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| Number | Title | Issue Date |
| 7258594 | Method and device for centerless cylindrical grinding During centerless cylindrical grinding, attention must be paid to the fact that the workpiece (3) is placed in a very specific position between the grinding wheel (1), the regulating wheel (2) and the support guide (4). The optimal positi... | 08/21/2007 |
| 7257893 | Efficient wafer processing technology Consistent excess conductive material is provided for plated conductors in integrated circuit metallization, regardless of the size and depth of trenches/vias into which the conductive material is deposited. Accordingly, subsequent processing (e.g., material removal... | 08/21/2007 |
| 7258595 | Polishing apparatus A polishing apparatus comprises a polishing table having a polishing surface and a top ring for holding a substrate to be polished, in which the substrate when held by the top ring is pressed against the polishing surface of the polishing table and thus polished. A ... | 08/21/2007 |
| 7254885 | Wafer-level fabrication method for top or side slider bond pads A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises providing a substrate having a top surface. Trenches are formed in the s... | 08/14/2007 |
| 7255784 | Polishing method and electropolishing apparatus A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform r... | 08/14/2007 |
| 7255632 | Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angul... | 08/14/2007 |
| 7254884 | Method for fabricating a pole tip in a magnetic transducer using feed-forward and feedback Methods for fabricating pole piece tips for a magnetic transducer are disclosed. The ion-milling operations for trimming P2 and notching P1 are controlled using feed-forward and feedback. The preferred method of the invention includes steps for setting... | 08/14/2007 |
| 7255637 | Carrier head vibration damping A carrier head for chemical mechanical polishing that has a base having at least a portion formed of a polymer, a mounting assembly connected to the base having a surface for contacting a substrate, a retainer secured to the portion of the base to prevent the substr... | 08/14/2007 |
| 7255628 | Method and apparatus for producing optical glasses The invention relates to a method and an apparatus for producing optical glasses. The glasses are polished and marked, following a shaping process. The polishing and marking steps are carried out in a common processing cell which comprises a polishing station, a was... | 08/14/2007 |
| 7252575 | Polishing state monitoring apparatus and polishing apparatus and method A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a lig... | 08/07/2007 |
| 7249496 | System for inspecting uniformity of tire An uniformity inspection line 1 comprises a decision-only line 2 having first UF machines 2M exclusive for the measurement of the uniformity of a tire 12 sorted and distributed on an automatic sorting line 21 and a correction-only ... | 07/31/2007 |
| 7249407 | Method of manufacturing magnetic head A method of manufacturing a magnetic head is provided which can improve controlling a thickness of a gap layer. A coil base layer having at least a surface layer formed of one or two or more alloys selected from Au, Ru, and Rh is formed on a contact layer. Thereby, ... | 07/31/2007 |
| 7249992 | Method, apparatus and system for use in processing wafers The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples w... | 07/31/2007 |
| 7246427 | Method to achieve both narrow track width and effective longitudinal stabilization in a CPP GMR read head Biasing schemes used for CIP GMR devices were previously thought to be impractical for CPP devices due to current shunting by the abutted hard magnets. In the present invention the CPP stripe is a narrow conductor directly above the free layer. The resistivity of th... | 07/24/2007 |
| 7247080 | Feedback controlled polishing processes Methods and apparatus for feedback controlled polishing. A computer program product for generating feedback for chemical mechanical polishing. The product includes instructions operable to cause a processor to receive monitoring information during a current polishin... | 07/24/2007 |
| 7246424 | Magnetic devices having magnetic features with CMP stop layers A magnetic device having a magnetic feature, the magnetic feature including a magnetic portion comprising a magnetic material, a region of non-magnetic material adjacent to the magnetic portion, and a stop layer disposed above the region of non-magnetic material, de... | 07/24/2007 |
| 7247081 | Precision machining apparatus and precision machining method A precision machining apparatus and a precision machining method capable of carrying out grinding with accuracy by performing switching control, for example, on a device for rotating a grinding wheel according to grinding stages through the amount of movement and co... | 07/24/2007 |
| 7247083 | Polishing apparatus The polishing apparatus is capable of precisely controlling polishing pressure, correctly positioning a press plate and uniformly polishing a workpiece. In the polishing apparatus, a holding head comprises: first pressing means for introducing a pressurized fluid in... | 07/24/2007 |
| 7245459 | Critically exposed lapping of magnetic sensors for target signal output Magnetic sensors are fabricated with an initial length that is slightly longer than their finished length. The sensors are then critically lapped and exposed for target signal output. The final target length of the sensors is obtained by first exposing the sensors t... | 07/17/2007 |
