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| Number | Title | Issue Date |
| 7887394 | Double-disc grinding machine, static pressure pad, and double-disc grinding method using the same for semiconductor wafer The present invention is a static pressure pad for supporting both sides of a raw wafer without contact by a static pressure of a fluid supplied to the both sides of the raw wafer in a double-disc grinding machine for a semiconductor wafer, wherein in patterns of la... | 02/15/2011 |
| 7780504 | Method for manufacturing disk-substrates for magnetic recording media, disk-substrates for magnetic recording media, method for manufacturing magnetic recording media, magnetic recording media, and magnetic recording device A method for manufacturing a magnetic recording medium disk substrate is provided for achieving a magnetic disk having a suitable surface roughness, a high in-plane magnetic anisotropy and a high S/N. The manufacturing method has a texturing process wherein the magn... | 08/24/2010 |
| 7722441 | Semiconductor processing Semiconductor processing and equipment are disclosed. The semiconductor equipment and processing provide semiconductor wafers with reduced defects. ... | 05/25/2010 |
| 7654884 | Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method The object of the invention is to provide a method of polishing the end surfaces of a substrate for a recording medium, which is capable of efficiently polishing the inner peripheral end surface and/or the outer peripheral end surface of the substrate preventing the... | 02/02/2010 |
| 7645184 | CD repair apparatus An apparatus for the repair and resurfacing of compact discs using a motorized, abrasive surface. ... | 01/12/2010 |
| 7438627 | Polishing state monitoring method A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a lig... | 10/21/2008 |
| 7435158 | Initial position setting method of grinding wheel in vertical double disc surface grinding machine The present invention provides an initial position setting method of grinding wheels, before starting a grinding operation, in a vertical double disc surface grinding machine for surface grinding the upper and lower grinding surfaces of a work-piece simultaneously b... | 10/14/2008 |
| 7416476 | Brake pad grinding method A method and apparatus for grinding a brake pad forms inclined faces at both ends of the brake pad through a single route of movement and no grinding limit quantity is involved whether boundary lines are parallel with each other or not. The apparatus includes: a fix... | 08/26/2008 |
| 7413499 | Grinding process and apparatus with arrangement for grinding with constant grinding load A process of grinding a surface of a workpiece, by a grinding tool rotated about its axis. The process includes a grinding step of grinding the workpiece surface, by pressing at least one of the grinding tool and the workpiece against the other of the grinding tool ... | 08/19/2008 |
| 7410409 | Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a metho... | 08/12/2008 |
| 7374473 | Texturing slurry and texturing method by using same Texturing slurry for texturing a substrate for a magnetic hard disk is obtained by dispersing abrading particles of a specified kind in a specified kind of dispersant. The abrading particles include diamond clusters formed with artificial diamond particles with prim... | 05/20/2008 |
| 7367873 | Substrate processing apparatus A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and t... | 05/06/2008 |
| 7364495 | Wafer double-side polishing apparatus and double-side polishing method The present invention provides a wafer double-side polishing apparatus comprising at least a carrier plate having wafer holding holes; upper and lower turn tables to which polishing pads are attached; and a slurry supply means; with wafers held in the wafer holding ... | 04/29/2008 |
| 7334747 | Destroying planar material into high security pieces True zero-clearance cutting on a commercial scale is provided via a cutting area including a sacrifice material that is relatively softer than the cutter. One example is a cutting system which is capable of cutting a material such as, for example, tape or paper, int... | 02/26/2008 |
| 7314404 | Burnishing head A burnishing head comprises at least two rails, each rail having an inner wall and an outer wall. The outer walls are at an angle relative to one another and relative to a central axis of the burnishing head. This angle permits the burnishing head to exhibit improve... | 01/01/2008 |
| 7311586 | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surfa... | 12/25/2007 |
| 7278206 | Method of preparing terminal board A terminal board having a plurality of terminals on which ball electrodes are formed can be prepared efficiently and economically without having any short-circuiting between terminals when its terminals formed in very close proximity to one another, as on an interpo... | 10/09/2007 |
| 7270596 | Chemical mechanical polishing process A chemical mechanical polishing process includes rotating at least one of a semiconductor substrate and polishing pad relative to the other. A chemical mechanical polishing slurry is provided intermediate the substrate and pad. The substrate is polished with the slu... | 09/18/2007 |
| 7270595 | Polishing pad with oscillating path groove network A polishing pad (20) for polishing a wafer (32) or other article, the pad having a groove network (60) configured to increase the residence time polishing medium (46) on the pad. The groove network has a first portion (72) that may... | 09/18/2007 |
| 7267602 | Seal assembly manufacturing methods Finishing a seal assembly as a unit is proposed, which prevents alignment of the end gaps of the annular body and the annular ring of the seal assembly, provides the ability to manufacture the seal assembly to very low tolerances, and establishes virtually perfect p... | 09/11/2007 |
| 7267841 | Method for manufacturing single-sided sputtered magnetic recording disks An information-storage media is provided that includes: (a) a substrate disk 312 having first and second opposing surfaces; (b) a first interface layer 304 on the first surface, the first interface la... | 09/11/2007 |
