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| Number | Title | Issue Date |
| 7357703 | Chemical mechanical polishing pad and chemical mechanical polishing method A chemical mechanical polishing pad of the present invention has the following two groups of grooves on the polishing surface: (i) a group of first grooves intersect a single virtual straight line extending from the center toward the periphery of the polishing surfa... | 04/15/2008 |
| 7357698 | Polishing pad and chemical mechanical polishing apparatus using the same A polishing pad for chemically mechanically polishing a semiconductor wafer comprises a first groove pattern circularly formed on the surface of the polishing pad, and a second groove pattern formed on the surface of the polishing pad while spirally extending from t... | 04/15/2008 |
| 7354527 | Chemical mechanical polishing pad and chemical mechanical polishing process A chemical mechanical polishing pad which has a storage elastic modulus E′(30° C.) at 30° C. of 120 MPa or less and an (E′(30° C.)/E′(60° C.)) ratio of the storage elastic modulus E′(30° C.) at 30° C. to the storage elastic modulus E′(60° C.) at 60Â... | 04/08/2008 |
| 7331847 | Vibration damping in chemical mechanical polishing system A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retain... | 02/19/2008 |
| 7300340 | CMP pad having overlaid constant area spiral grooves A circular chemical mechanical polishing pad that includes a polishing surface having a concentrically located origin. The polishing surface includes groove sets each containing grooves arranged in a pattern in which ones of the grooves in one groove set cross ones ... | 11/27/2007 |
| 7270595 | Polishing pad with oscillating path groove network A polishing pad (20) for polishing a wafer (32) or other article, the pad having a groove network (60) configured to increase the residence time polishing medium (46) on the pad. The groove network has a first portion (72) that may... | 09/18/2007 |
| 7252582 | Optimized grooving structure for a CMP polishing pad A polishing pad for a chemical mechanical polishing has a body rotatable in a predetermined direction and having a working surface, the working surface being provided with grooves, the grooves being formed so that over the course of a single revolution of the pad sa... | 08/07/2007 |
| 7214124 | Equipment and method for polishing both sides of a rectangular substrate Double-sided polishing equipment configured to polish a rectangular substrate, comprising a carrier having a pocket configured to accommodate a rectangular substrate, a lateral linear moving mechanism configured to move the carrier, first and second polishing pads w... | 05/08/2007 |
| 7195553 | Grinding module A grinding module for a rotating grinding brush includes an elongate body part, at least one abrasive cloth extending from the body part, and a plurality of bristles projecting from the body part essentially in the same direction as the abrasive cloth, the abrasive ... | 03/27/2007 |
| 7192336 | Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a selected energy without exposing a second portion of the material to... | 03/20/2007 |
| 7182668 | Methods for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table... | 02/27/2007 |
| 7140955 | Polishing apparatus A polishing apparatus includes a plurality of polishing fluid supply openings terminating in a polishing surface of a polishing table, and a plurality of grooves which are formed in the polishing surface and arranged so as not to be in direct communication with the ... | 11/28/2006 |
| 7125318 | Polishing pad having a groove arrangement for reducing slurry consumption A polishing pad (200) that includes a polishing layer (204) having a polishing region (208) for polishing a wafer (220). The polishing layer includes a set of inflow grooves (232) that extend into the polishing region and a set of ... | 10/24/2006 |
| 7112125 | Polishing cloth, polishing apparatus and method of manufacturing semiconductor devices There is disclosed a polishing cloth having an abrasive layer containing a polymer material which is a hydrolyzable with an aqueous medium and being capable of exhibiting a stable polishing performance for a relatively long period of time without necessitating a dre... | 09/26/2006 |
| 7063608 | Grinding wheel having core body coated with impermeable coating A grinding wheel including: (a) an annular core body which includes a multiplicity of aggregate particles and a resin bond that holds said aggregate particles together; (b) an abrasive layer which is disposed radially outwardly of said annular core body and which in... | 06/20/2006 |
| 7018581 | Method of forming a polishing pad with reduced stress window The present invention provides a chemical mechanical polishing pad having reduced stress windows. In addition, the present invention provides a method of forming a chemical mechanical polishing pad, the method comprising, primary annealing a window separate from a p... | 03/28/2006 |
| 6986706 | Polishing pad and method of producing the same A polishing pad has a working layer provided with an abrasive powder, an attaching layer for attaching a pad to a polishing head of a power tool, and a connection layer which connects the working layer with the attaching layer, the connection layer being located bet... | 01/17/2006 |
| 6974364 | Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table... | 12/13/2005 |
| 6964598 | Polishing apparatus and method for forming an integrated circuit In one embodiment, a semiconductor substrate (38) is uniformly polished using a polishing pad (16) that has a first polishing region (26), a second polishing region (28), and a third polishing region (30). The semiconductor substra... | 11/15/2005 |
| 6955587 | Grooved polishing pad and method A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) having a polishing region (164, 320, 420, 504) defined by first and second boundaries ((168, 17... | 10/18/2005 |
