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| Number | Title | Issue Date |
| 7410411 | Method of determining the number of active diamonds on a conditioning disk The invention relates to a method for determining the number of active diamonds on a conditioning disk. In particular, the method comprises (a) contacting a diamond conditioner disk with a hard surface, wherein the diamond-containing side of the diamond conditioning... | 08/12/2008 |
| 7393261 | Cylindrical grinding method for producing hard metal tools and cylindrical grinding machine for grinding cylindrical starting bodies during the production of hard metal tools The invention relates to a grinding method and to a cylindrical grinding machine, in which a sintered hard metal round rod is completely pushed through a chuck of a workpiece spindle head, said chuck having chuck jaws. Two backrest seats are ground on the freely pro... | 07/01/2008 |
| 7370659 | Photolithographic stepper and/or scanner machines including cleaning devices and methods of cleaning photolithographic stepper and/or scanner machines Stepper and/or scanner machines including cleaning devices and methods for cleaning stepper and/or scanner machines are disclosed herein. In one embodiment, a stepper and/or scanner machine includes a housing, an illuminator, a lens, a workpiece support, a cleaning ... | 05/13/2008 |
| 7371152 | Non-uniform subaperture polishing A method for subaperture polishing includes determining a first portion of a sample to be polished disproportionately compared to a second portion of the sample. Based on the determination of the first portion, a sweep frequency that is a first rate of lateral motio... | 05/13/2008 |
| 7371155 | Glass substrate for information recording medium and method for producing same A glass substrate for an information recording medium is manufactured by polishing the surface of a raw material glass plate. The polishing of the raw material glass plate is divided into a step for performing a first polishing process to roughly polish the surface ... | 05/13/2008 |
| 7371156 | Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system An off-line tool for breaking in pad conditioning disks used in a chemical mechanical polishing (CMP) system. The off-line tool comprises a platen having a first surface for holding a polishing pad and a motor for rotating the polishing pad. The motor is coupled to ... | 05/13/2008 |
| 7367866 | Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the pivotable load/unload cups a... | 05/06/2008 |
| 7367875 | CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same The present invention relates to a composite material and the method of making same, which comprises a CVD diamond coating applied to a composite substrate of ceramic material and an unreacted carbide-forming material of various configurations and for a variety of a... | 05/06/2008 |
| 7367872 | Conditioner disk for use in chemical mechanical polishing A conditioner disk for use on a polish pad in chemical mechanical polishing process includes a base structure a plurality of curved blades supported by the base structure. The blades radiate outwardly from a center region of the base structure and curve in a common ... | 05/06/2008 |
| 7364502 | Cutting wheel The present invention relates to an improved cutting wheel, comprising a disk-shaped abrasive body having two opposite faces and a non-uniform thickness. ... | 04/29/2008 |
| 7354333 | Detection of diamond contamination in polishing pad Methods for reconditioning a polishing pad and detecting diamond contamination of the polishing pad, are disclosed. In particular, the methods include the step of exposing the reconditioned polishing pad to an energy source to induce the diamond contamination to flu... | 04/08/2008 |
| 7354337 | Pad conditioner, pad conditioning method, and polishing apparatus The present invention provides: a pad conditioner for dressing a surface of a polishing pad which is used in a polishing apparatus for polishing works, comprising a bending or deflecting or elastic member and a supporting section to support a base end of the bending... | 04/08/2008 |
| 7348276 | Fabrication process of semiconductor device and polishing method A method of fabricating a semiconductor device includes a polishing process of a substrate, wherein the polishing process includes the steps of applying a chemical mechanical polishing process to the substrate on a polishing pad while using slurry, and conditions a ... | 03/25/2008 |
| 7341501 | Gear grinding machine, method for dressing threaded grinding wheel and method for grinding work A gear grinding machine, a method for dressing a threaded grinding wheel, and a method for grinding a work are disclosed. A dressing tool is rotated in a vertical plane, with its position being fixed. The position of a threaded grinding wheel is NC-controlled, where... | 03/11/2008 |
| 7341502 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular... | 03/11/2008 |
| 7331845 | Double end face truing device, double end face truing tool, and double end face truing method First and second end surface truing sections are formed by protruding cylindrical first and second base bodies from opposite end surfaces of a disc-like base of an opposite end surface truing tool in the axial direction thereof and by providing on the external surfa... | 02/19/2008 |
| 7322879 | Reprofiling device for the rails of railroads that captures waste A device for the continuous reprofiling of the rails of railroads includes at least one abrasive rail reprofiling unit (2) guided along the railroad tracks and comprising at least one abrasive disk (3) that can be pressed against a rail (1). Thi... | 01/29/2008 |
| 7316603 | Compositions and methods for tantalum CMP A composition suitable for tantalum chemical-mechanical polishing (CMP) comprises an abrasive, an organic oxidizer, and a liquid carrier therefor. The organic oxidizer has a standard redox potential (E0) of not more than about 0.5 V relative to a standard... | 01/08/2008 |
| 7306510 | Method of adhering polishing pads and jig for adhering the same The method of adhering polishing pads is capable of easily exchanging polishing pads in a comfortable posture. The method comprises the steps of: setting a pad adhering carrier, which has a through-hole in which a roller unit for pressing polishing pads is fixed, in... | 12/11/2007 |
