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| Number | Title | Issue Date |
| 8182311 | Device for abrasive machining A device for abrasive machining, comprising a substantially cup shaped to rough rotatable around an axis and having an inner chamber and a disk-shaped to working element at its one axial end; and immovable holder attachable to a machine to and surrounding at least a... | 05/22/2012 |
| 8172641 | CMP by controlling polish temperature A method for manufacturing integrated circuits on a wafer includes providing a facility-supplied room temperature solution; controlling the temperature of the facility-supplied room temperature solution to a desired temperature set point to generate a rinse solution... | 05/08/2012 |
| 8167681 | Slicing method The present invention provides a slicing method comprising winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel... | 05/01/2012 |
| 8157615 | Device and process for applying and/or detaching a wafer to/from a carrier The invention relates to a device for applying and/or detaching a wafer to/from a carrier with a deformable membrane which can be aligned parallel to the contact surface of the wafer, with one contact side for at least partial cont... | 04/17/2012 |
| 8123592 | Heatless slurry system A heatless slurry system for use with a glass removal apparatus for restoring a glass surface. The system comprises a slurry container and a pump mounted externally relative to the container to prevent heating of the slurry as the system is operated. Vacuum pressure... | 02/28/2012 |
| 8118642 | Method and machine tool for machining an optical object A method for machining a face (1) of an optical object (6), includes providing a machine tool which itself includes a bed (1) for locating an object to be machined. The bed (1) has a receiving surface (3) that is angularly adjustab... | 02/21/2012 |
| 8113913 | Method for the simultaneous grinding of a plurality of semiconductor wafers Simultaneous double-side grinding of a plurality of semiconductor wafers involves positioning each wafer freely in a cutout of one of plural carriers which rotate on a cycloidal trajectory, wherein the wafers are machined between two rotating ring-shaped working dis... | 02/14/2012 |
| 8092275 | Abrasive air blast system with air cooler for blast nozzle and air dryer for storage tank An abrasive blaster system includes a storage tank for storing dry granular abrasive media, a source of pressurized air and a metering valve for mixing the granular abrasive media with the pressurized air for release through a blast nozzle. A cooling system is in li... | 01/10/2012 |
| 7988530 | Slicing method The present invention provides a slicing method comprising winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel... | 08/02/2011 |
| 7959491 | Method for slicing workpiece by using wire saw and wire saw The present invention is a wire saw in which a wire is wound around a plurality of grooved rollers, the workpiece is sliced into wafers by causing the wire to travel and pressing the workpiece against the wire while a slurry is supplied to the grooved rollers, the w... | 06/14/2011 |
| 7934976 | Apparatus and method for scribing substrate A scribing apparatus for scribing a substrate improves productivity as well as prevents substrate deterioration. The apparatus according to an embodiment of the present invention includes a wheel to scribe a substrate, a refrigerant supplier installed near one side ... | 05/03/2011 |
| 7905764 | Polishing head using zone control A polishing head for a chemical mechanical polishing apparatus is provided which includes at least two polishing head zones configured to provide different temperatures for transferring heat to at least two zones of a substrate corresponding to the at least two poli... | 03/15/2011 |
| 7883393 | System and method for removing particles from a polishing pad A system for removing particles from a polishing pad to improve the efficiency of the removal of material by the polishing pad as part of a chemical-mechanical polishing process, the system comprising a polishing pad; a fluid dispenser arranged to dispense a fluid o... | 02/08/2011 |
| 7883394 | Substrate holding mechanism, substrate polishing apparatus and substrate polishing method A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the... | 02/08/2011 |
| 7878883 | Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control A system and method for slicing an ingot into wafers using the wire saw process. A slurry collection system collects and supplies slurry to a slurry handling system for controlling temperatures and/or flow rates of the slurry thereby providing slurry output at a con... | 02/01/2011 |
| 7837534 | Apparatus for heating or cooling a polishing surface of a polishing apparatus The present invention provides an apparatus for heating or cooling a polishing surface. This apparatus includes a heat exchanger arranged so as to face the polishing surface when the workpiece is polished. The heat exchanger includes a medium passage through which a... | 11/23/2010 |
| 7815490 | Flash vaporizing water jet and piercing with flash vaporization A flash vaporizing liquid jet cutting tool and method for piercing with minimal damage to the cut material. The liquid is preferably superheated water, typically with abrasive particles added after the jet is expressed through a nozzle (abrasive water jet, AWJ) or w... | 10/19/2010 |
| 7815489 | Method for the simultaneous double-side grinding of a plurality of semiconductor wafers A method for the simultaneous double-side grinding of a plurality of semiconductor wafers, involves a process wherein each semiconductor wafer lies such that it is freely moveable in a cutout of one of a plurality of carriers caused to rotate by means of a rolling a... | 10/19/2010 |
| 7794305 | Electric portable grinder with air cooling system A portable electric grinder with an air cooling system and connected to a remote stationary voltage supply means (19, 20) via a cable (16), wherein a cooling air duct (21) is provided to connect cooling air passages (23a, b) in the... | 09/14/2010 |
