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| Number | Title | Issue Date |
| 6905400 | Method and apparatus for dressing polishing cloth A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial ... | 06/14/2005 |
| 6903018 | Methods and apparatuses for planarizing microelectronic substrate assemblies Methods and apparatuses for planarizing microelectronic substrate assemblies on fixed-abrasive polishing pads with non-abrasive lubricating planarizing solutions. One aspect of the invention is to deposit a lubricating planarizing solution without abrasive particles... | 06/07/2005 |
| 6902470 | Apparatuses for conditioning surfaces of polishing pads The invention includes a method for conditioning a surface of a polishing pad after chemical-mechanical polishing of a semiconductor substrate with the pad surface. The method includes exposing the pad surface to steam, and the steam can comprise ammonium citrate. T... | 06/07/2005 |
| 6899592 | Polishing apparatus and dressing method for polishing tool In a polishing apparatus, a polishing tool including abrasive particles and a binder for bonding together the abrasive particles is pressed against a substrate to polish the substrate. The polishing apparatus has a light source for irradiating a polishing surface wi... | 05/31/2005 |
| 6899601 | Method and apparatus for conditioning a polishing pad A method and apparatus for conditioning a polishing pad is described. The method includes applying a stream of pressurized liquid to the polishing pad, and removing a significant amount of slurry and liquid from the polishing pad using a vacuum. The apparatus includ... | 05/31/2005 |
| 6899609 | CMP equipment for use in planarizing a semiconductor wafer Chemical mechanical polishing (CMP) equipment for use in planarizing a semiconductor wafer prevents slurry from being deposited on the surfaces of respective components of the equipment. The CMP equipment includes a turntable, a polishing pad mounted to the table so... | 05/31/2005 |
| 6896583 | Method and apparatus for conditioning a polishing pad A method (60) for conditioning a polishing pad (20) used for polishing semiconductor wafers (14). The degradation in conditioning performance of a conditioning device (28) is accounted for by controlling at least one of the conditioning v... | 05/24/2005 |
| 6896596 | Polishing pad ironing system An ironing assembly for use in chemical mechanical planarization (CMP) is provided. The ironing assembly is designed for use over a linear polishing pad which has a plurality of asperities and applied slurry. The ironing assembly includes an ironing disk having a co... | 05/24/2005 |
| 6893336 | Polishing pad conditioner and chemical-mechanical polishing apparatus having the same A polishing pad conditioner for a chemical-mechanical polishing apparatus includes a conditioning plate having a first recess and a holder having a second recess. The first recess is formed on the upper face of the conditioning plate, and the second recess is formed... | 05/17/2005 |
| 6890245 | Byproduct control in linear chemical mechanical planarization system In a method for controlling byproduct build-up on a polishing pad, a chemistry is introduced onto the top surface of the polishing pad in the presence of a source of kinetic energy. When the source of kinetic energy is a pressurized gas, the chemistry is sprayed ont... | 05/10/2005 |
| 6887132 | Slurry distributor for chemical mechanical polishing apparatus and method of using the same A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface... | 05/03/2005 |
| 6884155 | Diamond grid CMP pad dresser The present invention discloses a CMP pad dresser which has a plurality of uniformly spaced abrasive particles protruding therefrom. The abrasive particles are super hard materials, and are typically diamond, polycrystalline diamond (PCD), cubic boron nitride (cBN),... | 04/26/2005 |
| 6884151 | Method and apparatus for forming grooves on a workpiece and for dressing a grindstone used in the groove formation A grinding apparatus for grinding a spline ball groove on a workpiece comprises a rod-shaped grindstone, having a distal end portion with a curved surface corresponding to the groove to be ground, and a spindle mechanism for rotating the grindstone. The spindle mech... | 04/26/2005 |
| 6881129 | Fixed-abrasive chemical-mechanical planarization of titanium nitride Planarizing solutions, and their methods of use, for removing titanium nitride from the surface of a substrate using a fixed-abrasive planarizing pad. The planarizing solutions take the form of an etchant solution or an oxidizing solution. The etchant solutions are ... | 04/19/2005 |
| 6878045 | Ultrasonic conditioning device cleaner for chemical mechanical polishing systems A method and system for cleaning conditioning devices used in chemical mechanical polishing (CMP) systems is disclosed. The system includes a robotic arm for holding and transporting the conditioning device between the polish pad area of the machine and the conditio... | 04/12/2005 |
| 6875077 | Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modifi... | 04/05/2005 |
| 6875091 | Method and apparatus for conditioning a polishing pad with sonic energy A method and apparatus for conditioning a polishing pad is described, wherein the polishing pad has a polishing surface for polishing the semiconductor wafer. The method includes positioning a sonic energy generator above the polishing surface of the polishing pad, ... | 04/05/2005 |
| 6872127 | Polishing pad conditioning disks for chemical mechanical polisher The invention relates to disks for conditioning pads used in the chemical mechanical polishing of semiconductor wafers, and a method of fabricating the pads. In one embodiment, the conditioning pad includes multiple, pyramid-shaped, truncated protrusions which are c... | 03/29/2005 |
| 6872128 | System, method and apparatus for applying liquid to a CMP polishing pad A system and method of delivering a liquid to a CMP polishing pad includes supplying the liquid to a nozzle, the nozzle being oriented toward a polishing surface of the CMP polishing pad. The liquid flows at a rate of less than or equal to about 100 cc per minute. A... | 03/29/2005 |
| 6872132 | Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces Systems and methods for monitoring characteristics of a polishing pad used in polishing a micro-device workpiece are disclosed herein. In one embodiment, a method for monitoring a characteristic of a polishing pad includes applying ultrasonic energy to the polishing... | 03/29/2005 |
