Famous Patents
In 1608, Dutch eyeglass maker Hans Lipperhey filed the first patent for a working telescope. The patent was denied.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8113918 | Substrate supporting unit and single type substrate polishing apparatus using the same Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a p... | 02/14/2012 |
| 7556557 | Welding robot comprising an electrode grinder secured on a moving assembly of said welding robot A welding robot (1) comprising a stand (2) pivotally receiving a trunk-forming portion (3) having one end (5) of an articulated arm (6) pivotally mounted thereon, the arm having an opposite end (7) provided with a clamp (... | 07/07/2009 |
| 7435164 | Grinding method and grinding device To grind a peripheral surface of a rotated work (10), by a rotary grindstone (22) rotated by a wheel spindle 21, a rotary brush (40) is mounted to one side of the rotary grindstone (22), so that it is rotated along with the rotary ... | 10/14/2008 |
| 7413504 | Blade sharpening device with blade contour copying device The present invention provides a blade sharpening device designed for sharpening a blade for a uniform sharpening of the edge thereof. The blade sharpening device contains a base having a guide slidably movable relative to the base. The guide includes a material tha... | 08/19/2008 |
| 7364497 | Polish pad and chemical mechanical polishing apparatus comprising the same A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical p... | 04/29/2008 |
| 7341502 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular... | 03/11/2008 |
| 7338344 | Automated drill bit re-sharpening and verification system A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof... | 03/04/2008 |
| 7317324 | Semiconductor integrated circuit testing device and method A plurality of resistors is connected to a plurality of output terminals of a semiconductor integrated circuit, respectively, and a predetermined voltage is applied to the plurality of resistors. Also, a predetermined operation pattern signal used to test functions ... | 01/08/2008 |
| 7279051 | Method for treating a surface bounding a space within a cargo hold in a floating vessel A method for treating an exposed surface. A treating apparatus is provided having an elongate support and at least one flexible surface contacting element at a distal region of the support. The elongate support is manipulated from a proximal region of the support so... | 10/09/2007 |
| 7273408 | Paired pivot arm The present invention relates to an apparatus and method for polishing semiconductor substrates. In one embodiment, two polishing heads are mounted on two independent pivoting arms that share one pivot point. Each of the pivoting arms enable the corresponding polish... | 09/25/2007 |
| 7258599 | Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of t... | 08/21/2007 |
| 7255637 | Carrier head vibration damping A carrier head for chemical mechanical polishing that has a base having at least a portion formed of a polymer, a mounting assembly connected to the base having a surface for contacting a substrate, a retainer secured to the portion of the base to prevent the substr... | 08/14/2007 |
| 7255634 | Draining device and lens processing system having the same A draining device for removing processing water attached to a lens includes: a first lens holding shaft to which a cup attached to a refractive surface of the lens as a processing jig can be fitted; and a rotating unit which rotates the first lens holding shaft to r... | 08/14/2007 |
| 7249992 | Method, apparatus and system for use in processing wafers The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples w... | 07/31/2007 |
| 7241203 | Six headed carousel The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, ... | 07/10/2007 |
| 7238090 | Polishing apparatus having a trough Methods and apparatus for chemical mechanical polishing are described. In one embodiment, an apparatus includes a table top and a transfer station and multiple polishing stations are mounted on the table top. The apparatus further includes multiple washing stations,... | 07/03/2007 |
| 7235139 | Wafer carrier for growing GaN wafers A wafer carrier for growing wafers includes a plate having a first surface and a second surface, a plurality of openings extending from the first surface to the second surface of the plate, and a porous element disposed in each of the plurality of openings, each por... | 06/26/2007 |
| 7229380 | Power transmission device and plate-material feeding apparatus incorporating thereinto the same A power transmission device is capable of correctly adjusting relative positions of two shafts in a direction of rotation even when the shafts are rotationally driven, and comprises a hollow, outer shaft, to one end of which a drive gear is fixed, an inner shaft, to... | 06/12/2007 |
| 7228772 | Brake positioning system A saw is disclosed having a detection system adapted to detect a dangerous condition between a person and a saw blade, and a brake adapted to stop the saw blade in response to detection of the dangerous condition. The saw further includes a brake positioning system ... | 06/12/2007 |
| 7229535 | Hydrogen bubble reduction on the cathode using double-cell designs An apparatus and method for planarizing a surface of a substrate using a chamber separated into two parts by a membrane, and two separate electrolytes is provided. The embodiments of the present invention generally provide an electrochemical mechanical polishing sys... | 06/12/2007 |
