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| Number | Title | Issue Date |
| 6435950 | Pressurized delivery method for abrasive particulate material A method of delivering abrasive particulate material under pressure from a storage container adapted to contain the abrasive particulate material therein includes communicating an inlet valve with an inlet opening of the storage container and supplying a ... | 08/20/2002 |
| 6431953 | CMP process involving frequency analysis-based monitoring The invention provides a method, for monitoring a chemical-mechanical polishing process, comprising receiving a real-time data signal from a chemical-mechanical polishing process, wherein the real-time data signal pertains to a frictional force, torque, o... | 08/13/2002 |
| 6431957 | Directional flow control valve with recirculation for chemical-mechanical polishing slurries A valve particularly for use within a chemical-mechanical polishing (CMP) system for controlling the supply of slurry and de-ionized water streams while allowing for the constant recirculation of those streams. The valve includes a body having a bore with... | 08/13/2002 |
| 6431950 | Point-of-use fluid regulating system for use in the chemical-mechanical planarization of semiconductor wafers The present invention is directed to an apparatus and method for flow regulation of planarization fluids to a semiconductor wafer planarization machine. In one embodiment, the regulating system includes a fluid storage tank with an acoustic fluid level se... | 08/13/2002 |
| 6428388 | Finishing element with finishing aids A method of using a finishing element and using organic lubricating films for finishing semiconductor wafers is described. The lubricants in the finishing element can be transferred to operative finishing interface forming lubricating film. The organic lu... | 08/06/2002 |
| 6425802 | Apparatus for supplying flush fluid An apparatus is provided with a wafer polishing tool, a source of slurry, and a source of low pressure de-ionized water. The slurry is supplied to the tool for chemical-mechanical planarization. Periodically, the slurry source is shut off and the de-ioniz... | 07/30/2002 |
| 6422922 | Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece A workpiece holder for polishing comprising a workpiece holder body which is provided with multiple perforated holes for holding a workpiece by vacuum suction and a holder back plate which is closely contacted with a back face of the holder body and has g... | 07/23/2002 |
| 6419557 | Polishing method and polisher used in the method A polishing method including applying a polishing agent containing polishing grains and a surfactant onto an oxide film, which is formed on a substrate having a depressed portion and a protruding portion, wherein the surfactant is an organic compound incl... | 07/16/2002 |
| 6416402 | Methods of polishing microelectronic substrates, and methods of polishing wafers Microelectronic substrate polishing systems and methods of polishing microelectronic substrates are described. In one embodiment, a substrate carrier includes a resilient member and a vacuum mechanism. The vacuum mechanism is coupled to the substrate carr... | 07/09/2002 |
| 6413146 | Polishing apparatus This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiec... | 07/02/2002 |
| 6413154 | Polishing apparatus A polishing apparatus can produce a uniform quality of polished products by supplying a polishing solution consistently without being affected by any disturbances in the solution supply source. The polishing apparatus comprises: a polishing section for po... | 07/02/2002 |
| 6406364 | Polishing solution feeder The object of the present invention is to provide a polishing apparatus that can supply a polishing solution having a non-varying distribution of abrading particles sizes at a steady rate. An apparatus (20) for delivering a polishing solution to a polishi... | 06/18/2002 |
| 6406622 | Apparatus for filtering a fluid According to the apparatus, removables 12 trapped by a first filter film 10 are used as a second filter film 13, and clogging of the first filter film 10 is prevented, and an external force such as bubbles is applied to the second filter film 13 to mainta... | 06/18/2002 |
| 6402599 | Slurry recirculation system for reduced slurry drying The present invention provides a slurry delivery system comprising a slurry conduit couplable to a wall of the slurry tank, and configured to receive a slurry therein and deliver a stream of the slurry against an inner wall of the slurry tank. Thus, the s... | 06/11/2002 |
| 6398626 | Polishing apparatus A polishing apparatus is used for polishing a plate-like workpiece, such as a semiconductor wafer or a glass substrate. The polishing apparatus has a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a w... | 06/04/2002 |
| 6398624 | Method of flattening a surface of a semiconductor film A surface of a semiconductor film formed on the substantial entirety of a substrate is bombarded with ceramic particles blasted by an abrasive particle discharge nozzle. The abrasive particle discharge nozzle blasts the abrasive ceramic particles while re... | 06/04/2002 |
| 6390891 | Method and apparatus for improved stability chemical mechanical polishing A single-layer polishing pad is grooved in a pattern having relatively large turn radius bends (i.e., greater than the 90° bends of conventional rectangular grid grooving) to improve stability. The large radius bends allow slurry to be more easily and un... | 05/21/2002 |
| 6390909 | Disk for conditioning polishing pads A conditioning disk including a unitary thermoplastic polymer sheet material cut a unitary circular plate formed with gear teeth along its circular edge, and formed with block form protrusions that are impelled in a sweeping motion by rotation of the unit... | 05/21/2002 |
| 6390903 | Precise polishing apparatus and method The present invention provides a precise polishing apparatus and method in which a polished body is polished by rotating a polishing pad having a diameter greater than that of the polished body while urging the polishing pad against the polished body in c... | 05/21/2002 |
| 6387289 | Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies Planarizing machines and methods for selectively using abrasive slurries on fixed-abrasive planarizing pads in mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies. In one embodiment of a method in accordance with th... | 05/14/2002 |
