Did You Know...
...that Robert Adler has the dubious distinction of being the Father of the Couch Potato? Back in 1955 Adler was employed by what was then Zenith Radio Corp., where he was charged to invent something that would allow viewers to turn down the TV volume without leaving their chairs. After a series of flops (such as a wired contraption that people tripped over), Adler hit on the idea of using sound waves. Thus the Remote Control was born...
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| Number | Title | Issue Date |
| 8167690 | Polishing pad A polishing pad of excellent durability has a polishing layer is arranged on a base material layer, and the polishing layer comprises a thermosetting polyurethane foam having roughly spherical interconnected cells with an average cell diameter of 35 to 300 μm. ... | 05/01/2012 |
| 8012000 | Extended pad life for ECMP and barrier removal A method and apparatus for extending a polishing article lifetime on a polishing tool with multiple platens is described. The apparatus includes an advanceable roll to roll platen with multiple embodiments of a polishing article to be used thereon. The polishing art... | 09/06/2011 |
| 7549914 | Polishing system The disclosed invention is directed to an improved polishing system that can attain improved values in surface topography, and in particular, improved surface planarity of a polished substrate. The system can prevent the formation of deformities at the polishing sur... | 06/23/2009 |
| 7442113 | Visual wear confirmation polishing pad A polishing pad having an upper layer with a first visual characteristic. The upper layer is adapted to erode against a pad conditioner at a uniform rate during a pad conditioning process. At least one lower layer with at least a second visual characteristic is disp... | 10/28/2008 |
| 7435161 | Multi-layer polishing pad material for CMP The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a porous polishing layer and a porous bottom layer, wherein the bottom layer is substantially coextensive with the polishing layer, the polishing layer being joined... | 10/14/2008 |
| 7429210 | Materials for chemical mechanical polishing A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and... | 09/30/2008 |
| 7427340 | Conductive pad A method and apparatus for a processing pad assembly for polishing a substrate is disclosed. The processing pad assembly has a conductive processing pad having a plurality of raised features made of a conductive composite disposed on a conductive carrier. The raised... | 09/23/2008 |
| 7422516 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad s... | 09/09/2008 |
| 7393269 | Abrasive filter assembly and methods of making same An abrasive filter assembly with an integral dust collection system. The abrasive filter assembly comprises a porous element, a first filter media with channels, a second filter media, and an attachment interface layer. The openings of the porous element cooperate w... | 07/01/2008 |
| 7390244 | Abrasive article mounting assembly and methods of making same An abrasive article mounting assembly with an integral dust collection system. The abrasive attachment interface is configured to releasably engage and support an abrasive article, such as, for example, a porous abrasive sheet or disc. ... | 06/24/2008 |
| 7381121 | Base pad polishing pad and multi-layer pad comprising the same Disclosed is a base pad of polishing pad, which is used in conjunction with polishing slurry during a chemical-mechanical polishing or planarizing process, and a multilayer pad using the same. Since the base pad according to the present invention does not have fine ... | 06/03/2008 |
| 7377018 | Method of replacing a subpad of a polishing apparatus A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad support includes a subpad retention element for nonadhesively securing the subpad thereto. The subpad support ... | 05/27/2008 |
| 7374477 | Polishing pads useful for endpoint detection in chemical mechanical polishing A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through ... | 05/20/2008 |
| 7364501 | Sanding block and method of making same A sanding block includes a compressible core having at least one pair of sides characterized such that an abrasive material is adhered to said sides substantially along the surface thereof and having a juncture area defined between said two sides which does not have... | 04/29/2008 |
| 7364497 | Polish pad and chemical mechanical polishing apparatus comprising the same A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical p... | 04/29/2008 |
| 7357703 | Chemical mechanical polishing pad and chemical mechanical polishing method A chemical mechanical polishing pad of the present invention has the following two groups of grooves on the polishing surface: (i) a group of first grooves intersect a single virtual straight line extending from the center toward the periphery of the polishing surfa... | 04/15/2008 |
| 7357702 | Grinding wheel The present invention refers to an improved grinding wheel, comprising an abrasive and/or cutting disk-shaped member that can be associated substantially coaxially with the free end of the rotating shaft of a grinding machine and equipped with at least one substanti... | 04/15/2008 |
