapered cutting edge portion and a continuous raised portion from the tapered cutting edge portion are ground in an edge portion of a straight grinding raw material so that an eccentricity is not generated. In a method for grinding a treatment device, one end port... | 09/07/2010 |
| 7785172 | Combinatorial processing including rotation and movement within a region Combinatorial processing including rotation and movement within a region is described, including defining multiple regions of at least one substrate, processing the multiple regions of the at least one substrate in a combinatorial manner, rotating a head in one of t... | 08/31/2010 |
| 7775853 | Configurable polishing apparatus A polishing apparatus for polishing semiconductor wafers comprises a main polishing structure, which includes a plurality of polishing tables, a plurality of polishing heads and a plurality of load-and-unload stations, and an add-on polishing structure, which includ... | 08/17/2010 |
| 7775854 | Water jet machining with abrasive recovery and filtration A continuous flow recirculating jet machining system incorporates a dynamic particle separator downstream of the fluid collection reservoir, for directing the water or other liquid in a serpentine path to promote separation of larger-diameter particulates. A filter ... | 08/17/2010 |
| 7762869 | Nozzle for spraying sublimable solid particles entrained in gas for cleaning surface A nozzle for spraying sublimable solid particles and preventing frost from forming at surfaces of the nozzle. The nozzle includes: a cleaning agent block for phase-changing a cleaning agent into a snow containing sublimable solid particles; a nozzle block for growin... | 07/27/2010 |
| 7713106 | Device grinding method A device grinding method comprising the steps of holding the undersurface of a protective member which supports a plurality of devices by affixing their front surfaces onto the top surface of the protective member, on the chuck table of a grinding machine and grindi... | 05/11/2010 |
| 7704123 | Handle assembly for a concrete saw An adjustable handle assembly for a road surface cutting saw is provided that includes a back plate attached to the saw housing, an outer gear attached to the back plate, a bracket assembly including an inner gear, a tubular member slidably attached to the bracket a... | 04/27/2010 |
| 7690967 | Mounting structure for measuring device and grinding machine with the structure In a grinding machine, a bed 10 has secured thereon a work head 11 which rotatably supports a work spindle 12 for supporting a workpiece W and mounts thereon a slide base 15 reciprocatively movable in a Z-direction parallel to the axis of... | 04/06/2010 |
| 7677954 | O.D. centerless grinding machine In one aspect of the present invention, an outer diameter (O.D.) centerless grinding machine for use in grinding a diamond workpiece has a grinding wheel positioned parallel to a regulating wheel which is adapted to press a cylindrical workpiece into the grinding wh... | 03/16/2010 |
| 7645182 | Apparatus and method for lapping slider using floating lapping head An apparatus for lapping a slider comprises a lapping head for supporting elements while pressing the elements against a rotating lapping plate, the elements that are to be formed into sliders, a holding mechanism for supporting the lapping head, the holding mechani... | 01/12/2010 |
| 7628676 | Machine tool for machining workpieces The invention relates to a machine tool for machining workpieces, comprising a workpiece holder. Said workpiece holder comprises a support, a workpiece spindle head mounted on a first side of the support, and a tailstock. Said tailstock is mounted on a second side o... | 12/08/2009 |
| 7607968 | Apparatus on a flat card or roller card for grinding a fibre processing clothing disposed on a rotating cylinder or a card flat In an apparatus on a carding machine for grinding a fiber processing clothing on a roller or a card flat, grinding equipment includes at least one grinding element and an infeed device serving to position the grinding element against the clothing. To permit reliable... | 10/27/2009 |
| 7591709 | Blasting device The present invention provides a blasting device, comprising: a container in which a blast medium is stored; a suction pipe which is inserted in the container to be rotatably supported, and is formed substantially in an L-shape with a lower suction port bent at a ri... | 09/22/2009 |
| 7572169 | Advanced finishing control A factory, an apparatus, and methods of using an in situ finishing information for finishing workpieces and semiconductor wafers are described. Changes or improvements to cost of manufacture of a workpiece using in-process cost of manufacture information, tracked in... | 08/11/2009 |
| 7563153 | Method of preparing eyeglass lenses for mounting on the frame selected by the wearer The method comprises the following steps: a centering step during which the optical frame of reference of the lens is acquired and a blocking accessory is fastened thereto; and a step of shaping the lens to have a ... | 07/21/2009 |
| 7547244 | Sonic razor blade sharpener An apparatus for sharpening one or more razor blades secured within a holder is disclosed. The holder includes a head for retaining the one or more razor blades in a cutting position and a handle affixed to the head. A housing includes a razor slot adapted to receiv... | 06/16/2009 |
| 7540800 | Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer A rough-polishing method for conducting a rough polishing before mirror-finish polishing on a semiconductor wafer (W) using a polishing apparatus (1) includes a first polishing step for polishing the semiconductor wafer using slurry containing colloidal silic... | 06/02/2009 |
| 7540799 | System for adjusting an end effector relative to a workpiece A system (46) for adjusting an end effector (48) of an apparatus (44) includes a linear actuator (58) attachable with an arm (52) of the apparatus (44). The system (46) further includes a first link member (64)... | 06/02/2009 |
| 7503831 | System and method for cutting soluble scintillator material A system and method for cutting soluble scintillator material are disclosed. The system includes a scintillator cutting apparatus including a filament rotated around a plurality of pulleys in at least one direction and in operative proximity to the material thereby ... | 03/17/2009 |
| 7500902 | Thickness-measuring method during grinding process In a thickness-measuring method during a grinding process, which suppresses wear of a probe coming into contact with a chuck table subjected to self-grind and accurately grinds a workpiece, measurement of wafer thickness is performed only at the commencement and ter... | 03/10/2009 |
| 7485026 | Sander A sander can include a housing, an indicator coupled to the housing, and a motor assembly in the housing. The motor assembly can include an output member. A platen can be driven by the output member. A DC generator can be driven by the output member. The DC generato... | 02/03/2009 |
| 7476144 | Sander A sander can include housing, and a motor assembly in the housing. The motor assembly can include an output member. A platen can be driven by the output member. A user feedback assembly can be coupled to the housing and have a sensor assembly, a controller and an in... | 01/13/2009 |
| 7473161 | Lapping machine and head device manufacturing method A lapping machine that polishes a head block in which plural head devices are connected in a row includes a jig that has a bottom surface that opposes to a grinding plane, and fixes the head block onto the bottom surface, a pressure mechanism that applies a pressure... | 01/06/2009 |
| 7458879 | Dressing apparatus and substrate holding apparatus A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against the polishing surface. The substrate holding apparatus... | 12/02/2008 |
