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...that Robert Adler has the dubious distinction of being the Father of the Couch Potato? Back in 1955 Adler was employed by what was then Zenith Radio Corp., where he was charged to invent something that would allow viewers to turn down the TV volume without leaving their chairs. After a series of flops (such as a wired contraption that people tripped over), Adler hit on the idea of using sound waves. Thus the Remote Control was born...

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Class 451/72 - Having means to refurbish abrading tool


Subclass of Class 451 - Abrading
Definition: Abrading machine provided with means which dresses or trues
No. of patents: 365
Last issue date: 05/22/2012


1                    
NumberTitleIssue Date
8182315Chemical mechanical polishing pad and dresser
The present invention discloses a Chemical Mechanical Polishing (CMP) pad dresser used in lapping and polishing silicon wafers in either single or double sided polishing machines. ...
05/22/2012
7632172Hard finishing machine
The invention relates to a hard finishing machine (1). The machine has one tool (4) which is arranged on a tool spindle (3) and a rotary table (5) with an axis of rotation (6) which is aligned vertically, and a workpiece spindle (
12/15/2009
7578727Conditioner device for conditioning polishing pad and chemical mechanical polishing apparatus including the same
The present invention relates to a conditioner device for polishing pad and a chemical mechanical polishing (CMP) apparatus having the same. The conditioner device of the present invention comprises a rotable support plate including a support plate surface comprisin...
08/25/2009
7575503Vacuum-assisted pad conditioning system
A method and apparatus for conditioning polishing pads that utilize an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilize a vacuum capabi...
08/18/2009
7367872Conditioner disk for use in chemical mechanical polishing
A conditioner disk for use on a polish pad in chemical mechanical polishing process includes a base structure a plurality of curved blades supported by the base structure. The blades radiate outwardly from a center region of the base structure and curve in a common ...
05/06/2008
7361533Stacked embedded leadframe
A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec...
04/22/2008
7341502Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular...
03/11/2008
7331845Double end face truing device, double end face truing tool, and double end face truing method
First and second end surface truing sections are formed by protruding cylindrical first and second base bodies from opposite end surfaces of a disc-like base of an opposite end surface truing tool in the axial direction thereof and by providing on the external surfa...
02/19/2008
7303662Contacts for electrochemical processing
Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem...
12/04/2007
7300338CMP diamond conditioning disk
A method of making and the resulting non-metallic CMP conditioning pad comprising a non-metallic substrate and a single layer of abrasive particles bonded to the substrate by a non-metallic bonding medium. Preferred substrates include aluminum oxide and graphite. A ...
11/27/2007
7288165Pad conditioning head for CMP process
In a first aspect, a first apparatus is provided for a chemical mechanical polishing (CMP) process. The first apparatus includes (1) a rotatable member; (2) an end effector adapted to receive and retain a conditioning disk; and (3) an elastic device disposed between...
10/30/2007
7276180Chemical mechanical polishing composition and process
A composition for chemical mechanical polishing includes a slurry. A sufficient amount of a selectively oxidizing and reducing compound is provided in the composition to produce a differential removal of a metal and a dielectric material. A pH adjusting compound adj...
10/02/2007
7258600Vacuum-assisted pad conditioning system
A method and apparatus for conditioning polishing pads that utilize an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilize a vacuum capabi...
08/21/2007
7247083Polishing apparatus
The polishing apparatus is capable of precisely controlling polishing pressure, correctly positioning a press plate and uniformly polishing a workpiece. In the polishing apparatus, a holding head comprises: first pressing means for introducing a pressurized fluid in...
07/24/2007
7220161Automatic sharpening system for ice-skates
A method is for using a skate-grinding device. The method provides an automatic sharpening system (10) that has grip members (14, 16) and a grinding wheel (28). A blade (18) of a skate (20) is inserted into a groove (19). Th...
05/22/2007
7217172Enhanced end effector arm arrangement for CMP pad conditioning
A CMP conditioning apparatus enhanced end effector arm for improving the reliability of the apparatus and the quality of the conditioning and polishing operations includes a conditioner head with features that provide for simplified alignment/attachment of a conditi...
05/15/2007
7210981Smart conditioner rinse station
A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioni...
05/01/2007
7204243Truing tool for truing a grinding worm
A truing tool for truing an essentially cylindrical grinding worm that is arranged on the tool spindle of a machine suitable for the continuous generation grinding in the tangential- and diagonal process. The truing tool comprises an essentially cylindrical gear whe...
04/17/2007
7204679Flow control system
A flow control system includes a substantially rigid vessel with a process fluid reservoir situated in the rigid vessel is in fluid communication with an outlet. A movable member and/or a working fluid is situated in the rigid vessel so as to selectively expel proce...
04/17/2007
