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| Number | Title | Issue Date |
| 8403727 | Pre-planarization system and method A method for producing a normalized surface on a substrate for a chemical mechanical planarization process is provided. The method initiates with grinding a surface of the substrate with a first surface associated with a first planarization length. The method includ... | 03/26/2013 |
| 8333637 | Manufacturing method of metal mold and relection mirror for projection optical system There are provided a method of manufacturing a metal mold suitable for forming, for example, a reflection mirror for a projection optical system and a reflection mirror for the projection optical system manufactured by the method thereof. The method includes a first... | 12/18/2012 |
| 8251778 | Double-side grinding apparatus for wafer and double-side grinding method A double-side grinding apparatus is designed to be capable of minimizing thermal expansion of hydrostatic pad members and reducing nanotopography in performing wafer grinding. The double-side grinding apparatus is a double-side grinding apparatus for wafers that can... | 08/28/2012 |
| 8167687 | Method of thinning wafer and support plate A wafer can be thinned without occurrences of dimples. A support plate 1 has a number of through holes 10. A circuit forming surface of a wafer 2 is adhered to one surface of the support plate by an adhesive member 4, and a dimple prevent... | 05/01/2012 |
| 8157620 | System and method for cleaning stator slots A system and method for cleaning receiver slots with hook-fits for stator blade ring segments. A first cleaning tool with an abrasive coating and sideward projection in the shape of the hook is slid through the slot using the hook-fit as a guide. A second cleaning t... | 04/17/2012 |
| 8157621 | Wafer back side grinding process A wafer back side grinding process. A workpiece comprising a first assembly having a first semiconductor wafer and a second assembly having a second semiconductor wafer is provided. A first back side of the first semiconductor wafer is grinded by using the second as... | 04/17/2012 |
| 8133096 | Multi-phase polishing pad An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a polishing surface, the polishin... | 03/13/2012 |
| 8070558 | Porcelain epoxy flooring and method for producing the same An epoxy porcelain tile surface including a plurality of spaced, substantially flat substantially smooth porcelain tiles and epoxy grouting substantially filling the spaces between the porcelain tiles. The plurality of spaced, substantially flat substantially smooth... | 12/06/2011 |
| 8070559 | Zr-rich bulk amorphous alloy article and method of surface grinding thereof A method of surface grinding a Zr-rich bulk amorphous alloy article includes providing a substrate; providing a first surface grinder for rough surface grinding; and providing a second surface grinder for finish surface grinding. During the rough surface grinding, t... | 12/06/2011 |
| 8066551 | Retaining ring with shaped surface A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine ... | 11/29/2011 |
| 8025556 | Method of grinding wafer A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck tabl... | 09/27/2011 |
| 7922564 | Sanding element The invention concerns a sanding element with a succession of overlapping lamellas (3, 4) comprising sanding grains (9), characterized in that these lamellas (3, 4) are alternately formed of sanding lamellas (3) and compressible lamellas ... | 04/12/2011 |
| 7815492 | Surface treatment method A surface treatment method that enables a surface of an electrostatic chuck to be smoothed, so as to improve the efficiency of heat transfer between the surface of the electrostatic chuck and a substrate. The electrostatic chuck is provided in an upper portion of a ... | 10/19/2010 |
| 7674157 | Two-sided surface grinding method In effecting two-sided surface grinding for surface-grinding the opposite surfaces of a workpiece simultaneously by a pair of oppositely disposed grinding wheels, infeed grinding is performed by oscillating the workpiece within the range where the surfaces to be gro... | 03/09/2010 |
| 7500905 | Grinding apparatus and grinding system A grinding apparatus and a grinding system capable of efficient and superior grinding performance prevent the falling of a belt during the grinding of an edge surface thereof. The apparatus includes two rotating bodies 31 and 32 each having segment bru... | 03/10/2009 |
| 7442114 | Methods for silicon electrode assembly etch rate and etch uniformity recovery Methods for cleaning an electrode assembly, which can be used for etching a dielectric material in a plasma etching chamber after the cleaning, comprise polishing a silicon surface of the electrode assembly, preferably to remove black silicon contamination therefrom... | 10/28/2008 |
| 7429209 | Method of polishing a glass substrate for use as an information recording medium An information recording medium glass substrate manufactured by polishing the surface of a raw material glass plate. The polishing is divided into two steps, a step for performing a first polishing process to roughly polish the surface of the raw material glass plat... | 09/30/2008 |
| 7416476 | Brake pad grinding method A method and apparatus for grinding a brake pad forms inclined faces at both ends of the brake pad through a single route of movement and no grinding limit quantity is involved whether boundary lines are parallel with each other or not. The apparatus includes: a fix... | 08/26/2008 |
| 7413496 | Method and device for polishing endless belt metal rings for continuously variable transmission There are disclosed a method and device for polishing a metal ring, which is capable of polishing a side edge of the metal ring without performing barrel polishing or polishing by grinding stones. Subsequently to a projecting step of projecting a metal ring W by cle... | 08/19/2008 |
| 7404756 | Process for manufacturing optical and semiconductor elements A method for fabricating an array of precisely shaped and located shaped elements utilizes a precisely shaped patterned abrasive to form channels in a workpiece. One or more patterned abrasives contact and abrade along one or more intersecting axes to define the sha... | 07/29/2008 |
