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| Number | Title | Issue Date |
| 8157614 | Method of making and apparatus having windowless polishing pad and protected fiber A polishing system includes a polishing pad with an aperture that extends through all layers of the polishing pad and a light transmissive film positioned on top of a light-generating or light-guiding element of an optical monitoring system. ... | 04/17/2012 |
| 8152596 | Apparatus for deburring boards An apparatus for deburring boards includes a platform, on which first and second guiding rail units perpendicular to each other are fixed, a deburring unit mounted on the first guiding rail unit, a carrying unit adapted for carrying the boards and mounted movably on... | 04/10/2012 |
| 8128458 | Polishing apparatus and substrate processing method A polishing apparatus detects the escape of a substrate from a top ring during polishing. The polishing apparatus includes a polishing table having a polishing pad, a top ring, and a substrate escape detection section for detecting escape of the substrate from the t... | 03/06/2012 |
| 8118640 | Wafer transferring apparatus, polishing apparatus, and wafer receiving method A wafer transferring apparatus includes a top ring for holding a wafer on a lower end surface thereof and a pusher mechanism for transferring the wafer to and from the top ring. The pusher mechanism has a wafer rest for placing the wafer thereon and is arranged to a... | 02/21/2012 |
| 8118641 | Chemical mechanical polishing pad having window with integral identification feature Chemical mechanical polishing pads having a window with an integral identification feature, wherein the window has a polishing face and a nonpolishing face, wherein the integral identification feature is observable through the window, and wherein the integral identi... | 02/21/2012 |
| 8092274 | Substrate polishing metrology using interference signals A polishing pad assembly for a chemical mechanical polishing apparatus includes a polishing pad having a polishing surface and a surface opposite the polishing surface for attachment to a platen, and a solid light-transmissive window formed in the polishing pad. The... | 01/10/2012 |
| 8083570 | Chemical mechanical polishing pad having sealed window A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad... | 12/27/2011 |
| 8047896 | Polishing apparatus, polishing method, and processing apparatus The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the ... | 11/01/2011 |
| 8047895 | Machining device comprising a measuring device for a model The invention relates to a machining device (5) comprising a workpiece (8) and at least one machining tool (23, 40, 41) and a measuring device (1, 22) and a seat (20) for the workpiece (8) to be machined. The workpiece (8... | 11/01/2011 |
| 8038508 | Apparatus for polishing a wafer and method for detecting a polishing end point by the same A wafer polishing apparatus includes a polishing tape extending between two guide rollers, a first surface of the polishing tape contacting a surface of a wafer to be polished, a polishing head including a pusher pad, the pusher pad adapted to push the polishing tap... | 10/18/2011 |
| 7988529 | Methods and tools for controlling the removal of material from microfeature workpieces Methods and apparatus for controlling the removal of material from microfeature workpieces in abrasive removal processes. An embodiment of such a method comprises irradiating a periodic structure of the workpiece and obtaining an intensity distribution of radiation ... | 08/02/2011 |
| 7985121 | Chemical-mechanical planarization pad having end point detection window A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedd... | 07/26/2011 |
| 7967661 | Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture Planarizing systems and methods of planarizing microelectronic workpieces using mechanical and/or chemical-mechanical planarization are disclosed herein. In one embodiment, a planarizing system includes a platen having a support surface carrying a planarizing pad. T... | 06/28/2011 |
| 7946905 | Bit sharpening apparatus and method of using Disclosed in the present application is a sharpening apparatus and method for sharpening a cutting bit. The apparatus comprises a sharpening member and a laser for accurately positioning the cutting bit surface to be sharpened with respect to the sharpening member. ... | 05/24/2011 |
| 7942724 | Polishing pad with window having multiple portions A polishing pad has an opaque polishing layer with an aperture therethrough and a polishing surface, and a solid light-transmissive window in the aperture. The solid light-transmissive window includes an outer portion secured to the polishing layer and an inner port... | 05/17/2011 |
| 7938714 | Polishing pad assembly with glass or crystalline window Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. ... | 05/10/2011 |
| 7931522 | Removable optical monitoring system for chemical mechanical polishing A polishing system includes a platen having a top surface to receive a polishing pad, a recess in the top surface, and a cavity inside the platen spaced from the recess, a carrier head to hold a surface of a substrate against the polishing pad on the platen, a monit... | 04/26/2011 |
| 7927184 | Method and system for endpoint detection A method and system are presented for monitoring a process sequentially applied to a stream of substantially identical articles by a processing tool, so as to terminate the operation of the processing tool upon detecting an end-point signal corresponding to a predet... | 04/19/2011 |