| 7244169 | In-line contiguous resistive lapping guide for magnetic sensors An in-line lapping guide uses a contiguous resistor in a cavity to separate a lithographically-defined sensor from the in-line lapping guide. As lapping proceeds through the cavity toward the sensor, the resistance across the sensor leads increases to a specific tar... | 07/17/2007 |
| 7244168 | Methods for reducing delamination during chemical mechanical polishing Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a ... | 07/17/2007 |
| 7241203 | Six headed carousel The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, ... | 07/10/2007 |
| 7241201 | CMP pad analyzer An ultrasonic CMP polishing pad analyzer is disclosed. The analyzer provides a manufacturer or other user an ability to inspect a CMP polishing pad without removing the pad from the CMP machine by creating and displaying a topographical image of an in-service polish... | 07/10/2007 |
| 7241205 | Method of processing a substrate A method of processing a substrate is disclosed, wherein a sidewall surface of a notch portion formed in a circumferential portion of a substrate to be processed is polished by using a cylindrical polishing head rotatable with an axis as a rotational center. ... | 07/10/2007 |
| 7243003 | Substrate carrier handler that unloads substrate carriers directly from a moving conveyor In a first aspect, a substrate loading station is served by a conveyor which continuously transports substrate carriers. A substrate carrier handler that is part of the substrate loading station operates to exchange substrate carriers with the conveyor while the con... | 07/10/2007 |
| 7241200 | Control system and method for processing jewelry and the like A control system for controlling processing of workpieces such as jewelry has gantry and gimbal units having x, y, z translational and x, y, z rotational degrees of freedom, the units carrying a gripper for holding a piece of jewelry. Drive motors are associated wit... | 07/10/2007 |
| 7237321 | Method for fabricating a CPP magnetic transducer using CMP-assisted lift-off and a CMP-resistant metal layer A method is described which uses a CMP resistant metal layer to replace the upper dielectric layer in the track width definition phase of a TMR or CPP spin valve magnetic head. The metal which is selected to be resistant to the CMP process can be rhodium (Rh), plati... | 07/03/2007 |
| 7237323 | Method for manufacturing a magnetic head A method of making a magnetic head having an air bearing surface (ABS) composed of a flat and smooth worked surface and having a reduced step produced between a rail portion on the ABS and an element portion. Steps of the method include forming an electromagnetic tr... | 07/03/2007 |
| 7237315 | Method for fabricating a resonator A method for fabricating a quartz nanoresonator which can be integrated on a substrate, along with other electronics is disclosed. In this method a quartz substrate is bonded to a base substrate. The quartz substrate is metallized so that a bias voltage is applied t... | 07/03/2007 |
| 7238082 | Workpiece headstock Workpiece headstock for a machine tool, especially for a grinding machine, with a spindle (6); with a clamping device (7), which is connected to the spindle (6) and which is used to clamp a wor... | 07/03/2007 |
| 7238094 | Belt oscillating apparatus of belt sander A belt oscillating apparatus of a belt sander, wherein the belt sander includes a machine frame, a driving wheel, a driven wheel, a sand belt mounted on the driving wheel and the driven wheel, and the belt oscillating apparatus is mounted on the machine frame, compr... | 07/03/2007 |
| 7238083 | Wafer carrier with pressurized membrane and retaining ring actuator A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. ... | 07/03/2007 |
| 7235001 | Polishing apparatus The polishing apparatus is capable of transferring a work piece to a top ring without moving the work piece from the center and capable of precisely polishing the work piece. The polishing apparatus has a transfer unit for transferring the work piece to the top ring... | 06/26/2007 |
| 7234998 | Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor device Setting a polishing rate and a polishing time in chemical mechanical polishing can be performed with high accuracy by considering a product wafer of an object to be polished, and an instrumental error between apparatuses to be used, etc. By using, as a calculating f... | 06/26/2007 |
| 7234999 | Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with highe... | 06/26/2007 |
| 7234997 | Device for grinding of clothing in a textile machine A grinding device for the flats of a card comprises elastically bendable elements which enter between the clothing points, brush over the side flanks of the points and thereby grind the points. Additional grinding elements are provided in order to treat the front si... | 06/26/2007 |
| 7232361 | Rock saw The present invention discloses an automated rock saw having a saw motor load sensor to control the speed of the conveyor bringing the rock to the saw blade. As the saw motor works harder to cut a given rock, the controller automatically slows the conveyor belts, re... | 06/19/2007 |
| 7232760 | Method for producing semiconductor device, polishing apparatus, and polishing method A method for producing a semiconductor device, polishing method, and polishing apparatus, suppressing occurrence of dishing and erosion in a flattening process by polishing of a metal film for constituting an interconnection of a semiconductor device having a multil... | 06/19/2007 |
| 7232514 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic ... | 06/19/2007 |
| 7229336 | Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the pla... | 06/12/2007 |