| 7223153 | Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces, multiple wafer carriers and at least one load-and-unload cup. The load-and-unload cup may be configured to move to and from the wafer carriers in a ... | 05/29/2007 |
| 7210983 | Apparatus and method for grinding workpieces An exemplary method for grinding workpieces is provided. Firstly, a plurality of workpieces (18) are bonded together. The bonded workpieces have a central axis (181). Secondly, a grinding wheel (10) is provided. The grinding wheel has a rotating... | 05/01/2007 |
| 7207753 | Apparatus and method for shaping an edge of a tile An apparatus and method for shaping an edge of a tile. The preferred embodiment enables an operator to place a tile between an elevator and a reference plate. The operator snugs the edge of the tile up against a reference plate, and causes the elevator to press the ... | 04/24/2007 |
| 7204743 | Integrated circuit interconnect fabrication systems A system for processing a conductive surface on a front surface of a wafer to form a metallic interconnect structure is disclosed. The system for processing comprises an electrochemical mechanical processing (ECMPR) module configured to form a substantially planariz... | 04/17/2007 |
| 7198552 | Polishing apparatus A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable wi... | 04/03/2007 |
| 7189145 | Method of and apparatus for producing roll A belt grinding is integrated with an electroerosion machine for contouring the working surface of a mill roll and providing a texture thereon. The belt grinder can superfinish the roll and remove peaks in the surface without significantly affecting the mean surface... | 03/13/2007 |
| 7177019 | Apparatus for imaging metrology This invention is an apparatus for imaging metrology, which in particular embodiments may be integrated with a processor station such that a metrology station is apart from but coupled to a process station. The metrology station is provided with a first imaging came... | 02/13/2007 |
| 7172496 | Method and apparatus for cleaning slurry depositions from a water carrier Disclosed herein is a process for diminishing contamination of an integrated circuit wafer caused by residual slurry components disposed on a back side of a carrier for engaging an integrated circuit wafer. Also disclosed is a CMP machine configured to wash a back s... | 02/06/2007 |
| 7172497 | Fabrication of semiconductor interconnect structures A system and a method of forming copper interconnect structures in a surface of a wafer is provided. The method includes a step of performing a planar electroplating process in an electrochemical mechanical deposition station for filling copper material into a plura... | 02/06/2007 |
| 7166016 | Six headed carousel The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, ... | 01/23/2007 |
| 7159294 | Burr removal apparatus for laser beam machine The invention provides a burr removal apparatus for laser beam machine which removes burrs formed on the top surface of a workpiece. When, for example, pilot holes PH are produced in a workpiece W by a laser machining tool 60, molten particles scatter ... | 01/09/2007 |
| 7160180 | Substrate delivery mechanism A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring ... | 01/09/2007 |
| 7156720 | Substrate holding apparatus A substrate holding apparatus can accurately control temperature of a substrate in a direct manner with a relatively simple arrangement. The substrate holding apparatus has a top ring configured to hold a substrate to be polished and press the substrate against a po... | 01/02/2007 |
| 7153184 | Method and apparatus for producing optical glasses The invention relates to a method and an apparatus for producing optical glasses. The glasses are polished and marked, following a shaping process. The polishing and marking steps are carried out in a common processing cell which comprises a polishing station, a was... | 12/26/2006 |
| 7131893 | Method for grinding liquid crystal display panel Disclosed is a grinding table apparatus for a liquid crystal display panel and a grinder using the adapt to various sizes of unit liquid crystal display panels for grinding edges of the corresponding liquid crystal display panel by adjusting a variable moving distan... | 11/07/2006 |
| 7129150 | Method of dividing a semiconductor wafer A method of dividing a semiconductor wafer comprising: a bonding film adhering step of adhering a bonding film for die bonding to the back surface of the semiconductor wafer; a protective adhesive tape affixing ste... | 10/31/2006 |
| 7128825 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic ... | 10/31/2006 |
| 7121919 | Chemical mechanical polishing system and process Chemical mechanical polishing (CMP) systems and methods are provided herein. One aspect of the present subject matter is a polishing system. One polishing system embodiment includes a platen adapted to receive a wafer, and a polishing pad drum that has a cylindrical... | 10/17/2006 |
| 7108579 | Method and device for polishing The present invention relates to a polishing method for polishing a workpiece by pressing the workpiece, to be polished, against a fixed abrasive and bringing the workpiece into sliding contact with the fixed abrasive. The polishing method includes a first step of p... | 09/19/2006 |
| 7108590 | Draining device and lens processing system having the same A draining device for removing processing water attached to a lens includes: a first lens holding shaft to which a cup attached to a refractive surface of the lens as a processing jig can be fitted; and a rotating unit which rotates the first lens holding shaft to r... | 09/19/2006 |
