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| Number | Title | Issue Date |
| 6620030 | Dual grindstone A grinder for use with a tire uniformity machine and being selectially moved into and out of contact with a tire mounted in the tire uniformity machine and including a pair of rotatable grindstones for grinding the tire carried by a grinding head. The gri... | 09/16/2003 |
| 6620027 | Method and apparatus for hard pad polishing Methods and apparatus for planarizing a substrate surface having copper containing materials thereon is provided. In one aspect, the invention provides a system for processing substrates comprising a first platen adapted for polishing a substrate with a h... | 09/16/2003 |
| 6609956 | Method and machine for grinding coated sheets of glass A machine for grinding coated sheets of glass has a supporting surface for a sheet of glass for grinding, and two grinding units located on opposite sides of the supporting surface; each grinding unit having at least one first grinding wheel for grinding ... | 08/26/2003 |
| 6609954 | Method of planarization A polarization method that utilizes a chemical-mechanical polishing operation. In the polishing operation, slurry for polishing a metallic layer is first employed to remove a greater portion of the metallic layer. Next, slurry for polishing a dielectric l... | 08/26/2003 |
| 6602108 | Modular controlled platen preparation system and method A system and method are disclosed for preparing platens to perform lapping operations. The system includes a platter that is rotatably mounted on a base and designed to receive the platen thereon. A main drive motor is provided for rotating the platter an... | 08/05/2003 |
| 6602118 | Orbital finishing sander An orbital finishing sander for finishing coarsely sanded wood pieces includes a support frame and a conveyor belt movably mounted on the frame and extending generally horizontally thereon. An orbital sander support such as a plate is mounted on the frame... | 08/05/2003 |
| 6602436 | Chemical mechanical planarization of metal substrates A method of polishing a wafer in a carrier by a polishing pad, controlling a ratio of platen speed to carrier speed (PS to CS) within a specific range, or controlling a first polishing step with a PS to CS ratio in the range of about 150:1 to about 1:150 ... | 08/05/2003 |
| 6599174 | Eliminating dishing non-uniformity of a process layer A method includes providing at least one wafer having a process layer formed thereon. A surface of the process layer is polished using a first polishing process that is comprised of a slurry and a first polishing pad. The slurry is removed from the surfac... | 07/29/2003 |
| 6599173 | Method to prevent leaving residual metal in CMP process of metal interconnect A CMP slurry for and method of polishing a semiconductor wafer during formation of metal interconnects are disclosed. The present invention utilizes a first slurry comprising a first oxidizer, preferably ferric nitrate, to remove the excess metal of the m... | 07/29/2003 |
| 6595832 | Chemical mechanical polishing methods In one implementation, a chemical mechanical polishing method includes providing a workpiece having a dielectric region to be polished. A first chemical mechanical polishing of the dielectric region is conducted on the workpiece using a polishing pad and ... | 07/22/2003 |
| 6595830 | Method of controlling chemical mechanical polishing operations to control erosion of insulating materials The present invention is directed to a method of polishing wafers on a polishing tool comprised of first, second and third platens. The method comprises providing a wafer having a patterned layer of insulating material, a barrier metal layer, and a metal ... | 07/22/2003 |
| 6596150 | Production method for an aluminum support for a lithographic printing plate Disclosed is a production method of an aluminum support for a lithographic printing plate, capable of stable and low-cost production of an aluminum support for a lithographic printing plate, the support being scarcely subject to generation of treatment un... | 07/22/2003 |
| 6595831 | Method for polishing workpieces using fixed abrasives A polishing method and apparatus can concurrently establish a stable removal rate, a small step height reduction rate, and reduction of detects on the polished surface for various kinds of polished subjects, while providing less environmental problems and... | 07/22/2003 |
| 6585567 | Short CMP polish method A short CMP polish process is provided which removes minimal amounts of oxide and reduces defectivity at the surface of the wafer during short periods of rework by maintaining a high pH at the wafer surface in the presence of a high pH slurry. In one embo... | 07/01/2003 |
| 6585559 | Modular controlled platen preparation system and method A system and method are disclosed for preparing platens to perform lapping operations. The system includes a platter that is rotatably mounted on a base and designed to receive the platen thereon. A main drive motor is provided for rotating the platter an... | 07/01/2003 |
| 6582282 | Chemical mechanical polishing with multiple polishing pads In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads. Then the substrate is polished with a standard polishing pad to remove scratch defects created by the fixed-abrasive polishing pads.... | 06/24/2003 |
| 6579604 | Method of altering and preserving the surface properties of a polishing pad and specific applications therefor The present invention is directed, in general, to an improved material and method of planarizing a surface on a semiconductor wafer and, more specifically, to a method of altering the properties of polymers, preferably thermoplastic foam polymers, used in... | 06/17/2003 |
| 6575816 | Dual purpose handoff station for workpiece polishing machine The present invention provides a dual purpose workpiece handoff station for intermediately staging a semiconductor wafer, or other workpiece, being transferred between processing stations in, for example, a Chemical-Mechanical Planarization (CMP) machine.... | 06/10/2003 |
| 6572442 | Method and apparatus for forming grooves on a workpiece and for dressing a grindstone used in the groove formation A grinding apparatus for grinding a spline ball groove on a workpiece comprises a rod-shaped grindstone, having a distal end portion with a curved surface corresponding to the groove to be ground, and a spindle mechanism for rotating the grindstone. The s... | 06/03/2003 |