| 7306506 | In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging Chemical-mechanical planarization (CMP) apparatus and methods for detecting polishing pad properties using ultrasonic imaging is presented. An ultrasonic probe assembly transmits ultrasonic signals onto the surface of a polishing pad during a CMP process. Reflected ... | 12/11/2007 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7299533 | Process for lapping ring and pinion gears A method for processing a gear set through a lapping operation that includes: providing a lapping machine tool having a first spindle and a second spindle, the second spindle being rotatable about an axis that is generally perpendicular to a rotational axis of the f... | 11/27/2007 |
| 7300521 | Wall scrubber for blown insulation An insulation system comprising: a supply of material having discrete elements; an applicator assembly for installation of the material having discrete elements to a surface; and a scrubber for finishing the face of the material, the scrubber including: (a) a vacuum... | 11/27/2007 |
| 7300338 | CMP diamond conditioning disk A method of making and the resulting non-metallic CMP conditioning pad comprising a non-metallic substrate and a single layer of abrasive particles bonded to the substrate by a non-metallic bonding medium. Preferred substrates include aluminum oxide and graphite. A ... | 11/27/2007 |
| 7294046 | Method for dressing a grinding worm A method for dressing an essentially cylindrical grinding worm on a machine suitable for continuous generation grinding in the diagonal method. The dressing tool is an essentially cylindrical gear wheel, having an abrasive coating on the surface that effects the dre... | 11/13/2007 |
| 7294043 | CMP apparatus and process sequence method A CMP apparatus and process sequence. The CMP apparatus includes multiple polishing pads or belts and an in-line metrology tool which is interposed between adjacent polishing pads or belts in the apparatus. A material layer on each of multiple wafers is successively... | 11/13/2007 |
| 7291055 | Wafer polishing method and apparatus The present invention provides a wafer polishing method and a polishing apparatus which are capable of preventing peripheral sags of a wafer due to polishing and then manufacturing the wafer, especially an SOI wafer at a high flatness level. There is provided a wafe... | 11/06/2007 |
| 7291057 | Apparatus for polishing a substrate A method of polishing substrates enables the size of a polishing table to be reduced. A surface of a substrate to be polished is brought into contact with a polishing surface of a polishing table in such a manner that a portion of the surface of the substrate extend... | 11/06/2007 |
| 7291063 | Polyurethane urea polishing pad The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least par... | 11/06/2007 |
| 7288021 | Chemical-mechanical polishing of metals in an oxidized form The invention provides a method for polishing a substrate comprising a metal in an oxidized form, the method comprising the steps of: (a) providing a substrate comprising a metal in an oxidized form, (b) contacting a portion of the substrate with a chemical-mechanic... | 10/30/2007 |
| 7288165 | Pad conditioning head for CMP process In a first aspect, a first apparatus is provided for a chemical mechanical polishing (CMP) process. The first apparatus includes (1) a rotatable member; (2) an end effector adapted to receive and retain a conditioning disk; and (3) an elastic device disposed between... | 10/30/2007 |
| 7285039 | Tools for polishing and associated methods Methods for making polishing tools and associated tools are disclosed. In one aspect, a method of making a polishing tool is provided. Such a method may include truing a working surface of a nano-diamond impregnated substrate. The method may further include forming ... | 10/23/2007 |
| 7278905 | Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The con... | 10/09/2007 |
| 7278907 | Method of adhering polishing pads and jig for adhering the same The method of adhering polishing pads is capable of easily adhering the polishing pads without damages. The method comprises the steps of: tentatively adhering the polishing pads to polishing plates; attaching a roller unit having a shaft and a roller member, which ... | 10/09/2007 |
| 7276446 | Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Planarizing solutions, planarizing machines and methods for planarizing microelectronic-device substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. In one aspect of the invention, a microelectronic-device substrate assembly is plan... | 10/02/2007 |
| 7273411 | Polishing apparatus A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The con... | 09/25/2007 |
| 7270303 | Pincer apparatus for nanosat transport across a satellite A pincer system is comprised of an array of pincers. Each pincer includes an inner disk having legs that are pushed downwards onto a pliable material to cause protuberances, while an outer disk is rotated to simultaneously squeeze the extruded material between its l... | 09/18/2007 |
| 7270597 | Method and system for chemical mechanical polishing pad cleaning In one embodiment, a method for cleaning a chemical mechanical polishing (CMP) pad is provided. The CMP pad surface has a residue thereon. Chemicals are applied onto the surface of the CMP pad and the pad surface is rinsed so as to substantially remove by-product pr... | 09/18/2007 |
| 7267600 | Polishing apparatus Apparatus for polishing are provided. An apparatus comprises a fluid controller, a polishing apparatus and a fluid interface membrane. The fluid controller is fluidly coupled to the polishing apparatus by way of at least one conduit. The fluid interface membrane is ... | 09/11/2007 |
| 7267608 | Method and apparatus for conditioning a chemical-mechanical polishing pad A conditioner including abrasive elements for conditioning a polishing pad to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes. The abrasive elements are formed from... | 09/11/2007 |
