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| Number | Title | Issue Date |
| 6716090 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Apparatuses and methods for planarizing a microelectronic-device substrate assembly on a planarizing pad. In one aspect of the invention, material is removed from the substrate assembly by pressing the substrate assembly against a planarizing surface of a planarizin... | 04/06/2004 |
| 6716089 | Method for controlling pH during planarization and cleaning of microelectronic substrates A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a p... | 04/06/2004 |
| 6712676 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Apparatuses and methods for planarizing a microelectronic-device substrate assembly on a planarizing pad. In one aspect of the invention, material is removed from the substrate assembly by pressing the substrate assembly against a planarizing surface of a planarizin... | 03/30/2004 |
| 6705929 | Cloth cleaning device and polishing machine Cloth cleaning device of a polishing machine which is capable of fully cleaning a polishing cloth including a part in the vicinity of a center roller. The cloth cleaning device includes an arm movable in a plane parallel to the polishing cloth between a first positi... | 03/16/2004 |
| 6702654 | Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof The present invention provides an improved conditioning wheel for conditioning polishing pads used to polish semiconductor wafers. In one embodiment, the conditioning wheel includes a planar body having a metal surface located thereon. The metal surface h... | 03/09/2004 |
| 6702646 | Method and apparatus for monitoring polishing plate condition An apparatus for monitoring a condition of a polishing plate, in particular for detecting the time for the polishing plate to be reconditioned or replaced, comprising a measuring unit containing at least one sensing unit and a signal-conditioning unit; an... | 03/09/2004 |
| 6702651 | Method and apparatus for conditioning a polishing pad A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers a... | 03/09/2004 |
| 6699107 | Polishing head and apparatus with an improved pad conditioner for chemical mechanical polishing A polishing head and an apparatus for the chemical mechanical polishing (CMP) of a substrate are provided in which a conditioning surface is integrated in or directly coupled to the polishing head so that a simplified structure of the CMP apparatus can be... | 03/02/2004 |
| 6699106 | Conditioner for polishing pad and method for manufacturing the same A conditioner for polishing pad and a method for manufacturing the same are disclosed. The conditioner includes a substrate having formed with a plurality of geometrical protrusions of an uniformed height on at least one of its sides, and a cutting portio... | 03/02/2004 |
| 6699105 | Method and apparatus for cutting and grinding single crystal SiC The present invention comprises a metal bond grind stone having a flat plate portion 10a and a tapered portion 10b; an electrode 13 opposed to the metal bond grind stone with a gap therebetween; voltage applying means 12 for applying a direct-current puls... | 03/02/2004 |
| 6695684 | Chemical mechanical polishing apparatus having a cleaner for cleaning a conditioning disc and method of conditioning a polishing pad of the apparatus A chemical mechanical polishing apparatus includes a polishing pad on which a wafer requiring planarization is placed, a conditioning disc having an abrasive surface for conditioning the polishing pad, a tank containing de-ionized water in which the condi... | 02/24/2004 |
| 6695680 | Polishing pad conditioner for semiconductor polishing apparatus and method of monitoring the same The operation of a polishing pad conditioner for a CMP apparatus is monitored. The polishing pad conditioner includes a housing, a first drive pulley disposed in the housing and connected to a motor at a first side of the housing, a conditioning head havi... | 02/24/2004 |
| 6688947 | Porous, lubricated nozzle for abrasive fluid suspension jet A nozzle apparatus for use with an abrasive fluid jet cutting system, and its method of construction and operation, are disclosed that reduce the wear and erosion problems typically experienced in the cutting jet's nozzle. This improved nozzle apparatus c... | 02/10/2004 |
| 6682404 | Method for controlling a temperature of a polishing pad used in planarizing substrates A method for controlling a polishing characteristic of a polishing pad used in the planarization of a substrate is disclosed. The method includes controlling the temperature of a planarizing surface of the polishing pad so that waste matter accumulations ... | 01/27/2004 |
| 6682405 | Polishing apparatus having a dresser and dresser adjusting method The polishing particle surface of the dresser of a chemical mechanical polishing apparatus used for a planarization process in manufacturing semiconductor devices is inclined. Moreover, the pressure to be applied onto the polishing surface of the dresser ... | 01/27/2004 |
| 6682406 | Abrasive cleaning tool for removing contamination A cleaning tool for simultaneously abrading a contaminated surface and collecting contaminating particles and a method for using the same is provided the cleaning tool including an abrasive member including an abrasive surface said abrasive surface includ... | 01/27/2004 |
| 6679763 | Apparatus and method for qualifying a chemical mechanical planarization process A method and apparatus for qualifying a polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes at least one qualifying member including at least one collimated hole structure, wherein the colli... | 01/20/2004 |
| 6676493 | Integrated planarization and clean wafer processing system A wafer processing module is provided. In one example, the wafer processing module includes a sub-aperture CMP processing system and a pad exchange system including a pad magazine for storing CMP processing pads and a pad exchange robot for transferring C... | 01/13/2004 |
| 6672945 | Polishing apparatus and dressing method A abstract polishing apparatus has a substrate carrier a substrate and an abrasive member having a polishing surface. The surface is slidingly engaged with the substrate in order to effect polishing. The dressing device includes a light source when genera... | 01/06/2004 |
| 6672946 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Apparatuses and methods for planarizing a microelectronic-device substrate assembly on a planarizing pad. In one aspect of the invention, material is removed from the substrate assembly by pressing the substrate assembly against a planarizing surface of a... | 01/06/2004 |