7198043Method for extending diamond tool life in diamond machining of materials that chemically react with diamond
The present invention provides a method for extending diamond tool life in diamond machining of materials that chemically react with the diamond tool in which the surface electric potential of the workpiece is adjusted or tuned to be adequate to inhibit the chemical...
04/03/2007
7195543Machine tool with 5 machining axes with a continuous grinding tool profilling system
A machine tool for machining a part by on-head and continuous grinding tool profiling includes a part holder support driven into rotation by first driving means around a first axis in a vertical plane, a machining system provided with a grinding tool for machining t...
03/27/2007
7192807Wafer level package and fabrication method
A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through t...
03/20/2007
7192336Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a selected energy without exposing a second portion of the material to...
03/20/2007
7189149Method of truing chamfering grindstone and chamfering device
A truing method for a chamfering grindstone for performing chamfering work on a peripheral edge of a plate-shaped object, comprising the steps of: performing chamfering work on a truing grindstone with a master grindstone having a desired groove shape and forming a ...
03/13/2007
7182680Apparatus for conditioning processing pads
Embodiments of a flexible pad conditioner for conditioning a processing pad are provided. The pad conditioner includes an arc-shaped member having an abrasive bottom surface configured for conditioning the processing pad. Means are provided to apply a downward force...
02/27/2007
7175512Cutting chain grinder and method of grinding
A cutting chain bench grinder includes a self-centering vise that centers the cutting chain on an axis of rotation of the vise base. By centering the cutting chain to intersect the vise base axis of rotation, consistent top plate lengths and hook angles can be groun...
02/13/2007
7175510Method and apparatus for conditioning a polishing pad
A method and apparatus for polishing a thin film on a semiconductor substrate is described. A polishing pad is rotated and a wafer to be polished is placed on the rotating polishing pad. The polishing pad has grooves that channels slurry between the wafer and polish...
02/13/2007
7169012Hydrodynamic radial flux polishing and grinding tool for optical and semiconductor surfaces
A polishing tool useful for grinding and high precision, fine polishing of flat or curved optical surfaces, as well as for the optical flattening of semiconductor and metallic surfaces. The tool does not make contact with the surface to be polished and lacks moving ...
01/30/2007
7163438Zone polishing using variable slurry solid content
A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end ...
01/16/2007
7163447Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
Conditioning devices, systems and methods for conditioning a contact surface of a processing pad used in processing microelectronic workpieces. One embodiment of a conditioning device comprises an end-effector having a conditioning surface configured to engage the c...
01/16/2007
7144304Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the mi...
12/05/2006
7125477Contacts for electrochemical processing
Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem...
10/24/2006
7125316Method and device for producing molds for toothed belts
The invention relates to a method and to a device for producing molds for toothed belts. A grinding wheel (9) that has a profiled periphery is used instead of a milling cutter to provide the circumference of a roller-shaped blank (4) with the matrix of...
10/24/2006
7125312Rotor-grinding machine comprising a rotary head with two grinding wheels
The invention relates to a machine (1) for grinding the blades of a turbine rotor (2) or a compressor. The inventive machine consists of a rotary head (6) which is provided with two different grinding wheels (7, 7′) for grinding the rot...
10/24/2006
7121928High smoothness grinding process and apparatus for metal material
A high smoothness grinding process for obtaining a highly smooth surface of a metal material member. The process includes grinding an outer peripheral surface of a cylindrical or generally cylindrical metal material member by using a super abrasive grain grinding wh...
10/17/2006
7118448Truing method for grinding wheel, its truing device and grinding machine
A method and apparatus are used for truing grindstones. Grinding wheels are arranged in a manner such that the respective grindstone surfaces are disposed apart from each other to define a space therebeween and respective ones of the grindstone surfaces are position...
10/10/2006
7112270Algorithm for real-time process control of electro-polishing
Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In one embodiment, an endpoint is...
09/26/2006
7108581Polishing apparatus
A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against the polishing surface. The substrate holding apparatus...
09/19/2006
7105446Apparatus for pre-conditioning CMP polishing pad
An apparatus and method suitable for the pre-conditioning of a polishing pad on a CMP apparatus prior to the polishing of production wafers on the apparatus. The apparatus includes a pre-conditioning arm on which is mounted an ingot of suitable material. In use, the...
09/12/2006
7101269Cylindrical grinding machine
Disclosed is a cylindrical grinding machine of the type that a workpiece support device composed of a work head and a foot stock is mounted on a forward upper portion of a bed while a wheel head unit composed of a slide base and a wheel head is mounted on a rear upp...
09/05/2006
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