Did You Know...
...that Charles Goodyear performed some of his experiments on rubber while in debtor's prison? He was there so often he referred to it as his "hotel". Chronically in debt because of poor business sense and ill health, Goodyear depended on the generosity of friends and family. Even after he unlocked the secret to vulcanizing rubber, he was unable to improve his financial situation. When he died, his estate was $200,000 in debt.
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| Number | Title | Issue Date |
| 7435607 | Method of wafer laser processing using a gas permeable protective tape A laser processing method for forming a deteriorated layer, which has been once molten and then re-solidified, in the inside of a wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along a dividing line formed on the wafer, compri... | 10/14/2008 |
| 7255896 | Producing method for die coater and coating apparatus A method of producing a die coater structured with at least two bars so as to form a pocket section to extend a coating liquid in a coating width direction, a coating liquid supply port to supply a coating liquid to the pocket section, and a slit section to discharg... | 08/14/2007 |
| 7232363 | Polishing solution retainer A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing... | 06/19/2007 |
| 7144303 | Method of polishing a large part and abrasive for use in the method A surface to be polished of a large part is polished by projecting and colliding an abrasive comprising abrasive grains and an elastic petrochemical high polymer material having the specific gravity of 0.5 to 1.8 g/cm3 and elasticity of 10 to 200 ckg/cm | 12/05/2006 |
| 7134942 | Wafer processing method A wafer processing method for dividing a wafer having optical devices that are formed in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, along the dividing lines, which comprises a laser beam application step of app... | 11/14/2006 |
| 7134943 | Wafer processing method A wafer processing method for dividing a wafer having optical devices that are formed in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, along the dividing lines, comprising a laser beam application step of applying... | 11/14/2006 |
| 7131185 | Method of manufacturing magnetic recording medium A method for manufacturing a magnetic recording medium, including the steps of applying a magnetic coating containing ferromagnetic powder and a binder onto a nonmagnetic band-shaped flexible base material to be transferred to form a magnetic layer, and grinding the... | 11/07/2006 |
| 7096561 | Separator plate for wet-type multiplate clutch and wet-type multiplate clutch provided with such separator plates A separator plate useful in a wet-type multiplate clutch is provided on a friction surface thereof with elongated asperities extending with regularity in a predetermined direction. Peak portions of the elongated asperities, said peak portions being to project toward... | 08/29/2006 |
| 6966820 | High quality optically polished aluminum mirror and process for producing A new technical advancement in the field of precision aluminum optics permits high quality optical polishing of aluminum monolith, which, in the field of optics, offers numerous benefits because of its machinability, lightweight, and low cost. This invention combine... | 11/22/2005 |
| 6908362 | Reel-to-reel substrate tape polishing system Disclosed is a reel-to-reel single-pass mechanical polishing system (100) suitable for polishing long lengths of metal substrate tape (124) used in the manufacture of high-temperature superconductor (HTS) coated tape, including multiple instantiations ... | 06/21/2005 |
| 6869338 | Method of surface-treating reactor member and method of manufacturing reactor member by using the surface treatment method A method of surface-treating a reactor member for effectively removing a Cr-deficient layer and a work-hardened layer considered to be a cause of stress-corrosion cracking (SCC) under low-stress conditions. The method of surface-treating a reactor member which is wo... | 03/22/2005 |
| 6859984 | Method for providing a matrix array ultrasonic transducer with an integrated interconnection means A method is provided for producing a matrix array ultrasonic transducer having an integrated interconnection assembly. A piezoelectric member, formed by a plurality of individual elemental transducers arranged in M×N matrix configuration, is provided and an interco... | 03/01/2005 |
| 6855033 | Fixture for clamping a gas turbine component blank and its use in shaping the gas turbine component blank A gas turbine component blank is shaped by clamping the gas turbine component blank into a fixture that accurately positions the gas turbine component blank in three dimensions. The positioning is accomplished against stops accurately machined into a base of the fix... | 02/15/2005 |
| 6827634 | Ultra fine particle film forming method and apparatus A ultra fine particle film forming apparatus is provided which is capable of forming a ultra fine particle film which has ultra fine particles sufficiently bonded together, sufficient density, flat surface and uniform density. A planarized ultra fine particle film f... | 12/07/2004 |
| 6786804 | Siding board for clapboard boarding and a clapboard boarding structure Siding boards for clapboard boarding are used in a clapboard boarding structure in which lower side portions of upper siding boards are overlapped frontward of upper side portions of lower siding boards for installing a plurality of siding boards to a framework of a... | 09/07/2004 |
| 6767275 | Machining apparatus for workpiece and method therefor To provide an apparatus that may impart a complicated bend deformation to an object to be machined such as a ceramic bar elongated in one direction or the like, and may reduce the non-uniformity in machining amount of the object to be machined upon the machining wor... | 07/27/2004 |
| 6709321 | Processing jig A jig comprises: a main body; a retainer for retaining a block in which at least one row of sections to be sliders is aligned; a middle load application section coupled to a portion of the retainer located in the middle of the length thereof; end load application se... | 03/23/2004 |
| 6623336 | Magnetic head polishing device and method thereof When electric elements are formed on a ceramic bar or the like, the positional displacement of the respective elements occurs due to a division exposing process or the like. An object of the present invention is to provide a device and a method which unif... | 09/23/2003 |
| 6599170 | Method and apparatus for polishing, and lapping jig Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape... | 07/29/2003 |