| 6565417 | Method for manufacturing glass base material and glass base material grinding apparatus An apparatus for grinding a glass base material having a core and a clad comprising: a grinding wheel for grinding the clad; a measuring unit for measuring an eccentricity between a center position of the glass base material and a center position of the c... | 05/20/2003 |
| 6565416 | Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process A multi-platen chemical-mechanical polishing system is used to polish a wafer. The wafer is polished at a first station. During polishing, an endpoint is detected. The endpoint is detected by generating optical radiation by a first light source. The first... | 05/20/2003 |
| 6561876 | CMP method and semiconductor manufacturing apparatus A CMP method for polishing and flattening a film having a rugged surface and formed on a surface of semiconductor substrate by making use of an abrasive cloth while feeding an abrasive agent to the film, wherein the abrasive agent comprises abrasive grain... | 05/13/2003 |
| 6561881 | System and method for chemical mechanical polishing using multiple small polishing pads A system and method for chemically and mechanically polishing surfaces of semiconductor wafers utilizes multiple polishing pads having diameters that are smaller than the diameter of the wafers to simultaneously polish a given semiconductor wafer. The use... | 05/13/2003 |
| 6558231 | Sequential electromachining and electropolishing of metals and the like using modulated electric fields A surface of an electrolytically dissolvable material, e.g., an electrolytically dissolvable metal, is smoothed by a two-step electrochemical process wherein a the surface to be smoothed and a counterelectrode are contacted with an electrolyte and an elec... | 05/06/2003 |
| 6558227 | Method for polishing a work and an apparatus for polishing a work There is disclosed a method for polishing a work wherein polishing liquid is supplied to a polishing pad, and a relative movement is carried out between the work and the polishing pad with pressing the work on the polishing pad, wherein the work of which ... | 05/06/2003 |
| 6541383 | Apparatus and method for planarizing the surface of a semiconductor wafer An arrangement for planarizing a surface of a semiconductor wafer. The arrangement includes a planarizing member having a planarizing surface configured to be (i) positioned in contact with and (ii) moved relative to the surface of the semiconductor wafer... | 04/01/2003 |
| 6530826 | Process for the surface polishing of silicon wafers A process for the surface polishing of a silicon wafer, includes the successive polishing of the silicon wafer on at least two different polishing plates covered with polishing cloth, with a continuous supply of alkaline polishing abrasive with SiO2 | 03/11/2003 |
| 6530825 | Method for the production of glass substrates for magnetic recording mediums A method for the production of a glass substrate for magnetic recording mediums comprises the steps of sandwiching an abrasion board for correction between upper and lower surface tables of a both side-polishing device for polishing the glass substrate, w... | 03/11/2003 |
| 6527628 | Method for producing frost glass product The present invention provides a method for producing a frosted glass product, where a sand blast processing using a powder class abrasive and a brush polishing treatment are performed and thereby appearance and touch feeling equal to those of a product w... | 03/04/2003 |
| 6527627 | Semiconductor wafer grinding method A method of grinding a semiconductor using grinding machine having a chuck table for holding a semiconductor and a grinding means for grinding the top surface of a semiconductor placed on the chuck table, comprising the step of holding the ground semicond... | 03/04/2003 |
| 6514863 | Method and apparatus for slurry distribution profile control in chemical-mechanical planarization A nonplanar substrate surface is substantially uniformly planarized by a chemical mechanical planarization (CMP) process. The CMP process uses multiple sources of slurry delivered in between a slurry distribution screen and a slurry membrane of the CMP ap... | 02/04/2003 |
| 6506097 | Optical monitoring in a two-step chemical mechanical polishing process An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance tr... | 01/14/2003 |
| 6497611 | Method of polishing a magnetic head slider Disclosed is a method of polishing a magnetic head slider whereby a by-processed step can be easily reduced. An air bearing surface of the magnetic head slider is polished with setting a bar that includes the magnetic head slider where a thin film magneti... | 12/24/2002 |
| 6494768 | Wafer polishing apparatus A wafer polishing apparatus according to this invention has a polishing unit that includes three platens and two polishing heads. Injection ports are disposed between the platens. The two polishing heads can linearly move between the platens. In a two-ste... | 12/17/2002 |
| 6478661 | Apparatus and method for processing micro-V grooves A voltage is applied between a cylindrical cutting grindstone 2 that rotates about a vertical axis Y and a cylindrical truing grindstone 6 that rotates about a horizontal axis X. The vertical outer surface 2a and the horizontal lower surface 2b of the cut... | 11/12/2002 |
| 6475069 | Control of removal rates in CMP A method for CMP polishing with a first step slurry composition selective to a metal in a metal layer to remove the metal at a high removal rate during polishing, and a second step slurry composition selective to a barrier film and least selective to eith... | 11/05/2002 |
| 6475068 | Wafer holding plate for wafer grinding apparatus and method for manufacturing the same A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove p... | 11/05/2002 |
| 6475638 | Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof A process for producing an electrodeposited copper foil with its surface prepared, comprising the steps of: subjecting an electrodeposited copper foil having a shiny side and a matte side whose average surface roughness (Rz) is in the range of 2.5 to 10 Î... | 11/05/2002 |
| 6461226 | Chemical mechanical polishing of a metal layer using a composite polishing pad A method of polishing a wafer is disclosed. The wafer has formed thereon an oxide layer that has at least one via. A metal layer is formed on the oxide layer and in the via. The wafer is then polished against an outer portion of a polishing pad until the ... | 10/08/2002 |
| 6461230 | Chemical-mechanical polishing method A method for changing the polishing selectivity ratio of slurry used in chemical-mechanical polishing. Barrier slurry and a diluent are mixed together at different ratios to produce a mixture containing different amounts of solvent, chemicals and polishin... | 10/08/2002 |
