Did You Know...
...that after Parker Brothers executives turned down the game of Monopoly because it had "52 fundamental errors" (including taking too long to play), a copy of the game wound up in the home of the company president who stayed up until 1 a.m. to finish playing it? He was so impressed by the game that the next day he wrote to inventor Charles Darrow and offered to buy it!
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| Number | Title | Issue Date |
| 7381116 | Polishing media stabilizer A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support... | 06/03/2008 |
| 7320634 | Sanding tool and dust collection system therefor A hand-held manually-operated sanding tool includes a base having a lower surface including a plurality of attachment posts extending outwardly therefrom and a handle opposite the base lower surface for a user to grasp and maneuver the tool. ... | 01/22/2008 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7264542 | Knife sharpening method and system A method and system are disclosed. The system may include a device for sharpening a convex edge on the blade of a knife. The device may include a resilient material and a plurality of abrasive sheets of varying grit values. Each abrasive sheet may be removably attac... | 09/04/2007 |
| 7223165 | Abrasive pad for a manual grinding machine An abrasive pad for a manual grinding machine, in particular for an eccentric grinder, has a flat contact surface (13) on which an abrasive sheet is placed, and attachment means located on the contact surface (13) for creating an adhesive connection wi... | 05/29/2007 |
| 7175504 | Vacuum suction holding apparatus and holding method, polishing apparatus using this holding apparatus, and device manufacturing method using this polishing apparatus The vacuum suction holding apparatus of the present invention has a vacuum duct which is disposed inside a polishing head, with one end of this vacuum duct being opened in the attachment surface and the other end thereof being connected to a vacuum source. A polishi... | 02/13/2007 |
| 7156722 | Platen structure of polishing apparatus for processing semiconductor wafer and method for exchanging polishing pad affixed to the same A platen structure of a polishing apparatus for semiconductor wafer and a method for exchanging a polishing pad affixed to the same are provided in which the polishing pad supported by the platen is exchanged with convenience within a short time. The platen structur... | 01/02/2007 |
| 7147543 | Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, the carrier assembly includes a head having a chamber, a magneti... | 12/12/2006 |
| 7125477 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 10/24/2006 |
| 7121934 | Carrier head for chemical mechanical polishing apparatus Disclosed is a carrier head of a chemical mechanical polishing apparatus for planarizing a semiconductor wafer. An adjustment chamber is provided in a space section formed between a membrane lower holder and a membrane upper holder of a wafer support assembly. Press... | 10/17/2006 |
| 7112124 | Rotary blade sharpener A rotary blade sharpener is comprised of a motorized platen positioned in a housing with a surrounding wall and an open top. An abrasive sheet with an adhesive bottom surface is adhered to a disc, which is tightened to the platen by a knob. The disc is color coded t... | 09/26/2006 |
| 7094140 | Abrasive sanding surface An abrasive sandpaper system having a backing plate (16) with a canted outer periphery (28) and an off-centered aperture (26) for interlocking with lugs (18) of a power driver (12). The sandpaper (30) has a canted outer peri... | 08/22/2006 |
| 7077721 | Pad assembly for electrochemical mechanical processing Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A... | 07/18/2006 |
| 7077733 | Subpad support with a releasable subpad securing element and polishing apparatus including the subpad support A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad support includes a subpad retention element for non-adhesively securing the subpad thereto. The subpad support... | 07/18/2006 |
| 7059948 | Articles for polishing semiconductor substrates Methods, articles of manufacture, and apparatus are provided for depositing a layer, planarizing a layer, or combinations thereof, a material layer on a substrate. In one embodiment, an article of manufacture is provided for polishing a substrate, comprising a polis... | 06/13/2006 |
| 7040973 | Abrasive sheet An abrasive sheet is made from an abrasive media mounted to a polymeric foam support member forming a one-piece abrasive sheet that is easily cut into any desirable configuration. The abrasive sheet is easily mounted to a holder adaptable to hand-held manual or powe... | 05/09/2006 |
| 7040964 | Polishing media stabilizer A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support... | 05/09/2006 |
| 7029365 | Pad assembly for electrochemical mechanical processing Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an ... | 04/18/2006 |
| 7001251 | Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen that are co... | 02/21/2006 |
| 6979248 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coat... | 12/27/2005 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupl... | 11/08/2005 |