| 6596150 | Production method for an aluminum support for a lithographic printing plate Disclosed is a production method of an aluminum support for a lithographic printing plate, capable of stable and low-cost production of an aluminum support for a lithographic printing plate, the support being scarcely subject to generation of treatment un... | 07/22/2003 |
| 6571444 | Method of manufacturing an ultrasonic transducer A method is provided for making an ultrasonic transducer particularly useful in medical imaging. The transducer includes a transducer body having a major front surface for radiating ultrasonic energy to a propagation medium and is formed by a piezoelectri... | 06/03/2003 |
| 6565414 | Polishing apparatus for magnetic head and method therefor In the polishing work for forming a crown shape on a ceramic bar bearing a plurality of conversion units for the magnetic heads, the present invention is to provide a well-controlled satisfactory shape by pressing the ceramic bar, provided with plural gro... | 05/20/2003 |
| 6533647 | Method for controlling a selected temperature of a planarizing surface of a polish pad. A method for controlling a polishing characteristic of a polishing pad used in planarization of a substrate. The method preferably includes controlling the temperature of a planarizing surface of the polishing pad so that waste matter accumulations on the... | 03/18/2003 |
| 6527623 | Method of treating a surface with hard particles using free running rollers A method of treating a surface of a component formed from a base material is described. The method comprises the steps of bringing the surface into proximity with free running rollers, the surface being moved relative to the free running rollers with a co... | 03/04/2003 |
| 6488572 | Method and apparatus for removing marine organisms from a submerged substrate A method and apparatus for removing marine fouling from underwater substrates such as ships' hulls (10). The method is characterized by the steps of first subjecting marine organisms such as barnacles to an electrical field of sufficent intensity to degra... | 12/03/2002 |
| 6447367 | Processing jig A processing jig comprises: a main body to be fixed to a processing apparatus; a retainer that is long in one direction for retaining a bar as an object long in one direction; four couplers for coupling the retainer to the main body; three load applicatio... | 09/10/2002 |
| 6431958 | Method for mechanochemical treatment of a material The invention concerns a method for the mechanochemical treatment of a material characterised in that to improve said material surface properties by mechanochemical anchoring, such as in particular its adhesive capacity during subsequent assembling, or to... | 08/13/2002 |
| 6416617 | Apparatus and method for chemical/mechanical polishing A polishing pad is fixed on a polishing platen mounted to be rotatable. An abrasive supply tube supplies an abrasive onto the polishing pad. A substrate holder is mounted to be rotatable above the polishing pad, holds a substrate to be polished and presse... | 07/09/2002 |
| 6375553 | Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks are described. In one aspect, a polishing chuck includes a body dimensioned to hold... | 04/23/2002 |
| 6364751 | Method for singling semiconductor components and semiconductor component singling device Semiconductor components, which each include at least one semiconductor chip mounted on a common carrier substrate, are singled. The separation is effected by severing of the carrier substrate. The carrier substrate is thereby bent at least in that area o... | 04/02/2002 |
| 6346029 | Bow compensated lapping A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier... | 02/12/2002 |
| 6290579 | Fixed abrasive polishing pad Apparatuses and methods are disclosed using a fixed abrasive polishing pad to perform mechanical polishing of a surface. The apparatus includes a polishing pad positioned opposing a wafer support to provide for polishing of a surface of a wafer placed on ... | 09/18/2001 |
| 6287170 | Multipoint bending apparatus for lapping heads of a data storage device An actuator adapted to adjust the profile of a carrier supporting a bar relative to a lapping surface. The carrier including a plurality of spaced control or actuation points along the length of the carrier for adjusting the profile of the mounting surfac... | 09/11/2001 |
| 6277000 | Polishing chucks, semiconductor wafer polishing chucks, abrading method, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks are described. In one aspect a polishing chuck includes a body dimensioned to hold ... | 08/21/2001 |
| 6193585 | Method of polishing a hard material-coated wafer A method of producing and polishing a hard-material-coated wafer. A hard-material film is disposed on a substrate to form the wafer and provide the wafer with a convex shape. A surface of the substrate is fixed on a holder of a polishing machine having a ... | 02/27/2001 |
| 6186873 | Wafer edge cleaning In a chemical mechanical polishing process for planarization of semiconductor wafers, a pair of opposed grippers are used to move the wafer from one station to another. During this movement, the wafer is rotated and brushes along the periphery are placed ... | 02/13/2001 |
| 6146247 | Method and apparatus for grinding the surface of a work Abrasive grains are produced by gluing an abrasive powder to an elastic porous carrier. A number of abrasive grains are mixed with an abrasive liquid, and are then sprayed to the surface of a work at an oblique angle thereto to impact it while allowing th... | 11/14/2000 |
| 6139403 | Method and device for positioning and accessing a die under analysis A method and device which is provided for thinning flip chip bonded integrated circuit (IC) devices with better accuracy. The method and device permit a successful approach to one portion of the circuit while leaving other portions of the circuit intact. ... | 10/31/2000 |
| 6113468 | Wafer planarization carrier having floating pad load ring A wafer carrier for polishing or planarizing semiconductor workpieces or wafers includes a pressure plate configured to hold a wafer to be polished or to be planarized against a polishing pad, and is further configured to rotate the wafer during the polis... | 09/05/2000 |
| 6086459 | Device for deburring edges on an object In a process for deburring edges on an object, for example the cutting edges (14) of a cutting tool (12), a fluid guided under high pressure through at least one nozzle (26) in the form of at least one fluid jet (28) is directed onto the edges with a spee... | 07/11/2000 |