| 7354527 | Chemical mechanical polishing pad and chemical mechanical polishing process A chemical mechanical polishing pad which has a storage elastic modulus E′(30° C.) at 30° C. of 120 MPa or less and an (E′(30° C.)/E′(60° C.)) ratio of the storage elastic modulus E′(30° C.) at 30° C. to the storage elastic modulus E′(60° C.) at 60Â... | 04/08/2008 |
| 7344432 | Conductive pad with ion exchange membrane for electrochemical mechanical polishing An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing sur... | 03/18/2008 |
| 7338355 | Abrasive article and methods of making and using the same An abrasive article having an apertured coated abrasive member, filter media, and an attachment interface member is formed by an ultrasonic welding process. The abrasive article is useful for abrading a workpiece. ... | 03/04/2008 |
| 7335239 | Chemical mechanical planarization pad A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarazation characteristics throughout planarization applications. Shearing, hardness, wearing, w... | 02/26/2008 |
| 7335094 | Single-layer polishing pad and method of producing the same A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may... | 02/26/2008 |
| 7331847 | Vibration damping in chemical mechanical polishing system A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retain... | 02/19/2008 |
| 7329175 | Abrasive article and methods of making same A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and a porous attachment interface. The screen abrasive has an abrasive layer comprising a plurality of erectly oriented abrasive particles and at... | 02/12/2008 |
| 7329174 | Method of manufacturing chemical mechanical polishing pad The present invention relates to a method of manufacturing a chemical mechanical polishing pad which provides a chemical mechanical polishing pad which fully suppresses the occurrence of a scratch on the polished surface and has an excellent polishing rate. T... | 02/12/2008 |
| 7329171 | Fixed abrasive article for use in modifying a semiconductor wafer An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive element and the resilient element. ... | 02/12/2008 |
| 7320634 | Sanding tool and dust collection system therefor A hand-held manually-operated sanding tool includes a base having a lower surface including a plurality of attachment posts extending outwardly therefrom and a handle opposite the base lower surface for a user to grasp and maneuver the tool. ... | 01/22/2008 |
| 7316605 | Sheet for mounting polishing workpiece and method for making the same The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interi... | 01/08/2008 |
| 7311592 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adap... | 12/25/2007 |
| 7300340 | CMP pad having overlaid constant area spiral grooves A circular chemical mechanical polishing pad that includes a polishing surface having a concentrically located origin. The polishing surface includes groove sets each containing grooves arranged in a pattern in which ones of the grooves in one groove set cross ones ... | 11/27/2007 |
| 7300338 | CMP diamond conditioning disk A method of making and the resulting non-metallic CMP conditioning pad comprising a non-metallic substrate and a single layer of abrasive particles bonded to the substrate by a non-metallic bonding medium. Preferred substrates include aluminum oxide and graphite. A ... | 11/27/2007 |
| 7300335 | Glass substrate for data recording medium, manufacturing method thereof and polishing pad used in the method A polishing pad is used when a surface of a glass workpiece is polished for manufacturing a glass substrate of information recording medium. The polishing pad has a nap layer. The nap layer includes an inner layer that contains a plurality of closed cells, and an ou... | 11/27/2007 |
| 7297049 | Sanding rope and applications thereof A disposable sanding device is fabricated as a continuous rope-like article which is adapted for selective segmentation and application as a plurality of serially arranged disposable hand sanding devices or ropes. Each hand sanding device is formed as a generally el... | 11/20/2007 |
| 7294048 | Abrasive article An abrasive article includes a substrate having opposed first and second surfaces, a make coat on at least a portion of the first surface, abrasive mineral particles on at least a portion of the make coat to provide an abrasive surface and a size coat arranged over ... | 11/13/2007 |
| 7291063 | Polyurethane urea polishing pad The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least par... | 11/06/2007 |
| 7285146 | Resilient abrasive article A resilient hand-held abrasive article includes a flexible conformable backing layer having opposed first and second major surfaces, a flexible reinforcing layer affixed to at least one of the backing layer first and second major surfaces, and abrasive particles arr... | 10/23/2007 |
| 7285233 | Method of manufacturing polishing pad A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the poly... | 10/23/2007 |
| 7285036 | Pad assembly for electrochemical mechanical polishing Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an ... | 10/23/2007 |
| 7278911 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly th... | 10/09/2007 |
| 7276743 | Retaining ring with conductive portion A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The c... | 10/02/2007 |