| 6672949 | Polishing apparatus A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishi... | 01/06/2004 |
| 6669538 | Pad cleaning for a CMP system The present invention generally provides a system and apparatus for cleaning a polishing pad, such as a fixed abrasive pad, in a substrate processing system. In one embodiment, the system includes one or more nozzles which spray a fluid at pressures of ab... | 12/30/2003 |
| 6666754 | Method and apparatus for determining CMP pad conditioner effectiveness A method includes supplying a signal to rotationally drive a conditioning wheel of a conditioning tool. A polishing pad of a polishing tool is conditioned using the rotationally driven conditioning wheel. Changes in the signal driving the conditioning whe... | 12/23/2003 |
| 6666755 | Belt wiper for a chemical mechanical planarization system A belt wiper that can be used in a linear belt-type chemical mechanical planarization (CMP) system to maintain a belt pad is provided. The belt wiper mitigates disturbances within a detection region important to a belt pad steering system. Also, the belt ... | 12/23/2003 |
| 6659849 | Platen with debris control for chemical mechanical planarization Generally, a method and apparatus for cleaning a backside of a web of polishing material. In one embodiment, the apparatus includes a platen having a support surface adapted to support the backside the web and a web cleaner disposed on the platen and adja... | 12/09/2003 |
| 6656019 | Grooved polishing pads and methods of use Grooves are formed in a CMP pad by positioning the pad on a supporting surface with a working surface of the pad in spaced relation opposite to a router bit and at least one projecting stop member adjacent to the router bit, an outer end portion of the bi... | 12/02/2003 |
| 6656025 | Integrated pad and belt for chemical mechanical polishing An integrated pad and belt for polishing a surface comprising a belt integrated with a polishing pad that forms a seamless polishing surface.... | 12/02/2003 |
| 6652364 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Apparatuses and methods for planarizing a microelectronic-device substrate assembly on a planarizing pad. In one aspect of the invention, material is removed from the substrate assembly by pressing the substrate assembly against a planarizing surface of a... | 11/25/2003 |
| 6652365 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Apparatuses and methods for planarizing a microelectronic-device substrate assembly on a planarizing pad. In one aspect of the invention, material is removed from the substrate assembly by pressing the substrate assembly against a planarizing surface of a... | 11/25/2003 |
| 6652764 | Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates Methods and apparatuses for planarizing a microelectronic substrate. In one embodiment, a planarizing pad for mechanical or chemical-mechanical planarization includes a base section and a plurality of embedded sections. The base section has a planarizing ... | 11/25/2003 |
| 6648731 | Polishing pad conditioning apparatus in chemical mechanical polishing apparatus A polishing pad conditioning apparatus in a chemical mechanical polishing apparatus, wherein the conditioning apparatus includes a conditioning plate which maintains a predetermined relative velocity with respect to the polishing pad, extends from a cente... | 11/18/2003 |
| 6648736 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Apparatuses and methods for planarizing a microelectronic-device substrate assembly on a planarizing pad. In one aspect of the invention, material is removed from the substrate assembly by pressing the substrate assembly against a planarizing surface of a... | 11/18/2003 |
| 6645052 | Method and apparatus for controlling CMP pad surface finish A method and apparatus for pre-conditioning a polishing pad for use in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a pre-conditioning member having a smooth surface. The method includes providing a pre-co... | 11/11/2003 |
| 6645053 | Polishing apparatus A polishing apparatus has a turntable with a polishing cloth attached thereto and a top ring for holding and pressing a workpiece to be polished against the polishing cloth under a certain pressure. The polishing apparatus also has a first dressing unit h... | 11/11/2003 |
| 6645056 | Self-forming tooling for an orbital polishing machine and method for producing the same A method for producing, from a blank, restrictive tooling for use in an orbital polishing machine involves urging one of either the workpiece or the blank along a predetermined path against the other to physically impart a proportioned contour of the work... | 11/11/2003 |
| 6645046 | Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers A method and apparatus for conditioning a polishing pad are described. The method includes steps of providing a chemical mechanical polishing apparatus having a polishing region and a conditioning region; cycling a polishing member through the apparatus; ... | 11/11/2003 |
| 6641471 | Polishing pad having an advantageous micro-texture and methods relating thereto A statistically uniform micro-texture on a polishing pad surface improves break-in preconditioning time, and is measured by: Land Surface Roughness, Ra, from about 0.01 μm to about 25 μm; Average Peak to Valley Roughness, Rtm, from about 2 μm to about 40... | 11/04/2003 |
| 6638148 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Apparatuses and methods for planarizing a mnicroelectronic-device substrate assembly on a planarizing pad. In one aspect of the invention, material is removed from the substrate assembly by pressing the substrate assembly against a planarizing surface of ... | 10/28/2003 |
| 6634934 | Method for cleaning polishing tool, polishing method polishing apparatus A method for cleaning a polishing tool capable of reliably removing deposited solidified abrasive and impurities and thereby capable of suppressing scratching of a polished object and reducing residual particles on the polished face of the polished object... | 10/21/2003 |
| 6626743 | Method and apparatus for conditioning a polishing pad A method and apparatus for conditioning a polishing pad is described. The method includes applying a stream of pressurized liquid to the polishing pad, and removing a significant amount of slurry and liquid from the polishing pad using a vacuum. The appar... | 09/30/2003 |