| 6386950 | Process for mechanical chemical polishing of layer of aluminium or aluminium alloy conducting material Process for mechanical chemical polishing of a layer of an aluminium or aluminium alloy conducting material used in the microelectronics semi-conductors industry in which said aluminium or aluminium alloy layer is abraded using an abrasive composition whi... | 05/14/2002 |
| 6381830 | Method for cutting rare earth alloy, method for manufacturing rare earth alloy plates and method for manufacturing rare earth alloy magnets using wire saw, and voice coil motor A method for cutting a rare earth alloy according to the present invention includes the steps of: a) supplying slurry containing abrasive grains onto a wire; and b) machining the rare earth alloy with the abrasive grains, interposed between the wire and t... | 05/07/2002 |
| 6383060 | Method of polishing silicon wafer Mirror-polishing of a silicon wafer is conducted using an abrasive agent which contains silica as a principal ingredient, and either one of the ingredients set forth at (1) and (2): (1) an ingredient which is selected from alkali sulfide, alkali hydrogens... | 05/07/2002 |
| 6375541 | Polishing fluid polishing method semiconductor device and semiconductor device fabrication method A polishing fluid comprising a distributed organic phase and a continuous aqueous phase. The distributed phase has at least one complexing agent and the aqueous phase has abrasive particles dispersed therein. Reaction products generated during polishing i... | 04/23/2002 |
| 6375544 | System and method for reducing surface defects integrated in circuits The fabrication of integrated circuits entails the repeated application of many basic processing steps, for instance, planarization--the process of making a surface flat, or planar. One specific technique for making surfaces flat is chemical-mechanical pl... | 04/23/2002 |
| 6375547 | Method of operating a fluid jet cutting machine with abrasive removal system A method of operating a fluid jet cutting machine with abrasive removal system. The fluid-jet cutting machine has a nozzle and a carrier assembly attached to the nozzole to move the nozzle along a cutting path. A high-pressure fluid source and an abrasive... | 04/23/2002 |
| 6372111 | Method and apparatus for reclaiming a metal from a CMP process for use in an electroplating process A method and apparatus is disclosed for reclaiming a metal from the effluent of a chemical mechanical planarization (CMP) process and using the reclaimed metal in an electroplating process. The steps of the method include using a chemical solution in a CM... | 04/16/2002 |
| 6371833 | Backing film for chemical mechanical planarization (CMP) of a semiconductor wafer A backing film having areas of different compressibilities is useful in polishing semiconductor wafers.... | 04/16/2002 |
| 6371834 | Method for preparing glass substrate for magnetic recording medium A method for preparing a glass substrate for use in making a magnetic recording medium is herein disclosed and the method is characterized in that an abrasive liquid containing a CeO2 -base abrasive having an average particle size, D50 | 04/16/2002 |
| 6361409 | Polymeric polishing pad having improved surface layer and method of making same A polishing pad made of polymeric material has an improved surface layer which is provided by treating a surface of the polishing pad with a chemical solvent. Solubility parameter is used to select a suitable chemical solvent. The treated polishing pad ca... | 03/26/2002 |
| 6361415 | Employing an acidic liquid and an abrasive surface to polish a semiconductor topography The present invention advantageously provides a method and apparatus for polishing a semiconductor topography by applying a liquid which is void of particles between the topography and an abrasive polishing pad surface. The semiconductor topography is rot... | 03/26/2002 |
| 6361417 | Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved alon... | 03/26/2002 |
| 6358116 | Thrown wafer failsafe system for chemical/mechanical planarization An improved wafer polishing technique. The apparatus as configured prevents the destruction of a thrown wafer and facilitates quick restart of the polishing process on a previously thrown wafer without shutting down or reinitializing the apparatus. When a... | 03/19/2002 |
| 6358125 | Polishing liquid supply apparatus A polishing liquid supply apparatus supplies a polishing liquid to a polishing unit. The polishing liquid supply apparatus includes a supply tank for storing a polishing liquid having a predetermined concentration, and a polishing liquid pipe for deliveri... | 03/19/2002 |
| 6350183 | High pressure cleaning A method and apparatus for chemical mechanical polishing a semiconductor wafer by providing a novel high pressure mixture of gas and liquid in a pulsation mode for eliminating residual slurry, by-products, and slurry abrasive particles on or in the polish... | 02/26/2002 |
| 6347979 | Slurry dispensing carrier ring A slurry dispensing carrier ring for confining a semiconductor wafer to a polishing pad in a chemical mechanical polishing machine. The slurry dispensing ring has a diameter and a lower surface substantially parallel to the plane defined by the diameter a... | 02/19/2002 |
| 6347978 | Composition and method for polishing rigid disks A method for polishing computer rigid disks comprising bringing at least one surface of the rigid disk into contact with a polishing pad and applying a composition to the rigid disk comprising at least one hydroxylamine additive and colloidal silica to gi... | 02/19/2002 |
| 6343977 | Multi-zone conditioner for chemical mechanical polishing system An apparatus and method for conditioning the polishing pad of CMP system by employing a multi-zone conditioner, or dresser. The conditioner comprises a plurality of rollers or disks, which can be well tuned to make down-pressure and rolling speed of the r... | 02/05/2002 |
| 6341998 | Integrated circuit (IC) plating deposition system and method The present invention system and method facilitates efficient material deposition and wafer planarization during IC wafer fabrication. The present invention is particularly useful in facilitating efficient copper deposition and manufacturing of interconne... | 01/29/2002 |
| 6338670 | Method and system of manufacturing slurry for polishing, and method and system of manufacturing semiconductor devices A manufacturing system of semiconductor devices, which comprises a dispersing equipment for dispersing inorganic oxide with water, a filtrating equipment provided behind the dispersing equipment for filtrating the slurry sent from the dispersing equipment... | 01/15/2002 |