| 6935929 | Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces Polishing machines and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces are disclosed herein. In one embodiment, a machine includes a table having a support surface, an under-pad carried by the support surface, and a workpiece c... | 08/30/2005 |
| 6860802 | Polishing pads for chemical mechanical planarization An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron... | 03/01/2005 |
| 6824455 | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings. ... | 11/30/2004 |
| 6824459 | Gold jewelry lapping machine with shroud A lapping machine operable with a lap wheel for lapping gold jewelry and adapted to collect gold dust produced by the lapping machine, includes: (a) a base, (b) an electric motor mounted to the base, the electric motor having a rotatable output shaft extending upwar... | 11/30/2004 |
| 6802761 | Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication A lapping plate has photolithographically defined patterns that are electroplated to produce lands with well-defined channels. By choosing a particular geometry, the retention force is significantly reduced over prior art options, while still retaining a high land a... | 10/12/2004 |
| 6800019 | Abrasive cloth and polishing method An abrasive ground fabric which is a composite ground fabric comprising a fiber substrate and a elastic polymer filled in the fiber substrate, wherein (1) the fiber substrate is composed of bundles, each consisting of 20 to 3,000 fine fibers, and (2) the average dia... | 10/05/2004 |
| 6783436 | Polishing pad with optimized grooves and method of forming same A polishing pad useful for chemical mechanical planarization has a polishing layer for planarizing substrates. The polishing layer comprises a radius that extends from a center of the polishing layer to an outer perimeter of the polishing layer; one or more continuo... | 08/31/2004 |
| 6761746 | Sanding disc A sanding disc particularly useful for smoothing drywall. The sanding disc includes a circular abrasive disc having an abrasive surface, and a circular foam disc smaller in diameter than the abrasive disc which is co-axially adhered to the surface of the abrasive di... | 07/13/2004 |
| 6752693 | Afferent-based polishing media for chemical mechanical planarization One polishing media for chemical mechanical planarization includes an underlayer and a plurality of pressure sensors provided on the underlayer. At least some of the pressure sensors have a pad asperity provided thereon. The pressure sensors may be micro electromech... | 06/22/2004 |
| 6739963 | Disk for grinding concrete Of the type designed to be attached to the propeller-shaped bases or heads of a concrete grinder, to enhance the grinding effect of said propeller-shaped bases after the latter are used without disks, it is shaped like a cross, with four equal arms which are equiang... | 05/25/2004 |
| 6726534 | Preequilibrium polishing method and system The invention provides a polishing system that comprises a liquid carrier, an alkali metal ion, hydroxide ions, and a polishing pad and/or an abrasive. The abrasive can be dispersed in the liquid carrier of the polishing system or bound to the polishing pad. The alk... | 04/27/2004 |
| 6722950 | Method and apparatus for electrodialytic chemical mechanical polishing and deposition Embodiments of the invention include methods and apparatus for electrodialytic polishing of various layers formed on semiconductor substrates. In certain embodiments the use of electrodialytic processes in conjunction with chemical mechanical forces to achieve a cop... | 04/20/2004 |
| 6712683 | Backing plate for abrasive flap wheels A backing plate for an abrasive flap wheel has a sunk inner part and an outer flange. The sunk inner part has a hub which is provided with a location hole having an internal thread. The internal thread serves to fasten the backing wheel to the threaded shaft of a dr... | 03/30/2004 |
| 6705935 | Abrasive molding and abrasive disc provided with same An abrasive molding composed of a mass of inorganic particles, said mass having pores intervening among the inorganic particles, which molding has abrasive area to be placed in frictional contact with an article to be abraded, and non-abrasive area on a abrading sur... | 03/16/2004 |
| 6699104 | Elimination of trapped air under polishing pads A polishing pad includes a polishing layer and an adhesive layer. An adhesive bottom surface of the adhesive layer has an air transmitting pathway to collect air that is expelled from under the adhesive bottom surface, which avoids entrapment of air under... | 03/02/2004 |
| 6699115 | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.... | 03/02/2004 |
| 6692343 | Superabrasive wheel for mirror finishing A superabrasive wheel (100, 200) for mirror finishing includes an annular base plate (120, 220) having an annular end surface (121, 221) and a plurality of superabrasive members (110, 210), each having a peripheral end surface (111), arranged along the pe... | 02/17/2004 |
| 6685539 | Processing tool, method of producing tool, processing method and processing apparatus A processing tool is used to carry out a fixed-abrasive grinding process on a surface of a silicon work-piece. The processing tool includes abrasive grains made up silica grains. A primary average grain size of the silica grains is desirably 0.8 nm to 10 ... | 02/03/2004 |
| 6663480 | Polishing pad for semiconductor and optical parts, and method for manufacturing the same The present invention relates to a polishing pad for the chemical mechanical polishing (CMP). According to the present invention, there is provided a chemical mechanical polishing pad for polishing a semiconductor wafer with chemicals containing predeterm... | 12/16/2003 |
| 6645061 | Polishing pad having a grooved pattern for use in chemical mechanical polishing A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.... | 11/11/2003 |