| 7749049 | Submerged fluid jet polishing Fluid jet polishing (FJP) is a method of contouring and polishing a surface of a component by aiming a jet of a slurry of working fluid from a nozzle at the component and eroding the surface to create a desired shape. During erosion, the end of the nozzle and the co... | 07/06/2010 |
| 7699685 | Method and apparatus for grinding a workpiece A method and apparatus for_cutting a profile in a workpiece, such as a turbine disk, without cracking the parent material which includes providing a grinding wheel having a ceramic grinding surface formed with an optimized grain material and grain spacing to produce... | 04/20/2010 |
| 7666064 | Method for grinding semiconductor wafers Semiconductor wafers are processed so as to remove material on one or both sides by means of at least one grinding tool, with coolant supplied into a contact region between the semiconductor wafer and the at least one grinding tool, characterized in that the coolant... | 02/23/2010 |
| 7635290 | Interpenetrating network for chemical mechanical polishing Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising an interpenetrating network including a continuous non-fugitive phase and a substantially co-continuous fugitive phase. Also provided ar... | 12/22/2009 |
| 7572168 | Method and apparatus for high speed singulation A method of singulating semiconductor devices applies a blade to a molded strip that includes the semiconductor device. The blade generates a kerf at a contact point between the blade and the molded strip. The kerf is filled with a plurality of particles. The kerf s... | 08/11/2009 |
| 7568968 | Coolant nozzle positioning for machining work-pieces A method of determining a position of a coolant nozzle relative to a rotating grinding wheel removing material from a work-piece and an apparatus for practicing the method are disclosed. The method includes the step of disposing a coolant nozzle having a base and a ... | 08/04/2009 |
| 7513819 | Polishing apparatus and method There are provided a polishing apparatus and a polishing method capable of performing polishing a work (such as a wafer) with high efficiency and high precision, a novel work holding plate effectively holding a work and an adhering method for a work capable of adher... | 04/07/2009 |
| 7481696 | Grinding machine and coolant supplying method therefor In a rough grinding step the large quantity of coolant supplied to cool the grinding point enables the flow to pass through a wheel-following air layer and reach the grinding point while the supply of an air jet is stopped during this step. At a fine grinding step, ... | 01/27/2009 |
| 7473160 | Method and apparatus for grinding a workpiece A method and apparatus for cutting a profile in a workpiece, such as a turbine disk, without cracking the parent material which includes providing a grinding wheel having a ceramic grinding surface formed with an optimized grain material and grain spacing to produce... | 01/06/2009 |
| 7419420 | Substrate holding mechanism, substrate polishing apparatus and substrate polishing method A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the... | 09/02/2008 |
| 7390240 | Method of shaping and forming work materials Method of processing a workpiece comprising (a) providing a tool and a workpiece, wherein the workpiece has an initial shape; (b) placing the workpiece and the tool in contact to form an interface, applying force to the tool and/or the workpiece, and moving the tool... | 06/24/2008 |
| 7367867 | Two-side working machine A two-side working machine, comprising an upper and a lower working disc which hold on, and are fixed to, an upper and a lower carrier disc, and which are disposed coaxially with each other and are adapted to be rotationally driven relative to each other by a workin... | 05/06/2008 |
| 7364494 | Eyeglass lens processing apparatus and method of processing eyeglass lens An eyeglass lens processing apparatus for processing an eyeglass lens includes: a lens chuck that holds the lens; a roughing tool; a finishing tool; a finishing data input unit that inputs finishing data; a water supply unit that supplies water to a portion being pr... | 04/29/2008 |
| 7341502 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular... | 03/11/2008 |
| 7335088 | CMP system with temperature-controlled polishing head A chemical mechanical polish system for polishing a wafer includes a polishing head; an inner tube connected to the polishing head, wherein the inner tube is filled with a heat media; a media heater connected to the inner tube; and a pressure controller connected to... | 02/26/2008 |
| 7326103 | Vertically adjustable chemical mechanical polishing head and method for use thereof The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof. ... | 02/05/2008 |
| 7306508 | Multi-wire saw A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating th... | 12/11/2007 |
| 7297286 | Methods for resist stripping and other processes for cleaning surfaces substantially free of contaminants A method for manufacturing an article having polymeric residue that is to be removed during the manufacture of the article is disclosed. The article is introduced into a controlled environment of a processing tool having one or more processing chambers. Free radical... | 11/20/2007 |
| 7270592 | Milling machine The improved milling machine makes use of individually controlled x-axis, y-axis, and z-axis carriages. These carriages provide positive and precise control of the position of the cutting tools and the blank to be cut. The tools are located in spindles that are move... | 09/18/2007 |
| 7238084 | Chemical mechanical polishing apparatus and chemical mechanical polishing method using the same Polishing uniformity in a CMP process may be improved due to an improvement in the temperature uniformity of a polishing surface, when a wafer is polished by a CMP apparatus including a polishing head for holding the wafer, a platen, a polishing pad at a top of the ... | 07/03/2007 |
| 7229336 | Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the pla... | 06/12/2007 |