| 7255943 | Glass substrate for a magnetic disk, magnetic disk, and methods of producing the glass substrate and the magnetic disk On a principal surface of a glass disk substrate, a texture comprising a combination of an isotropic texture for stabilizing a flight of a magnetic head flying and traveling over a magnetic disk and an anisotropic texture for imparting a magnetic anisotropy to a mag... | 08/14/2007 |
| 7255632 | Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angul... | 08/14/2007 |
| 7238090 | Polishing apparatus having a trough Methods and apparatus for chemical mechanical polishing are described. In one embodiment, an apparatus includes a table top and a transfer station and multiple polishing stations are mounted on the table top. The apparatus further includes multiple washing stations,... | 07/03/2007 |
| 7217175 | Polishing apparatus and polishing method A polishing apparatus comprises a first polishing table having a first polishing surface, a substrate carrier for holding a substrate and positioning the substrate so as to bring a surface of the substrate into contact with the first polishing surface, a pressing me... | 05/15/2007 |
| 7207862 | Polishing apparatus and method for detecting foreign matter on polishing surface A polishing apparatus comprises a polishing tool having a polishing surface, and a holder device (top ring) for holding a semiconductor wafer (a substrate). The polishing apparatus further comprises a color CCD camera for taking a color image of a region on the poli... | 04/24/2007 |
| 7204745 | Device in a circular, disk-shaped element intended for cleaning purposes The invention relates to a device in a circular disk-shaped cleaning element intended for cleaning by means of a cleaning machine. The element is designed with a number of recesses (3) distributed over the active cleaning surface (2a) thereof Gr... | 04/17/2007 |
| 7194802 | Tool for certifying a head-gimbal assembly A device and method for testing a slider of a head-gimbal assembly during disc drive manufacturing. The device includes a test disc, an actuator arm and a control module. The test disc has a first circumferential area for detecting contact between the slider and the... | 03/27/2007 |
| 7186653 | Polishing slurries and methods for chemical mechanical polishing Aqueous polishing slurries for chemical-mechanical polishing are effective for polishing copper at high polish rates. The aqueous slurries according to the present invention may include soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid di... | 03/06/2007 |
| 7186651 | Chemical mechanical polishing method and apparatus A method for removing material from the surface of a semiconductor wafer with a chemical mechanical polishing process is described. The method uses a polishing pad on which a line-pattern of grooves is formed. The pattern comprises orderly spaced grooved-area and ar... | 03/06/2007 |
| 7175511 | Method of manufacturing substrate for magnetic disk, apparatus for manufacturing substrate for magnetic disk, and method of manufacturing magnetic disk A magnetic polishing method capable of easily and satisfactorily polishing the inner peripheral end face of a circular hole (1) at the center part of a disk substrate (2) even if the diameter of the circular hole is reduced. By this method, a large qua... | 02/13/2007 |
| 7160181 | Polishing pad of CMP equipment for polishing a semiconductor wafer A polishing pad used for polishing the surface of a semiconductor wafer in CMP equipment, includes a support layer adhered to the top of a rotary plate of the CMP equipment, a polishing layer disposed on top of the support layer, and an adhesive layer interposed bet... | 01/09/2007 |
| 7160172 | Multi-station disk finishing apparatus and method Multi-disk processing system and method of continuous finishing of memory media disks for digital data storage systems in preparation for magnetic memory coating, comprising four main sub-systems: 1) multiple driven spindles mounted on a chassis, at 3, 6, 9 and 12 o... | 01/09/2007 |
| 7156726 | Polishing apparatus and method for forming an integrated circuit In one embodiment, a dielectric layer (144, 156) overlying a semiconductor substrate (28) is uniformly polished. During polishing, the perimeter (32) of the semiconductor substrate (28) overlies a peripheral region (16, 48, 66, 86, 120... | 01/02/2007 |
| 7144304 | Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the mi... | 12/05/2006 |
| 7134940 | Data storage splitter An apparatus is provided for destroying or disabling an information or data storage device comprising a first layer and a second layer bonded together. A mechanical device or energy form is inserted into the information or data storage device to cause the first and ... | 11/14/2006 |
| 7118686 | Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods A method for substantially simultaneously polishing a copper conductive structure of a semiconductor device structure and an adjacent barrier layer. The method includes use of a polishing pad with a slurry solution in which copper and a material, such as tungsten, o... | 10/10/2006 |
| 7118448 | Truing method for grinding wheel, its truing device and grinding machine A method and apparatus are used for truing grindstones. Grinding wheels are arranged in a manner such that the respective grindstone surfaces are disposed apart from each other to define a space therebeween and respective ones of the grindstone surfaces are position... | 10/10/2006 |
| 7118446 | Grinding apparatus and method A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perform both edge and face grindin... | 10/10/2006 |
| 7118462 | Disk for toroidal continuously variable transmission and method of machining the same A method of machining a disk for a toroidal-type continuously variable transmission, has the steps of fixing a disk to a core bar having a pair of reference portions for rotation at both end thereof, clamping the reference portions by a first center and a second cen... | 10/10/2006 |