| 7393261 | Cylindrical grinding method for producing hard metal tools and cylindrical grinding machine for grinding cylindrical starting bodies during the production of hard metal tools The invention relates to a grinding method and to a cylindrical grinding machine, in which a sintered hard metal round rod is completely pushed through a chuck of a workpiece spindle head, said chuck having chuck jaws. Two backrest seats are ground on the freely pro... | 07/01/2008 |
| 7378349 | Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method Disclosed is a chemical mechanical polishing aqueous dispersion comprising (A1) first fumed silica having a specific surface area of not less than 10 m2/g and less than 160 m2/g and an average secondary particle diameter of not less than 170 nm... | 05/27/2008 |
| 7374472 | Method for manufacturing decorative stone A method of using ultrasonic cutting technology to make a decorative stone includes cutting a stone or other decorative materials into certain positive pieces having various shape by the ultrasonic cutting technology; cutting another stone to certain depth but not t... | 05/20/2008 |
| 7371157 | Fixture for grinding machines A fixture for grinding machines includes a first base (10), a second base (20) and a driving component (40). The first base defines a first working groove (11) therein. The second base defines a second working groove (12) correspon... | 05/13/2008 |
| 7364495 | Wafer double-side polishing apparatus and double-side polishing method The present invention provides a wafer double-side polishing apparatus comprising at least a carrier plate having wafer holding holes; upper and lower turn tables to which polishing pads are attached; and a slurry supply means; with wafers held in the wafer holding ... | 04/29/2008 |
| 7357696 | Method and apparatus for reconditioning digital discs An automated method for reconditioning a plurality of digital discs within a reconditioning apparatus is disclosed. The method comprises holding the digital discs in a load area, and then transferring each of the digital discs from the load area to at least one work... | 04/15/2008 |
| 7354332 | Technique for process-qualifying a semiconductor manufacturing tool using metrology data A technique of the present invention utilizes qualification characteristics from a single wafer for qualifying a semiconductor manufacturing tool. Generally speaking, the technique commences with the processing of a wafer by the manufacturing tool. During processing... | 04/08/2008 |
| 7351130 | Sanding machine having adjustable brush A sanding or polishing or grinding machine includes one or more sanding wheels supported on a machine base and movable up and down relative to the machine base for grinding the work pieces of different heights or thicknesses. A driving device may be used for driving... | 04/01/2008 |
| 7347765 | Honing installation with several work stations A honing installation for honing workpieces comprises a plurality of work stations, each work station being configured for performing at least one working step on a workpiece and at least part of the work station is set up as a honing station for performing at least... | 03/25/2008 |
| 7338349 | Apparatus and process for cylindrically grinding workpieces An apparatus for cylindrically grinding workpieces includes a first holding tool (100) for positioning pre-grinding workpieces (40) and a second holding tool (200) for positioning partially ground workpieces (i.e. workpieces which have been grou... | 03/04/2008 |
| 7332099 | Ion bombardment of electrical lapping guides to decrease noise during lapping process A method for reducing noise in a lapping guide. Selected portions of a magnetoresistive device wafer are bombarded with ions such that a magnetoresistive effect of lapping guides is reduced. The device is lapped, using the lapping guides to measure an extent of the ... | 02/19/2008 |
| 7329171 | Fixed abrasive article for use in modifying a semiconductor wafer An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive element and the resilient element. ... | 02/12/2008 |
| 7326104 | Apparatus for holding lenses and method for use thereof An apparatus for holding a plurality of lenses, including: a block having a mounting surface; a cavity defined in the block at the mounting surface; and a through hole defined in the block, the through hole being in communication with the cavity, wherein the mountin... | 02/05/2008 |
| 7314403 | Apparatus and method for fabricating liquid crystal display panel An apparatus and method for fabricating a liquid crystal display panel are disclosed. In case of the single mode that liquid crystal display panels are fabricated with the same size on a large glass substrate, unit liquid crystal display panels are kept and discarde... | 01/01/2008 |
| 7309277 | Method of manufacturing honeycomb structural body A method of manufacturing a honeycomb structure of the present invention is a method of obtaining a honeycomb structure 10 having a predetermined shape by processing a peripheral portion of a crude honeycomb structure 2, the method being characterized ... | 12/18/2007 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7303462 | Edge bead removal by an electro polishing process A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using an electrode configured to electro polish a substrate edge are disclosed. The electro polishing of the substrate edge may occur simultaneously during electroche... | 12/04/2007 |
| 7303461 | Method of machining airfoils by disc tools A method for machining a rotor having a disc and a plurality of integral airfoils projecting outwardly from the disc, according to one aspect of the invention, comprises a step of machining each airfoil with a disc tool having a grinding periphery thereof adapted fo... | 12/04/2007 |
| 7300877 | Method of manufacturing a semiconductor device A method of manufacturing a semiconductor device that prevents formation of scratches and occurrence of dishing in a CMP process. The method includes forming a first film on a part of a semiconductor substrate, forming a second film all over the semiconductor substr... | 11/27/2007 |
| 7300876 | Method for cleaning slurry particles from a surface polished by chemical mechanical polishing A method is provided to clean slurry particles from a surface in which tungsten and dielectric are coexposed after a dielectric CMP step. Such a surface is formed when tungsten features are patterned and etched, the tungsten features are covered with dielectric, and... | 11/27/2007 |