| 7927183 | Polishing pad A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side). A method for manufacturing a semiconductor device includes a process of polishing the surface of a semiconductor wafer... | 04/19/2011 |
| 7918712 | Endpoint detection system for wafer polishing An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal ... | 04/05/2011 |
| 7892069 | Loading device of chemical mechanical polishing equipment for semiconductor wafers A loading device of chemical mechanical polishing (CMP) equipment for processing semiconductor wafers is provided. The loading device includes a loading cup having a cup-like bath, a cup plate installed in the bath, and a loading plate supported on the cup plate for... | 02/22/2011 |
| 7892070 | Process of using a polishing apparatus including a platen window and a polishing pad A polishing pad can include a first layer and a second layer. The first layer can have a first polishing surface and a first opening. The second layer can have an attaching surface and a second opening substantially contiguous with the first opening. The polishing p... | 02/22/2011 |
| 7874894 | Polishing pad A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side) and is capable of preventing a slurry from leaking from the boundary between a polishing region and a light-transmittin... | 01/25/2011 |
| 7846008 | Method and apparatus for improved chemical mechanical planarization and CMP pad A polishing pad includes a guide plate, a porous slurry distribution layer and a flexible under-layer. Polishing elements are interdigitated with one another through the slurry distribution layer and the guide plate. The polishing elements may be affixed to the comp... | 12/07/2010 |
| 7841926 | Substrate polishing metrology using interference signals A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the substrate and the polishing pad to polish a side of the substrate, gen... | 11/30/2010 |
| 7841925 | Polishing article with integrated window stripe A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear ... | 11/30/2010 |
| 7824244 | Methods and apparatus for polishing a semiconductor wafer Methods and apparatus provide for: a base on which a substrate may be releasably coupled; a moving belt located with respect to the base such that a contact surface thereof is operable to remove material from a top surface of the substrate; and a plurality of actuat... | 11/02/2010 |
| 7780503 | Polishing apparatus and polishing method A polishing apparatus makes it possible to polish and remove an extra conductive film while preventing the occurrence of erosion and without lowering of the throughput. The polishing apparatus includes: a polishing table having a polishing surface; a top ring for ho... | 08/24/2010 |
| 7775852 | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a lase... | 08/17/2010 |
| 7731566 | Substrate polishing metrology using interference signals A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the substrate and the polishing pad to polish a side of the substrate, gen... | 06/08/2010 |
| 7686674 | Cup attaching apparatus A cup attaching apparatus for attaching a cup to an eyeglass lens, comprises: a lens mount on which the lens is to be mounted; at least three support pins provided on the lens mount to support the lens when a rear refractive surface of the lens is brought in contact... | 03/30/2010 |
| 7662022 | Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero. ... | 02/16/2010 |
| 7651385 | Polishing system with optical head A polishing system includes a platen, a carrier head to hold a surface of a substrate against a polishing pad on the platen, a monitoring module including a light source and a detector, an optical fiber having a proximate end coupled to the monitoring module and a d... | 01/26/2010 |
| 7651384 | Method and system for point of use recycling of ECMP fluids The present invention generally comprises a method and an apparatus for recycling electrochemical mechanical polishing (ECMP) fluid. A selected portion of used ECMP fluid may be delivered to a recycling unit where the fluid may be refurbished. The concentration of t... | 01/26/2010 |
| 7621798 | Reducing polishing pad deformation A chemical mechanical polishing pad is described. A chemical mechanical polishing pad has an outer layer that includes a polishing surface, a first thinned region defined by a recess on a bottom surface of the pad, a first thick region surrounding the first thinned ... | 11/24/2009 |
| 7614932 | Method and system for endpoint detection A method and system are presented for monitoring a process sequentially applied to a stream of substantially identical articles by a processing tool, so as to terminate the operation of the processing tool upon detecting an end-point signal corresponding to a predet... | 11/10/2009 |
| 7614934 | Double-side polishing apparatus The double-side polishing apparatus for polishing both faces of a wafer is capable of reliably measuring not only a thickness of an outer part of the wafer but also a thickness of a center part thereof. The double-side polishing apparatus comprises: a lower polishin... | 11/10/2009 |
| 7614933 | Polishing pad assembly with glass or crystalline window Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. ... | 11/10/2009 |
| 7604527 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular... | 10/20/2009 |
| 7585204 | Substrate polishing apparatus A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a tab... | 09/08/2009 |