| 6958001 | Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, the carrier assembly includes a head having a chamber, a magneti... | 10/25/2005 |
| 6951297 | Sandpaper dispenser A sandpaper dispenser (100) is provided. The sandpaper dispenser includes a frame (102) adapted to be coupled to a sanding device (106) and a sandpaper dispensing assembly 144 coupled to the frame. A sanding pad (105 or 110)... | 10/04/2005 |
| 6857950 | Polishing apparatus, semiconductor device manufacturing method using the polishing apparatus, and semiconductor device manufactured by the manufacturing method The present invention provides a polishing apparatus with a construction which makes it possible to prevent the peripheral portions of a substrate from sloping downward as a result of the polishing member tilting at the peripheral portions of the substrate during th... | 02/22/2005 |
| 6722949 | Ventilated platen/polishing pad assembly for chemcial mechanical polishing and method of using A ventilated platen/polishing pad assembly for chemical mechanical polishing copper conductors on a semiconductor wafer is disclosed. The ventilated platen is constructed by a platen having a multiplicity of apertures through a thickness of the platen, and a polishi... | 04/20/2004 |
| 6663470 | Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen ... | 12/16/2003 |
| 6514125 | Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen ... | 02/04/2003 |
| 6506101 | Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen ... | 01/14/2003 |
| 6491570 | Polishing media stabilizer A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and ... | 12/10/2002 |
| 6394887 | Apparatus for use with automated abrading equipment An adapter for use with automated abrading equipment. The adapter includes a first surface for the releasable mounting of abrasive articles, such as those mounted with releasable adhesive, and a second surface for releasable mounting to automated equipmen... | 05/28/2002 |
| 6361424 | Back-up pad for abrasive articles and method of making A back-up pad for pad for supporting an abrasive article. A preferred embodiment of the invention provides a back-up pad having a dust collection groove, in which the engagement component for securing the abrasive article is attached to the dust collectio... | 03/26/2002 |
| 6302775 | Apparatus and method for cold cross-sectioning of soft materials Apparatus and a method of cold cross-sectioning soft materials includes providing a chuck attached to a drive motor with a composite plate attached to the chuck and including a heat insulating portion, a heat conducting layer, and a central axially extend... | 10/16/2001 |
| 6261958 | Method for performing chemical-mechanical polishing An apparatus and method for performing chemical-mechanical polishing is disclosed in which the pad is secured to the platen without the use of adhesives. A polishing pad and a platen are secured together by a releasable attractive force; the force may com... | 07/17/2001 |
| 6244941 | Method and apparatus for pad removal and replacement A method and apparatus for facilitating the removal and replacement of polishing pads utilized in the process of polishing and planarizing workpieces such as semiconductors where the polishing machine employed includes a rotatable platen. The apparatus fo... | 06/12/2001 |
| 6224474 | Magnetic disc system for grinding or polishing specimens A magnetic disc system for grinding or polishing metallographic test specimens on a movable platen includes a barrier that is magnetically attached to a movable platen. A grinding or polishing surface attaches to the barrier. The barrier magnetically atta... | 05/01/2001 |
| 6217425 | Apparatus and method for lapping magnetic heads An apparatus for lapping a workpiece including a plurality of magnetic heads supported by a tool is disclosed. The lapping apparatus comprises a rotary lapping table, a lapping head attachment frame, an adjuster ring resiliently supported by the frame, a ... | 04/17/2001 |
| 6120349 | Polishing system A polishing system includes a polishing pad for polishing a surface of a layer provided on a substrate, a surface condition measuring device for detecting a condition of a polishing surface of the polishing pad and a controller for controlling a process t... | 09/19/2000 |
| 6116998 | Attachment means and use of such means for attaching a sheet-formed abrasive or polishing means to a magnetized support An attachment means for attaching a sheet-formed abrasive and/or polishing means to a magnetized support, said attachment means comprising a ferromagnetic base layer and an external adhesive layer to which the abrasive and/or polishing means attached, and... | 09/12/2000 |
| 6089963 | Attachment system for lens surfacing pad An attachment system for a lens surfacing and polishing pad adapted for use with a lapping tool is described. The lapping tool includes a curved surface having a metallic surface disposed on at least a portion thereof. The pad has a configuration conformi... | 07/18/2000 |
| 6083083 | Separation type grinding surface plate and grinding apparatus using same A separation type grinding or polishing (hereinafter "grinding") surface plate (11) comprises a surface plate body (12) connected to a drive of a grinding apparatus directly or through a water cooled jacket or the like, and a disk (13) for grinding which ... | 07/04/2000 |