| 6869339 | Polishing pad and method of manufacture A method of joining sections of polishing pad for use in the chemical mechanical planarization of a semiconductor wafer. Two sections of polishing pad are positioned so that they contact one another. The two sections are then welded together to create a robust joint... | 03/22/2005 |
| 6869342 | Dressing of grinding tools for gear grinding A dressing apparatus (20) attached to a dressing pedestal (25) of a tooth flank grinding machine is maneuverable by means of an advancer device (27) from a dust proof position of rest aside of the dressing position into an optimum dressing posit... | 03/22/2005 |
| 6866566 | Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces Conditioning devices, systems and methods for conditioning a contact surface of a processing pad used in processing microelectronic workpieces. One embodiment of a conditioning device comprises an end-effector having a conditioning surface configured to engage the c... | 03/15/2005 |
| 6863597 | Chip collecting apparatus for tip dresser In a chip collecting apparatus for a tip dresser of the present invention, a chip pickup case mounted on a dresser main body is divided into an upper case and a lower case, and the lower end of an arm admission port formed in the upper case is opened downward. Durin... | 03/08/2005 |
| 6857942 | Apparatus and method for pre-conditioning a conditioning disc An apparatus and a method for off-line pre-conditioning a conditioning disc that is used in a chemical mechanical polishing process are provided. In the apparatus, an upper platform for mounting a conditioning disc thereto and a lower platform for mounting a polishi... | 02/22/2005 |
| 6852020 | Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has... | 02/08/2005 |
| 6852016 | End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces End effectors, apparatuses including end effectors for conditioning planarizing pads, and methods for manufacturing end effectors with contact elements to condition planarizing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, a... | 02/08/2005 |
| 6852004 | CMP machine dresser and method for detecting the dislodgement of diamonds from the same A CMP machine dresser. The dresser includes a substrate, a first conductive layer and a second conductive layer respectively disposed and isolated in the substrate, a plurality of diamonds mounted in the first conductive layer and the second conductive layer, and a ... | 02/08/2005 |
| 6848978 | METHOD OF FINISHING A BELT SEAM USING AN ABRASIVE FINISHING MACHINE, A METHOD OF FINISHING A BELT SEAM USING AN ABRASIVE FINISHING MACHINE HAVING A PLURALITY OF FINISHING HEADS, AND A METHOD OF FINISHING A BELT SEAM USING AN ABRASIVE FINISHING MACHINE HAVING FIRST, SECOND, THIRD AND FOURTH FINISHING HEADS An imageable belt includes a seam that is finished using an abrasive finishing machine. The seam comprises a seam width with adhesive material disposed thereon. The finishing process includes an abrasive finishing media with a finishing surface and a backer bar. The... | 02/01/2005 |
| 6840846 | Polishing station of a chemical mechanical polishing apparatus An apparatus for polishing a wafer includes a polishing station having a platen on which a polishing pad is installed, a polishing head having a membrane that contacts a surface of the wafer, the membrane securing the wafer and pressuring the wafer against the polis... | 01/11/2005 |
| 6840840 | Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the pla... | 01/11/2005 |
| 6837773 | Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates A method and apparatus for controlling a polishing characteristic of a polishing pad used in planarization of a substrate. The method preferably includes controlling the temperature of a planarizing surface of the polishing pad so that waste matter accumulations on ... | 01/04/2005 |
| 6835116 | Polishing apparatus A polishing apparatus for polishing a workpiece comprises a polishing table having a polishing surface and a top ring for holding the workpiece and pressing the workpiece against the polishing surface. The polishing table and the top ring are rotated independently o... | 12/28/2004 |
| 6832948 | Thermal preconditioning fixed abrasive articles The CMP removal rate of a fixed abrasive article is increased and wafer-to-wafer uniformity enhanced by thermal preconditioning. Embodiments include preconditioning a fixed abrasive article by heating with hot water to a temperature of about 90° C. to about 100° C... | 12/21/2004 |
| 6827639 | Polishing particles and a polishing agent In polishing particles each having a core-shell structure, a polishing rate can be controlled by adjusting a thickness and/or density of a shell portion. The polishing particles have the core-shell structure with an average diameter in the range from 5 to 300 nm, an... | 12/07/2004 |
| 6824451 | Process for the abrasive machining of surfaces, in particular of semiconductor wafers A process is described for the chemical mechanical machining of semiconductor wafers. A plurality of surfaces are successively subjected to a polishing step, in which they are brought into contact with a polishing device. The polishing device contains a polishing-gr... | 11/30/2004 |
| 6821190 | Static pad conditioner A chemical mechanical polishing apparatus includes a polishing pad. A pad conditioner includes a static conditioner head having a surface area configured to contact and condition the pad. The surface area has a first end proximate to an axis of rotation of the pad a... | 11/23/2004 |
| 6821189 | Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate The invention provides abrasive articles comprising: (a) a backing having a first major surface and a second major surface; and (b) an abrasive coating consisting essentially of: (i) a hardened binder coating having a first surface adhered to the flexible backing an... | 11/23/2004 |
| 6821188 | Diamond compact There is disclosed a method of abrading a product where a corrosive environment is experienced which includes the steps of using, as the abrading element, a composite diamond compact comprising a diamond compact bonded to a cemented carbide substrate, the diamond co... | 11/23/2004 |
| 6821187 | Method for chemical-mechanical polishing of a layer which is a substrate and is a metal selected from a platinum group The invention discloses a method for the chemical-mechanical polishing of layers composed of metals of the group of platinum metals, particularly iridium. In the CMP process, high erosion rates for iridium and a high selectivity relative to silicon oxide are achieve... | 11/23/2004 |
